JPS5640265A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS5640265A JPS5640265A JP11646279A JP11646279A JPS5640265A JP S5640265 A JPS5640265 A JP S5640265A JP 11646279 A JP11646279 A JP 11646279A JP 11646279 A JP11646279 A JP 11646279A JP S5640265 A JPS5640265 A JP S5640265A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- island
- lead frame
- adjacent
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005452 bending Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11646279A JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11646279A JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5640265A true JPS5640265A (en) | 1981-04-16 |
| JPS6230499B2 JPS6230499B2 (enrdf_load_stackoverflow) | 1987-07-02 |
Family
ID=14687703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11646279A Granted JPS5640265A (en) | 1979-09-11 | 1979-09-11 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5640265A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6384143A (ja) * | 1986-09-29 | 1988-04-14 | Matsushita Electronics Corp | 半導体装置 |
| US4949160A (en) * | 1987-12-17 | 1990-08-14 | Kabushiki Kaisha Toshiba | Semiconductor device |
-
1979
- 1979-09-11 JP JP11646279A patent/JPS5640265A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6384143A (ja) * | 1986-09-29 | 1988-04-14 | Matsushita Electronics Corp | 半導体装置 |
| US4949160A (en) * | 1987-12-17 | 1990-08-14 | Kabushiki Kaisha Toshiba | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230499B2 (enrdf_load_stackoverflow) | 1987-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK53183A (en) | A lead frame and a semiconductor device made by use of the lead frame | |
| JPS5713777A (en) | Semiconductor device and manufacture thereof | |
| GB2017408A (en) | Structured copper strain buffer and semiconductor device structure incorporating the buffer | |
| JPS5461874A (en) | Punching lead frame for semiconductor package | |
| JPS5286067A (en) | Lead wire frame for semiconductor device | |
| GB2057759B (en) | Semiconductor device production | |
| JPS5640265A (en) | Lead frame for semiconductor device | |
| IT1135091B (it) | Transistore mosfet verticale,dotato di un elettrodo di schermatura | |
| JPS5556412A (en) | Device for engaging wire guide post | |
| GB2004222A (en) | Contacting device for producing a wire connection to a microcircuit | |
| JPS5460563A (en) | Lead frame for semiconductor device | |
| FR2561444B1 (fr) | Dispositif semi-conducteur hyperfrequence a connexions externes prises au moyen de poutres | |
| JPS5763850A (en) | Semiconductor device | |
| JPS5735331A (en) | Semiconductor device | |
| JPS5751928B2 (enrdf_load_stackoverflow) | ||
| JPS5726459A (en) | Glass-sealed semiconductor device | |
| JPS5450990A (en) | Screwless terminal | |
| JPS57194559A (en) | Semicondcutor device | |
| JPS5698848A (en) | Semiconductor device | |
| JPS5324779A (en) | Clamper of wire bonder | |
| JPS564260A (en) | Electronic device | |
| JPS5299770A (en) | Metal ribbon for semiconductor devices | |
| JPS56133861A (en) | Film carrier | |
| JPS5617047A (en) | Semiconductor device | |
| JPS5287362A (en) | Lead wire for semiconductor device |