JPS6229920B2 - - Google Patents
Info
- Publication number
- JPS6229920B2 JPS6229920B2 JP56150990A JP15099081A JPS6229920B2 JP S6229920 B2 JPS6229920 B2 JP S6229920B2 JP 56150990 A JP56150990 A JP 56150990A JP 15099081 A JP15099081 A JP 15099081A JP S6229920 B2 JPS6229920 B2 JP S6229920B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- soldering
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 57
- 238000005476 soldering Methods 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000007664 blowing Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000004090 dissolution Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 7
- 230000004907 flux Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15099081A JPS5852899A (ja) | 1981-09-24 | 1981-09-24 | プリント基板へのハンダ付け方法およびその装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15099081A JPS5852899A (ja) | 1981-09-24 | 1981-09-24 | プリント基板へのハンダ付け方法およびその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5852899A JPS5852899A (ja) | 1983-03-29 |
JPS6229920B2 true JPS6229920B2 (xx) | 1987-06-29 |
Family
ID=15508868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15099081A Granted JPS5852899A (ja) | 1981-09-24 | 1981-09-24 | プリント基板へのハンダ付け方法およびその装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5852899A (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853186U (ja) * | 1981-10-07 | 1983-04-11 | クラリオン株式会社 | 自動はんだ付け装置 |
JPS60161696A (ja) * | 1984-02-01 | 1985-08-23 | 千住金属工業株式会社 | プリント基板のはんだ付け用噴流はんだ槽 |
US4610391A (en) * | 1984-12-18 | 1986-09-09 | Union Carbide Corporation | Process for wave soldering |
JP2001251047A (ja) | 2000-03-07 | 2001-09-14 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法および自動はんだ付け装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5350738U (xx) * | 1976-09-28 | 1978-04-28 | ||
JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
-
1981
- 1981-09-24 JP JP15099081A patent/JPS5852899A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5350738U (xx) * | 1976-09-28 | 1978-04-28 | ||
JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
Also Published As
Publication number | Publication date |
---|---|
JPS5852899A (ja) | 1983-03-29 |
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