JPS6233317Y2 - - Google Patents
Info
- Publication number
- JPS6233317Y2 JPS6233317Y2 JP1982121233U JP12123382U JPS6233317Y2 JP S6233317 Y2 JPS6233317 Y2 JP S6233317Y2 JP 1982121233 U JP1982121233 U JP 1982121233U JP 12123382 U JP12123382 U JP 12123382U JP S6233317 Y2 JPS6233317 Y2 JP S6233317Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- molding
- plunger
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 62
- 239000011347 resin Substances 0.000 claims description 62
- 239000012778 molding material Substances 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12123382U JPS5926244U (ja) | 1982-08-09 | 1982-08-09 | 半導体樹脂封入成形用の成形装置 |
GB8321044A GB2127736B (en) | 1982-08-09 | 1983-08-04 | Molding apparatus |
DE19833328408 DE3328408C2 (de) | 1982-08-09 | 1983-08-05 | Formpreßeinrichtung zum dichten Einbetten von Halbleiter-Chips durch Umspritzen mit einer Preßmasse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12123382U JPS5926244U (ja) | 1982-08-09 | 1982-08-09 | 半導体樹脂封入成形用の成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5926244U JPS5926244U (ja) | 1984-02-18 |
JPS6233317Y2 true JPS6233317Y2 (zh) | 1987-08-26 |
Family
ID=14806202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12123382U Granted JPS5926244U (ja) | 1982-08-09 | 1982-08-09 | 半導体樹脂封入成形用の成形装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5926244U (zh) |
DE (1) | DE3328408C2 (zh) |
GB (1) | GB2127736B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60131212A (ja) * | 1983-12-20 | 1985-07-12 | Yamada Seisakusho:Kk | トランスフア成形用金型 |
US4575328A (en) * | 1984-03-06 | 1986-03-11 | Asm Fico Tooling, B.V. | Automatic continuously cycleable molding apparatus |
DE3811813C2 (de) * | 1988-04-08 | 1993-11-04 | Siemens Ag | Spritz-form-vorrichtung |
DE3811814C2 (de) * | 1988-04-08 | 1994-08-25 | Siemens Ag | Spritz-Form-Vorrichtung für quarzgefülltes Kunststoff-Material |
GB8828334D0 (en) * | 1988-12-05 | 1989-01-05 | Goh B H | Gang-pot mould |
DE8913972U1 (de) * | 1989-11-27 | 1991-03-28 | Remaplan Anlagenbau GmbH, 8000 München | Vorrichtung zum Spritzpressen von Kunststoffteilen aus einer Kunststoffschmelze |
JP2846773B2 (ja) * | 1992-09-01 | 1999-01-13 | 三菱電機株式会社 | 半導体装置の樹脂封止装置及び樹脂封止方法 |
US6007316A (en) * | 1993-07-22 | 1999-12-28 | Towa Corporation | Apparatus for molding resin to seal electronic parts |
TW257745B (zh) * | 1993-07-22 | 1995-09-21 | Towa Kk | |
CN110640981A (zh) * | 2019-10-31 | 2020-01-03 | 东莞市嘉宏机电科技有限公司 | 一种组合脚垫注塑模具的自动出料装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50109255A (zh) * | 1974-02-06 | 1975-08-28 | ||
JPS5538088A (en) * | 1978-09-11 | 1980-03-17 | Nec Kyushu Ltd | Resin sealing device |
JPS5539665A (en) * | 1978-09-14 | 1980-03-19 | Toa Seimitsu Kogyo Kk | Die device for charge and formation of semiconductor element |
JPS5544766A (en) * | 1978-09-25 | 1980-03-29 | Nec Kyushu Ltd | Resin enclosing device |
JPS5546537A (en) * | 1978-09-28 | 1980-04-01 | Toa Seimitsu Kogyo Kk | Metal mold for shaping semiconductor device in enclosed state |
JPS575339A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding method and molding die |
JPS575338A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding die |
JPS5878433A (ja) * | 1981-11-04 | 1983-05-12 | Mitsubishi Electric Corp | 半導体装置の樹脂封止成形装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH387287A (de) * | 1961-02-28 | 1965-01-31 | Drabert Soehne | Verfahren und Vorrichtung zum automatischen Spritzpressen härtbarer Formmassen |
DE1943210A1 (de) * | 1969-08-25 | 1971-03-11 | Siemens Ag | Spritzpresswerkzeug zum Umhuellen von elektrischen Bauelementen |
-
1982
- 1982-08-09 JP JP12123382U patent/JPS5926244U/ja active Granted
-
1983
- 1983-08-04 GB GB8321044A patent/GB2127736B/en not_active Expired
- 1983-08-05 DE DE19833328408 patent/DE3328408C2/de not_active Expired
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50109255A (zh) * | 1974-02-06 | 1975-08-28 | ||
JPS5538088A (en) * | 1978-09-11 | 1980-03-17 | Nec Kyushu Ltd | Resin sealing device |
JPS5539665A (en) * | 1978-09-14 | 1980-03-19 | Toa Seimitsu Kogyo Kk | Die device for charge and formation of semiconductor element |
JPS5544766A (en) * | 1978-09-25 | 1980-03-29 | Nec Kyushu Ltd | Resin enclosing device |
JPS5546537A (en) * | 1978-09-28 | 1980-04-01 | Toa Seimitsu Kogyo Kk | Metal mold for shaping semiconductor device in enclosed state |
JPS575339A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding method and molding die |
JPS575338A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding die |
JPS5878433A (ja) * | 1981-11-04 | 1983-05-12 | Mitsubishi Electric Corp | 半導体装置の樹脂封止成形装置 |
Also Published As
Publication number | Publication date |
---|---|
DE3328408C2 (de) | 1985-05-02 |
DE3328408A1 (de) | 1984-03-15 |
GB2127736A (en) | 1984-04-18 |
JPS5926244U (ja) | 1984-02-18 |
GB2127736B (en) | 1986-02-26 |
GB8321044D0 (en) | 1983-09-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4599062A (en) | Encapsulation molding apparatus | |
JPS5850582B2 (ja) | 半導体封入成形方法とその金型装置 | |
JPS6233317Y2 (zh) | ||
US20130140737A1 (en) | Stacked substrate molding | |
JPS5611236A (en) | Method and metallic mold for plastic molding | |
US4388265A (en) | Process and apparatus for molding plastics | |
CN208020655U (zh) | 带凹槽塑件的侧向抽芯注塑模具 | |
JP3100843B2 (ja) | 半導体パッケージ成形用モルドプレス | |
KR102078722B1 (ko) | 반도체 패키지 제조 장치 | |
JPH0340579Y2 (zh) | ||
JPH0257006B2 (zh) | ||
CN215969846U (zh) | 一种塑料件生产用新型注塑模具 | |
JP2996427B2 (ja) | 電子部品モールド金型 | |
JPH0122732B2 (zh) | ||
JPS635227Y2 (zh) | ||
CN217597652U (zh) | 一种挤胶模的加料装置 | |
JPS6382716A (ja) | トランスフア−成形型の金型装置 | |
JPS6154633A (ja) | 半導体樹脂封止用金型 | |
JPS6366051B2 (zh) | ||
JP2683204B2 (ja) | 樹脂パッケージング方法及びその装置 | |
JPS6382717A (ja) | トランスファー成形型の金型装置 | |
JPS6334271Y2 (zh) | ||
JPH0642336Y2 (ja) | 半導体素子の樹脂封止装置 | |
JPH0440276Y2 (zh) | ||
JPH0716879A (ja) | 電子部品モールド金型 |