JPH0230069U - - Google Patents
Info
- Publication number
- JPH0230069U JPH0230069U JP10770288U JP10770288U JPH0230069U JP H0230069 U JPH0230069 U JP H0230069U JP 10770288 U JP10770288 U JP 10770288U JP 10770288 U JP10770288 U JP 10770288U JP H0230069 U JPH0230069 U JP H0230069U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- testing
- convex
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図ａは、本考案の一実施例の平面図、第１
図ｂは第１図ａの断面図、第２図は本考案の他の
実施例の断面図である。
１……プリント基板本体、２……配線パターン
、３……基板面凸部、４……実装穴、５……溝。
Figure 1a is a plan view of one embodiment of the present invention;
Figure b is a sectional view of Figure 1a, and Figure 2 is a sectional view of another embodiment of the present invention. 1...Printed circuit board body, 2...Wiring pattern, 3...Protrusion on board surface, 4...Mounting hole, 5...Groove.
Claims (1)
ス印加試験用プリント基板において、基板面の配
線パターン間に凸または凹部を設けたことを特徴
とする半導体装置試験用プリント基板。 1. A printed circuit board for semiconductor device testing, characterized in that a printed circuit board for bias application testing used in reliability testing of semiconductor integrated circuits and the like is provided with convex or concave portions between wiring patterns on the substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770288U JPH0230069U (en) | 1988-08-15 | 1988-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770288U JPH0230069U (en) | 1988-08-15 | 1988-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0230069U true JPH0230069U (en) | 1990-02-26 |
Family
ID=31342354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10770288U Pending JPH0230069U (en) | 1988-08-15 | 1988-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230069U (en) |
-
1988
- 1988-08-15 JP JP10770288U patent/JPH0230069U/ja active Pending