JPS6232551U - - Google Patents

Info

Publication number
JPS6232551U
JPS6232551U JP1985124205U JP12420585U JPS6232551U JP S6232551 U JPS6232551 U JP S6232551U JP 1985124205 U JP1985124205 U JP 1985124205U JP 12420585 U JP12420585 U JP 12420585U JP S6232551 U JPS6232551 U JP S6232551U
Authority
JP
Japan
Prior art keywords
semiconductor device
integrated circuit
pattern
circuit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985124205U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985124205U priority Critical patent/JPS6232551U/ja
Publication of JPS6232551U publication Critical patent/JPS6232551U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の一実施例であるフレキシブ
ル回路基板の平面図、第２図は第１図に示した基
板に半田バンプ付集積回路をフリツプチツプボン
デイングするための機械の模式図である。第３図
は本考案による集積回路実装後の断面図である。 １……フレキシブル基板、２……リード（回路
パターン）、３……パツド、４……はり出しリー
ド、５……穴、６……ヒータチツプ、７……バキ
ユームパイプ、８……集積回路、９……半田バン
プ、１０……フレキシブル基板、１１……パター
ン（リード）、１２……プリズム、１３……基板
押し台、１４……カメラ、１５……封止樹脂。 Figure 1 is a plan view of a flexible circuit board that is an embodiment of the present invention, and Figure 2 is a schematic diagram of a machine for flip-chip bonding an integrated circuit with solder bumps to the board shown in Figure 1. be. FIG. 3 is a sectional view after mounting an integrated circuit according to the present invention. 1... Flexible board, 2... Lead (circuit pattern), 3... Pad, 4... Protruding lead, 5... Hole, 6... Heater chip, 7... Vacuum pipe, 8... Integrated circuit, 9... ...Solder bump, 10...Flexible board, 11...Pattern (lead), 12...Prism, 13...Substrate pusher, 14...Camera, 15...Sealing resin.

Claims (1)

【実用新案登録請求の範囲】 (1) ポリイミド等のフレキシブルの基板上に回
路パターンを形成してあり、その回路パターンの
一部に、半田バンプ付集積回路をフリツプチツプ
ボンデイングしてなる半導体装置において、回路
基板の集積回路実装部の複数のボンデイングパツ
ドより内側にあけた穴から、複数本の基板位置検
出用のパターンがはり出している事を特徴とする
半導体装置。 (2) はり出しているパターンは、その幅が、０
．１mmから０．２mmの間で幅と長さの比が、１：
５以内である事を特徴とする第１項記載の半導体
装置。 (3) 前記の穴は、集積回路実装部のモールド用
の穴を兼ねている事を特徴とする第１項記載の半
導体装置。[Claims for Utility Model Registration] (1) A semiconductor device in which a circuit pattern is formed on a flexible substrate such as polyimide, and an integrated circuit with solder bumps is flip-chip bonded to a part of the circuit pattern. A semiconductor device characterized in that a plurality of patterns for detecting the position of a circuit board protrude from holes formed inside a plurality of bonding pads of an integrated circuit mounting portion of the circuit board. (2) The width of the protruding pattern is 0.
．． Between 1mm and 0.2mm, the width to length ratio is 1:
2. The semiconductor device according to claim 1, wherein the semiconductor device is within 5. (3) The semiconductor device according to item 1, wherein the hole also serves as a hole for molding an integrated circuit mounting portion.
JP1985124205U 1985-08-13 1985-08-13 Pending JPS6232551U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985124205U JPS6232551U (en) 1985-08-13 1985-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985124205U JPS6232551U (en) 1985-08-13 1985-08-13

Publications (1)

Publication Number Publication Date
JPS6232551U true JPS6232551U (en) 1987-02-26

Family

ID=31016004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985124205U Pending JPS6232551U (en) 1985-08-13 1985-08-13

Country Status (1)

Country Link
JP (1) JPS6232551U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02261489A (en) * 1989-03-31 1990-10-24 Nakanihon Juki Kk Method and apparatus for sewing tubular cloth edge by sewing machine
JPH02142569U (en) * 1989-05-01 1990-12-04
JPH0313973U (en) * 1989-06-27 1991-02-13

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02261489A (en) * 1989-03-31 1990-10-24 Nakanihon Juki Kk Method and apparatus for sewing tubular cloth edge by sewing machine
JPH02142569U (en) * 1989-05-01 1990-12-04
JPH0313973U (en) * 1989-06-27 1991-02-13

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