JPS6229920B2 - - Google Patents

Info

Publication number
JPS6229920B2
JPS6229920B2 JP56150990A JP15099081A JPS6229920B2 JP S6229920 B2 JPS6229920 B2 JP S6229920B2 JP 56150990 A JP56150990 A JP 56150990A JP 15099081 A JP15099081 A JP 15099081A JP S6229920 B2 JPS6229920 B2 JP S6229920B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
solder
soldering
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56150990A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5852899A (ja
Inventor
Seihachi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO SEISAN GIKEN KK
Original Assignee
TOKYO SEISAN GIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO SEISAN GIKEN KK filed Critical TOKYO SEISAN GIKEN KK
Priority to JP15099081A priority Critical patent/JPS5852899A/ja
Publication of JPS5852899A publication Critical patent/JPS5852899A/ja
Publication of JPS6229920B2 publication Critical patent/JPS6229920B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15099081A 1981-09-24 1981-09-24 プリント基板へのハンダ付け方法およびその装置 Granted JPS5852899A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15099081A JPS5852899A (ja) 1981-09-24 1981-09-24 プリント基板へのハンダ付け方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15099081A JPS5852899A (ja) 1981-09-24 1981-09-24 プリント基板へのハンダ付け方法およびその装置

Publications (2)

Publication Number Publication Date
JPS5852899A JPS5852899A (ja) 1983-03-29
JPS6229920B2 true JPS6229920B2 (xx) 1987-06-29

Family

ID=15508868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15099081A Granted JPS5852899A (ja) 1981-09-24 1981-09-24 プリント基板へのハンダ付け方法およびその装置

Country Status (1)

Country Link
JP (1) JPS5852899A (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853186U (ja) * 1981-10-07 1983-04-11 クラリオン株式会社 自動はんだ付け装置
JPS60161696A (ja) * 1984-02-01 1985-08-23 千住金属工業株式会社 プリント基板のはんだ付け用噴流はんだ槽
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
JP2001251047A (ja) 2000-03-07 2001-09-14 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法および自動はんだ付け装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350738U (xx) * 1976-09-28 1978-04-28
JPS5383948A (en) * 1976-12-29 1978-07-24 Pioneer Electronic Corp Method of soldering print wiring plate and its device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350738U (xx) * 1976-09-28 1978-04-28
JPS5383948A (en) * 1976-12-29 1978-07-24 Pioneer Electronic Corp Method of soldering print wiring plate and its device

Also Published As

Publication number Publication date
JPS5852899A (ja) 1983-03-29

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