JPS6334271Y2 - - Google Patents
Info
- Publication number
- JPS6334271Y2 JPS6334271Y2 JP1983131688U JP13168883U JPS6334271Y2 JP S6334271 Y2 JPS6334271 Y2 JP S6334271Y2 JP 1983131688 U JP1983131688 U JP 1983131688U JP 13168883 U JP13168883 U JP 13168883U JP S6334271 Y2 JPS6334271 Y2 JP S6334271Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- resin
- resin material
- molding machine
- elastic pushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 63
- 238000000465 moulding Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13168883U JPS6039243U (ja) | 1983-08-24 | 1983-08-24 | 半導体素子の樹脂封入成形機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13168883U JPS6039243U (ja) | 1983-08-24 | 1983-08-24 | 半導体素子の樹脂封入成形機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6039243U JPS6039243U (ja) | 1985-03-19 |
| JPS6334271Y2 true JPS6334271Y2 (zh) | 1988-09-12 |
Family
ID=30297636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13168883U Granted JPS6039243U (ja) | 1983-08-24 | 1983-08-24 | 半導体素子の樹脂封入成形機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039243U (zh) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2883704A (en) * | 1953-05-28 | 1959-04-28 | Us Rubber Co | Transfer molding apparatus |
| JPS5821343A (ja) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | 樹脂封止装置 |
| JPS5839889U (ja) * | 1981-09-10 | 1983-03-16 | 株式会社パイロット | 万年筆 |
| JPS5897838A (ja) * | 1981-12-08 | 1983-06-10 | Toshiba Corp | 半導体用樹脂封止装置 |
| JPS5943525A (ja) * | 1982-09-03 | 1984-03-10 | Kyowa Denki Kagaku Kk | 電子部品の絶縁包装部の形成方法および装置 |
-
1983
- 1983-08-24 JP JP13168883U patent/JPS6039243U/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2883704A (en) * | 1953-05-28 | 1959-04-28 | Us Rubber Co | Transfer molding apparatus |
| JPS5821343A (ja) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | 樹脂封止装置 |
| JPS5839889U (ja) * | 1981-09-10 | 1983-03-16 | 株式会社パイロット | 万年筆 |
| JPS5897838A (ja) * | 1981-12-08 | 1983-06-10 | Toshiba Corp | 半導体用樹脂封止装置 |
| JPS5943525A (ja) * | 1982-09-03 | 1984-03-10 | Kyowa Denki Kagaku Kk | 電子部品の絶縁包装部の形成方法および装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6039243U (ja) | 1985-03-19 |
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