JPH0476048U - - Google Patents
Info
- Publication number
- JPH0476048U JPH0476048U JP11884990U JP11884990U JPH0476048U JP H0476048 U JPH0476048 U JP H0476048U JP 11884990 U JP11884990 U JP 11884990U JP 11884990 U JP11884990 U JP 11884990U JP H0476048 U JPH0476048 U JP H0476048U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- signal
- laminated board
- laminated substrate
- signal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体装置を示す斜視図
、第２図は本考案に係る半導体装置の要部を拡大
して示す断面図である。第３図ａ，ｂは本考案に
係る半導体装置をマザーボードに搭載した状態を
示す図で、同図ａは平面図、同図ｂは縦断面図で
ある。第４図ａ，ｂは従来のＰＧＡ型の半導体装
置を示す図で、同図ａは平面図、同図ｂは正面図
を示す。第５図はＤＩＰ型半導体装置を示す斜視
図、第６図はＳＯＰ型半導体装置を示す斜視図、
第７図は従来の半導体装置をプリント配線基板に
実装した状態を示す斜視図である。
１１……半導体装置、１２……信号配線積層基
板、１３……放熱積層基板、１４……ＬＳＩチツ
プ、１５……信号ライン配線パターン、１６……
貫通穴、１７……信号端子、２０……マザーボー
ド。
FIG. 1 is a perspective view showing a semiconductor device according to the present invention, and FIG. 2 is a sectional view showing an enlarged main part of the semiconductor device according to the present invention. Figures 3a and 3b are views showing the semiconductor device according to the present invention mounted on a motherboard, where figure a is a plan view and figure b is a longitudinal sectional view. FIGS. 4a and 4b are diagrams showing a conventional PGA type semiconductor device, with FIG. 4a showing a plan view and FIG. 4b showing a front view. FIG. 5 is a perspective view showing a DIP type semiconductor device, FIG. 6 is a perspective view showing an SOP type semiconductor device,
FIG. 7 is a perspective view showing a conventional semiconductor device mounted on a printed wiring board. DESCRIPTION OF SYMBOLS 11... Semiconductor device, 12... Signal wiring laminated board, 13... Heat dissipation laminated board, 14... LSI chip, 15... Signal line wiring pattern, 16...
Through hole, 17...signal terminal, 20...motherboard.
Claims (1)
てマザーボードに搭載される放熱用積層基板と、
前記信号端子に接続される配線パターンが設けら
れかつ半導体チツプが挿入される貫通穴が複数穿
設され、前記放熱用積層基板上に接合される信号
配線積層基板とを備え、テープキヤリアボンデイ
ングによつてリードが設けられた半導体チツプを
、リードを前記信号配線積層基板の配線パターン
に接続させて前記貫通穴に臨ませ、この半導体チ
ツプの底面を前記放熱用積層基板に接合したこと
を特徴とする半導体装置。 a heat dissipation laminated board formed of a heat transfer material, provided with signal terminals and mounted on a motherboard;
A signal wiring laminated substrate is provided with a wiring pattern connected to the signal terminal, a plurality of through holes are drilled into which semiconductor chips are inserted, and a signal wiring laminated substrate is bonded onto the heat dissipation laminated substrate, and is formed by tape carrier bonding. A semiconductor chip provided with leads is connected to the wiring pattern of the signal wiring laminated board so as to face the through hole, and the bottom surface of the semiconductor chip is bonded to the heat dissipation laminated board. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884990U JP2508660Y2 (en) | 1990-11-15 | 1990-11-15 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884990U JP2508660Y2 (en) | 1990-11-15 | 1990-11-15 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476048U true JPH0476048U (en) | 1992-07-02 |
| JP2508660Y2 JP2508660Y2 (en) | 1996-08-28 |
Family
ID=31866817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11884990U Expired - Lifetime JP2508660Y2 (en) | 1990-11-15 | 1990-11-15 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508660Y2 (en) |
-
1990
- 1990-11-15 JP JP11884990U patent/JP2508660Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2508660Y2 (en) | 1996-08-28 |
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