JPS6229920B2 - - Google Patents
Info
- Publication number
- JPS6229920B2 JPS6229920B2 JP56150990A JP15099081A JPS6229920B2 JP S6229920 B2 JPS6229920 B2 JP S6229920B2 JP 56150990 A JP56150990 A JP 56150990A JP 15099081 A JP15099081 A JP 15099081A JP S6229920 B2 JPS6229920 B2 JP S6229920B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- soldering
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 57
- 238000005476 soldering Methods 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000007664 blowing Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000004090 dissolution Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 7
- 230000004907 flux Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
【発明の詳細な説明】
本発明は、チツプ状の抵抗、コンデンサー等の
部品をプリント基板にハンダ付けする方法および
その装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for soldering components such as chip-shaped resistors and capacitors to a printed circuit board.
チツプ状の抵抗、コンデンサー等の部品をプリ
ント基板にハンダ付けする場合において、従来
は、これらの部品の脚をプリント基板に穿設した
孔にプリント基板の表面側から挿入してその裏面
側に突出させ、その状態でのプリント基板の裏面
を、ハンダ付け装置内の静止式または噴流式のハ
ンダ溶解槽内のハンダ溶解液に接触させて行なつ
ていた。すなわち、裏面を下に向けた状態のプリ
ント基板を傾けてその先端を、静止式ハンダ溶解
槽内の静止状態のハンダ溶解液または噴流式ハン
ダ溶解槽内の噴流状態のハンダ溶解液に接触し、
ハンダ溶解液面に対するプリント基板の傾斜角を
次第に小さくしながら先端から後端までハンダ溶
解液に接触せしめて、上述の各部品の脚と、プリ
ント基板裏面に形成されたプリント配線部とにハ
ンダ付けを施していた。 When soldering chip-shaped components such as resistors and capacitors to a printed circuit board, conventionally the legs of these components were inserted into holes drilled in the printed circuit board from the front side of the printed circuit board and then protruded to the back side. In this state, the back side of the printed circuit board is brought into contact with a solder solution in a static or jet type solder melting tank in a soldering device. That is, the printed circuit board with its back side facing down is tilted and its tip is brought into contact with the stationary solder solution in a static solder melting tank or the jetted solder solution in a jet solder melter,
While gradually reducing the angle of inclination of the printed circuit board with respect to the solder solution surface, bring the printed circuit board into contact with the solder solution from the tip to the rear end, and solder the legs of each of the above components and the printed wiring section formed on the back of the printed circuit board. was being administered.
しかし、上記従来のハンダ付け方法において
は、ハンダ溶解液が通常250℃前後の高温に保持
されているため、接触した部分のプリント基板か
らプリント基板面に塗布されたフラツクスがガス
化されて、プリント基板裏面全体をハンダ溶解液
に接触させようとした場合、上記ガスがプリント
基板とハンダ溶解液面との間に介在して、プリン
ト基板裏面の所望箇所に均一にハンダ付けができ
ないという問題があつた。 However, in the conventional soldering method described above, the solder solution is usually kept at a high temperature of around 250°C, so the flux applied to the printed circuit board surface from the printed circuit board in the contact area is gasified and printed If an attempt is made to bring the entire back side of the board into contact with the solder solution, there is a problem in that the gas mentioned above is interposed between the printed circuit board and the surface of the solder solution, making it impossible to uniformly solder the desired location on the back of the printed circuit board. Ta.
本発明は上記問題を解決し、ガス化したフラツ
クスをプリント基板裏面の半田内部より効果的に
除去でき、プリント基板の所望簡所に均一にハン
ダ付けができるプリント基板へのハンダ付け方法
およびその方法の実施に使用される装置を提供す
ることを目的とする。 The present invention solves the above problems and provides a method for soldering a printed circuit board, which can effectively remove gasified flux from inside the solder on the back of the printed circuit board, and can uniformly solder the solder at desired locations on the printed circuit board. The purpose is to provide a device used for carrying out.
本発明のプリント基板へのハンダ付け方法は、
チツプ状の抵抗、コンデンサー等の部品を植設し
たプリント基板を傾けてその先端をハンダ溶解液
に接触し、ハンダ溶解液面に対するプリント基板
の傾斜角を次第に小さくしながら先端から後端ま
でハンダ溶解液に接触せしめて、プリント基板の
裏面にハンダ付けする方法において、前記プリン
ト基板の先端に後続して後端がハンダ溶解液に接
触するまで、前記プリント基板の後端が接触する
位置のハンダ溶解液面近傍から前記プリント基板
の先端に向けて熱風を送ることを特徴とするもの
である。 The method of soldering to a printed circuit board of the present invention is as follows:
Tilt the printed circuit board on which chip-shaped resistors, capacitors, and other parts are embedded and bring the tip into contact with the solder dissolving solution. Solder melts from the tip to the rear end while gradually reducing the angle of inclination of the printed circuit board with respect to the solder dissolving solution surface. In a method of soldering to the back side of a printed circuit board by contacting with a liquid, the solder is melted at a position where the rear end of the printed circuit board comes into contact, following the leading edge of the printed circuit board until the rear end contacts the solder dissolving liquid. This method is characterized in that hot air is sent from near the liquid surface toward the tip of the printed circuit board.
また、本発明のハンダ付け装置は、上記の如く
ハンダ溶解液面に対するプリント基板の傾斜角を
変化させながらプリント基板の裏面にハンダ付け
する装置において、プリント基板の後端がハンダ
溶解液に接触する位置のハンダ溶解面近傍に、該
位置から前記プリント基板の先端に向けて熱風を
供給する吹出しノズルを配設したことを特徴とす
るものである。 Further, the soldering device of the present invention is an apparatus for soldering to the back side of a printed circuit board while changing the inclination angle of the printed circuit board with respect to the solder solution surface as described above, in which the rear end of the printed circuit board comes into contact with the solder solution. The present invention is characterized in that a blowing nozzle for supplying hot air from the position toward the tip of the printed circuit board is disposed near the solder melting surface at the position.
以下、本発明の実施例を図面に従つて説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
第１図および第２図は本発明方法の実施に使用
されるプリント基板へのハンダ付け装置の一例を
示したもので、図中、１は機枠、２は噴流式のハ
ンダ溶解槽、３はハンダ溶解槽２内に配設された
キヤビネツト、４はハンダ溶解液である。このハ
ンダ溶解液４は、ヒーターボツクス５からハンダ
溶解槽２底部に延びる複数本のヒーターパイプ６
によつて常に溶融された状態に維持されていて、
キヤビネツト３の側方に延設された部分の底部開
口（図示略）からキヤビネツト３内部に導入さ
れ、後述する噴流装置７によつてキヤビネツト３
の吹口８から所定高さまで噴流され、この吹口よ
り溢れて再びハンダ溶解槽２内に循環せられるも
のである。 1 and 2 show an example of an apparatus for soldering printed circuit boards used in the method of the present invention, in which 1 is a machine frame, 2 is a jet-type solder melting tank, and 3 2 is a cabinet disposed in the solder melting tank 2, and 4 is a solder melting liquid. This solder melting liquid 4 is supplied to a plurality of heater pipes 6 extending from the heater box 5 to the bottom of the solder melting tank 2.
is kept in a molten state at all times by
It is introduced into the inside of the cabinet 3 through the bottom opening (not shown) of the side-extending part of the cabinet 3, and is drawn into the cabinet 3 by a jet device 7, which will be described later.
The solder melt is jetted from the nozzle 8 to a predetermined height, overflows from the nozzle, and is circulated into the solder melting tank 2 again.
噴流装置７は、噴流モータ９による駆動力をベ
ルトカバー１０内の伝達機構を介して回転軸１１
に伝達させ、キヤビネツト３内の回転軸１１下端
に取り付けた羽根車１２を回転させて、キヤビネ
ツト３内のハンダ溶解液４を噴流せしめるもので
ある。 The jet device 7 transmits the driving force from the jet motor 9 to the rotating shaft 11 via a transmission mechanism inside the belt cover 10.
The impeller 12 attached to the lower end of the rotary shaft 11 in the cabinet 3 is rotated, and the solder melt 4 in the cabinet 3 is made to flow out.
１３は噴流状態のハンダ溶解液４の液面上に熱
風を送る吹出しノズルであつて、複数の吹出しノ
ズル１３は、各ノズルの吹出し口１３ａをプリン
ト基板を搬送する第１図中央矢印Ａ方向に向け
て、かつ、幾分下方に向けて、プリント基板の後
端が先端に後続して接触する位置の噴流状態のハ
ンダ溶解液面近傍に配設されている。これらの吹
出しノズル１３の基部は、供給管１４を経て、図
示を省略した熱風供給装置に接続している。熱風
としては高温のエアを用いることができ、その熱
風温度はハンダ付けが通常250℃近傍で実施され
ていることを考慮して、この温度と同程度が好ま
しい。 Reference numeral 13 denotes a blowout nozzle that sends hot air onto the liquid surface of the solder melt 4 in a jet state, and the plurality of blowout nozzles 13 direct the blowout opening 13a of each nozzle in the direction of arrow A in the center of FIG. It is disposed near the surface of the solder melt in a jet state at a position where the rear end of the printed circuit board comes into contact with the front end of the printed circuit board, and is directed slightly downward. The bases of these blow-off nozzles 13 are connected to a hot air supply device (not shown) via a supply pipe 14. High-temperature air can be used as the hot air, and considering that soldering is usually performed at around 250°C, the temperature of the hot air is preferably about the same as this temperature.
なお、図示例中、１５は配電箱、１６はプリン
ト基板を支持する支持枠（図示略）を矢印Ａ方向
に搬送するための２条の案内レールである。 In the illustrated example, 15 is a power distribution box, and 16 is two guide rails for transporting a support frame (not shown) that supports a printed circuit board in the direction of arrow A.
次に、上記構成を有するハンダ付け装置を使用
して実施される本発明方法の一例を述べる。 Next, an example of the method of the present invention implemented using the soldering device having the above configuration will be described.
第３図には、ハンダ付けされるプリント基板１
７を示す。このプリント基板１７の複数の孔１７
ａには、チツプ状の抵抗、コンデンサー等の部品
１８の脚１８ａが表面側から挿入されていて、脚
１８ａはプリント基板１７の裏面側に突出してい
る。なお、プリント基板１７の裏面には図示を省
略したが、プリント配線部が形成されている。 Figure 3 shows a printed circuit board 1 to be soldered.
7 is shown. A plurality of holes 17 in this printed circuit board 17
A leg 18a of a component 18 such as a chip-shaped resistor or capacitor is inserted into the part a from the front side, and the leg 18a projects to the back side of the printed circuit board 17. Although not shown, a printed wiring section is formed on the back surface of the printed circuit board 17.
このような構成のプリント基板１７にハンダ付
けを行うには、まず裏面を下に向けた状態のプリ
ント基板１７を、第４図の如く矢印Ａ方向にハン
ダ付け装置上に搬送する。そして吹口８上でプリ
ント基板１７を下方に傾斜し、その先端が図示例
の如し噴流状態のハンダ溶解液４と接触すると同
時に、各吹出しノズル１３からハンダ溶解液４の
液面上に向けて熱風を送り、プリント基板１７の
接触した部品におけるプリント基板面に塗布され
たフラツクスが高温でガス化されても、発生した
ガスを熱風の流れに沿わせて排除する。並行し
て、プリント基板１７の傾斜角を徐々に小さくし
て、ついには後端をハンダ溶解液４に接触させ
る。 To solder the printed circuit board 17 having such a configuration, first, the printed circuit board 17 with its back side facing down is transported onto a soldering device in the direction of arrow A as shown in FIG. Then, the printed circuit board 17 is tilted downward on the blowing port 8, and at the same time its tip comes into contact with the solder melt 4 in a jet state as shown in the illustrated example, the printed circuit board 17 is directed from each blowing nozzle 13 onto the surface of the solder melt 4. Hot air is sent to remove the generated gas along the flow of the hot air even if the flux applied to the printed circuit board surface of the parts in contact with the printed circuit board 17 is gasified at high temperature. In parallel, the inclination angle of the printed circuit board 17 is gradually reduced until the rear end is brought into contact with the solder solution 4.
このようにして、ハンダ溶解液４がプリント基
板１７裏面のプリント配線部（図示略）と部品１
８の脚１８ａの先端部とに付着し、所望箇所への
均一なハンダ付けが施される。続いてプリント基
板１７の先端を上下に傾斜させて、プリント基板
１７を第４図中矢印Ａ方向に搬送すると、一連の
ハンダ付け工程は終了する。 In this way, the solder solution 4 is applied to the printed wiring section (not shown) on the back side of the printed circuit board 17 and the component 1.
8, and is uniformly soldered to a desired location. Subsequently, the leading end of the printed circuit board 17 is tilted up and down and the printed circuit board 17 is transported in the direction of arrow A in FIG. 4, thereby completing the series of soldering steps.
本発明は以上説明した実施例のものに限定され
るものではなく、ハンダ付け装置として静止式ハ
ンダ溶解槽を有するものを用い、これに熱風供給
用の吹出しノズルを設けたものであつてもよく、
そしてこの静止式ハンダ溶解槽を備えたハンダ付
け装置を用いて本発明方法を実施してもよいもの
である。 The present invention is not limited to the embodiments described above, but it is also possible to use a soldering device having a static solder melting tank, which is provided with a blowing nozzle for supplying hot air. ,
The method of the present invention may also be carried out using a soldering apparatus equipped with this static solder melting tank.
以上説明したような本発明のプリント基板への
ハンダ付け方法およびその装置によれば、ハンダ
溶解液に接触した部分のプリント基板からプリン
ト基板面に塗布されたフラツクスがガス化して
も、このガスを熱風を送ることによつて除くこと
ができ、プリント基板の所望箇所に均一にハンダ
付けができる。 According to the method and apparatus for soldering a printed circuit board of the present invention as described above, even if the flux applied to the printed circuit board surface from the part of the printed circuit board that has come into contact with the solder solution is gasified, this gas can be removed. It can be removed by blowing hot air, allowing uniform soldering to desired locations on the printed circuit board.
第１図は本発明に係るハンダ付け装置の一例を
示す平面図、第２図は第１図のものの正面図、第
３図はプリント基板を示す斜視図、第４図は第１
図および第２図に示したハンダ付け装置を用いて
実施される本発明方法の一例を示す図である。
図中、２……ハンダ溶解槽、３……キヤビネツ
ト、４……ハンダ溶解液、７……噴流装置、８…
…吹口、１３……吹出しノズル、１７……プリン
ト基板、１８……部品。
FIG. 1 is a plan view showing an example of a soldering device according to the present invention, FIG. 2 is a front view of the soldering device shown in FIG. 1, FIG. 3 is a perspective view showing a printed circuit board, and FIG.
FIG. 3 is a diagram showing an example of the method of the present invention carried out using the soldering apparatus shown in FIGS. In the figure, 2...Solder dissolving tank, 3...Cabinet, 4...Solder dissolving liquid, 7...Jet flow device, 8...
...Blowout mouth, 13...Blowout nozzle, 17...Printed circuit board, 18...Parts.
Claims (1)
設したプリント基板を傾けてその先端をハンダ溶
解液に接触し、ハンダ溶解液面に対するプリント
基板の傾斜角を次第に小さくしながら先端から後
端までハンダ溶解液に接触せしめて、プリント基
板の裏面にハンダ付けする方法において、前記プ
リント基板の先端に後続して後端がハンダ溶解液
に接触するまで、前記プリント基板の後端が接触
する位置のハンダ溶解液面近傍から前記プリント
基板の先端に向けて熱風を送ることを特徴とする
プリント基板へのハンダ付け方法。 ２ チツプ状の抵抗、コンデンサー等の部品を植
設したプリント基板を傾けてその先端をハンダ溶
解槽内のハンダ溶解液に接触し、ハンダ溶解液面
に対するプリント基板の傾斜角を次第に小さくし
ながら先端から後端までハンダ溶解液に接触せし
めて、プリント基板の裏面にハンダ付けする装置
において、前記プリント基板の後端が接触する位
置のハンダ溶解面近傍に、該位置から前記プリン
ト基板の先端に向けて熱風を供給する吹出しノズ
ルを配設したことを特徴とするプリント基板への
ハンダ付け装置。[Claims] 1. Tilt a printed circuit board on which parts such as chip-shaped resistors and capacitors are implanted, and bring the tip of the board into contact with the solder solution, gradually reducing the angle of inclination of the printed circuit board with respect to the surface of the solder solution. In a method of soldering to the back side of a printed circuit board by contacting the solder solution from the tip to the rear end, the rear end of the printed circuit board is soldered following the front end of the printed circuit board until the rear end comes into contact with the solder solution. A method for soldering a printed circuit board, characterized in that hot air is sent toward the tip of the printed circuit board from near the surface of the solder solution at a position where it comes into contact with the surface of the solder solution. 2 Tilt the printed circuit board on which parts such as chip-shaped resistors and capacitors are embedded, and touch the tip of the printed circuit board to the solder solution in the solder dissolution tank, gradually reducing the angle of inclination of the printed circuit board to the surface of the solder solution. In an apparatus for soldering to the back side of a printed circuit board by contacting the solder solution from the rear end to the solder melting surface, the solder melt is placed near the solder melting surface at a position where the rear end of the printed circuit board comes into contact, and from this position toward the tip of the printed circuit board. A device for soldering printed circuit boards, characterized in that it is equipped with a blowing nozzle that supplies hot air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15099081A JPS5852899A (en) | 1981-09-24 | 1981-09-24 | Method and device for soldering to printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15099081A JPS5852899A (en) | 1981-09-24 | 1981-09-24 | Method and device for soldering to printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5852899A JPS5852899A (en) | 1983-03-29 |
| JPS6229920B2 true JPS6229920B2 (en) | 1987-06-29 |
Family
ID=15508868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15099081A Granted JPS5852899A (en) | 1981-09-24 | 1981-09-24 | Method and device for soldering to printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852899A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853186U (en) * | 1981-10-07 | 1983-04-11 | クラリオン株式会社 | automatic soldering equipment |
| JPS60161696A (en) * | 1984-02-01 | 1985-08-23 | 千住金属工業株式会社 | Method of soldering printed board and jet solder tank |
| US4610391A (en) * | 1984-12-18 | 1986-09-09 | Union Carbide Corporation | Process for wave soldering |
| JP2001251047A (en) | 2000-03-07 | 2001-09-14 | Senju Metal Ind Co Ltd | Method of soldering printed board and automatic soldering apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5350738U (en) * | 1976-09-28 | 1978-04-28 | ||
| JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
-
1981
- 1981-09-24 JP JP15099081A patent/JPS5852899A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5350738U (en) * | 1976-09-28 | 1978-04-28 | ||
| JPS5383948A (en) * | 1976-12-29 | 1978-07-24 | Pioneer Electronic Corp | Method of soldering print wiring plate and its device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5852899A (en) | 1983-03-29 |
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