JPH0341934U - - Google Patents
Info
- Publication number
- JPH0341934U JPH0341934U JP10331989U JP10331989U JPH0341934U JP H0341934 U JPH0341934 U JP H0341934U JP 10331989 U JP10331989 U JP 10331989U JP 10331989 U JP10331989 U JP 10331989U JP H0341934 U JPH0341934 U JP H0341934U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- flexible substrate
- curved portion
- bonding pads
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案実施例の構造を示す図である。
第２図は本考案実施例の平面図、第３図は、第１
図のＡ−Ａ断面図である。第４図は、本考案実施
例の製造手順を説明する図である。第５図は、従
来のフレキシブル基板の構造例を示す図である。
１……絶縁性フイルム、１ａ……孔、２……配
線回路、３……ボンデイングパツド、４……カバ
ーレイ。
FIG. 1 is a diagram showing the structure of an embodiment of the present invention.
Fig. 2 is a plan view of the embodiment of the present invention, and Fig. 3 is a plan view of the embodiment of the present invention.
It is an AA sectional view of the figure. FIG. 4 is a diagram illustrating the manufacturing procedure of the embodiment of the present invention. FIG. 5 is a diagram showing an example of the structure of a conventional flexible substrate. DESCRIPTION OF SYMBOLS 1... Insulating film, 1a... Hole, 2... Wiring circuit, 3... Bonding pad, 4... Coverlay.
Claims (1)
デイングするフレキシブル基板であつて、絶縁性
フイルムの表面上にボンデイングパツドおよび配
線回路が形成され、かつ、上記絶縁性フイルムに
穿たれた孔により、上記ボンデイングパツド部の
みが、その形成面の反対面側に露呈していること
を特徴とする、フレキシブル基板。 A flexible substrate for face-down bonding of chips such as ICs and LSIs, in which bonding pads and wiring circuits are formed on the surface of an insulating film, and holes drilled in the insulating film allow the bonding pads to be bonded to the surface of the insulating film. 1. A flexible substrate characterized in that only the curved portion is exposed on the side opposite to the surface on which the curved portion is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10331989U JPH0341934U (en) | 1989-09-01 | 1989-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10331989U JPH0341934U (en) | 1989-09-01 | 1989-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341934U true JPH0341934U (en) | 1991-04-22 |
Family
ID=31652165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10331989U Pending JPH0341934U (en) | 1989-09-01 | 1989-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022168478A1 (en) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | Module |
-
1989
- 1989-09-01 JP JP10331989U patent/JPH0341934U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022168478A1 (en) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | Module |
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