JPS63201351U - - Google Patents
Info
- Publication number
- JPS63201351U JPS63201351U JP1987093069U JP9306987U JPS63201351U JP S63201351 U JPS63201351 U JP S63201351U JP 1987093069 U JP1987093069 U JP 1987093069U JP 9306987 U JP9306987 U JP 9306987U JP S63201351 U JPS63201351 U JP S63201351U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- leads
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、この考案の一実施例に係るモジユー
ルの縦断面図、第２図は、同モジユールの平面図
、第３図は、従来のモジユールの縦断面図である
。
２……アルミ放熱板、２ｂ…チツプ収納部、２
ｃ……ＰＣＢ装着部、３……プリント回路基板、
５……ＴＡＢ形ＩＣ、６……チツプ、７……リー
ド、８……フイルム。
FIG. 1 is a longitudinal sectional view of a module according to an embodiment of this invention, FIG. 2 is a plan view of the same module, and FIG. 3 is a longitudinal sectional view of a conventional module. 2... Aluminum heat sink, 2b... Chip storage section, 2
c...PCB mounting part, 3...Printed circuit board,
5...TAB type IC, 6...chip, 7...lead, 8...film.
Claims (1)
るリードとをフイルムに保持してなるＴＡＢ形半
導体装置と、このＴＡＢ形半導体装置が装着され
るプリント回路基板とを備えてなる電子回路装置
において、 前記プリント回路基板は、金属放熱板に、これ
らの表面同士が揃うよう装着され、この金属放熱
板表面には、前記プリント回路基板と隣接して、
前記チツプを収納するチツプ収納部を凹設し、前
記チツプの底面は、このチツプ収納部内面に接着
され、前記フイルムは、金属放熱板表面に支持さ
れると共に、前記リードを前記プリント回路基板
上に突出させて、このリードを前記プリント回路
基板表面の導体パターンに電気的に接続してなる
ことを特徴とする電子回路装置。 (2) 前記ＴＡＢ形半導体装置のリードは、フイ
ルムの一辺より集中して引き出される実用新案登
録請求の範囲第１項記載の電子回路装置。[Claims for Utility Model Registration] (1) A TAB type semiconductor device comprising a chip and leads electrically connected to the chip held in a film, and a printed circuit board on which this TAB type semiconductor device is mounted. In the electronic circuit device, the printed circuit board is attached to a metal heat sink so that their surfaces are aligned with each other, and on the surface of the metal heat sink, adjacent to the printed circuit board,
A chip accommodating portion for accommodating the chip is provided in a recessed manner, the bottom surface of the chip is adhered to the inner surface of the chip accommodating portion, the film is supported on the surface of a metal heat sink, and the lead is placed on the printed circuit board. An electronic circuit device characterized in that the leads are electrically connected to a conductor pattern on the surface of the printed circuit board by protruding from the leads. (2) The electronic circuit device according to claim 1, wherein the leads of the TAB type semiconductor device are drawn out in a concentrated manner from one side of the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987093069U JPS63201351U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987093069U JPS63201351U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201351U true JPS63201351U (en) | 1988-12-26 |
Family
ID=30955334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987093069U Pending JPS63201351U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201351U (en) |
-
1987
- 1987-06-17 JP JP1987093069U patent/JPS63201351U/ja active Pending
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