JPS6230499B2 - - Google Patents
Info
- Publication number
- JPS6230499B2 JPS6230499B2 JP11646279A JP11646279A JPS6230499B2 JP S6230499 B2 JPS6230499 B2 JP S6230499B2 JP 11646279 A JP11646279 A JP 11646279A JP 11646279 A JP11646279 A JP 11646279A JP S6230499 B2 JPS6230499 B2 JP S6230499B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- lead frame
- leads
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11646279A JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11646279A JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5640265A JPS5640265A (en) | 1981-04-16 |
JPS6230499B2 true JPS6230499B2 (enrdf_load_stackoverflow) | 1987-07-02 |
Family
ID=14687703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11646279A Granted JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5640265A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0770676B2 (ja) * | 1986-09-29 | 1995-07-31 | 松下電子工業株式会社 | 半導体装置 |
JPH01161743A (ja) * | 1987-12-17 | 1989-06-26 | Toshiba Corp | 半導体装置 |
-
1979
- 1979-09-11 JP JP11646279A patent/JPS5640265A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5640265A (en) | 1981-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6229205B1 (en) | Semiconductor device package having twice-bent tie bar and small die pad | |
JP3535879B2 (ja) | 半導体パッケージアセンブリ方法 | |
US4801997A (en) | High packing density lead frame and integrated circuit | |
JP3872530B2 (ja) | 半導体装置およびその製造に用いるリードフレーム | |
JPS6230499B2 (enrdf_load_stackoverflow) | ||
JP3144383B2 (ja) | 半導体装置 | |
JP2859057B2 (ja) | リードフレーム | |
JPS63283053A (ja) | 半導体装置のリ−ドフレ−ム | |
JPH05243464A (ja) | リードフレーム及びこれを用いた樹脂封止型半導体装置 | |
KR920000380B1 (ko) | 반도체장치 | |
KR20090012378A (ko) | 반도체 패키지 | |
JPS60111449A (ja) | 半導体装置 | |
JPH0497559A (ja) | リードフレーム | |
JP2667901B2 (ja) | 半導体装置の製造方法 | |
JPS61148849A (ja) | 半導体装置 | |
JP3015458B2 (ja) | リードフレームを用いた半導体装置の製造方法 | |
JPS621239A (ja) | 半導体装置 | |
JPS62144349A (ja) | 半導体装置用リ−ドフレ−ムおよびその製造方法 | |
JP4108637B2 (ja) | 半導体装置 | |
JPH0513642A (ja) | 半導体装置 | |
JP2520612Y2 (ja) | 樹脂封止型半導体装置 | |
JPS60178636A (ja) | 半導体装置 | |
JP2981309B2 (ja) | 半導体装置 | |
JPS62128550A (ja) | 半導体装置用リ−ドフレ−ム | |
JPS6244531Y2 (enrdf_load_stackoverflow) |