JPS6233748B2 - - Google Patents

Info

Publication number
JPS6233748B2
JPS6233748B2 JP58089103A JP8910383A JPS6233748B2 JP S6233748 B2 JPS6233748 B2 JP S6233748B2 JP 58089103 A JP58089103 A JP 58089103A JP 8910383 A JP8910383 A JP 8910383A JP S6233748 B2 JPS6233748 B2 JP S6233748B2
Authority
JP
Japan
Prior art keywords
mold
resin
lead frame
space
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58089103A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5910251A (ja
Inventor
Kunihiro Tsubosaki
Kunihiko Nishi
Keizo Ootsuki
Takeshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58089103A priority Critical patent/JPS5910251A/ja
Publication of JPS5910251A publication Critical patent/JPS5910251A/ja
Publication of JPS6233748B2 publication Critical patent/JPS6233748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H10W74/016—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58089103A 1983-05-23 1983-05-23 リ−ドフレ−ム Granted JPS5910251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58089103A JPS5910251A (ja) 1983-05-23 1983-05-23 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58089103A JPS5910251A (ja) 1983-05-23 1983-05-23 リ−ドフレ−ム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9028675A Division JPS59969B2 (ja) 1975-07-25 1975-07-25 半導体装置の封止方法

Publications (2)

Publication Number Publication Date
JPS5910251A JPS5910251A (ja) 1984-01-19
JPS6233748B2 true JPS6233748B2 (index.php) 1987-07-22

Family

ID=13961547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58089103A Granted JPS5910251A (ja) 1983-05-23 1983-05-23 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5910251A (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135765A (ja) * 1988-11-16 1990-05-24 Matsushita Electron Corp 半導体装置用リードフレーム
US5275546A (en) * 1991-12-30 1994-01-04 Fierkens Richard H J Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor
JP6539942B2 (ja) * 2014-01-09 2019-07-10 株式会社カネカ 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643854B2 (index.php) * 1973-07-17 1981-10-15

Also Published As

Publication number Publication date
JPS5910251A (ja) 1984-01-19

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