JPS62295928A - 樹脂含浸基材の製造方法 - Google Patents

樹脂含浸基材の製造方法

Info

Publication number
JPS62295928A
JPS62295928A JP13898286A JP13898286A JPS62295928A JP S62295928 A JPS62295928 A JP S62295928A JP 13898286 A JP13898286 A JP 13898286A JP 13898286 A JP13898286 A JP 13898286A JP S62295928 A JPS62295928 A JP S62295928A
Authority
JP
Japan
Prior art keywords
base material
resin
impregnated
varnish
paper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13898286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0331736B2 (enrdf_load_stackoverflow
Inventor
Katsuo Okuyama
奥山　勝男
Akitsugu Miwa
晃嗣 三輪
Yoshiaki Ezaki
義昭 江崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP13898286A priority Critical patent/JPS62295928A/ja
Publication of JPS62295928A publication Critical patent/JPS62295928A/ja
Publication of JPH0331736B2 publication Critical patent/JPH0331736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP13898286A 1986-06-14 1986-06-14 樹脂含浸基材の製造方法 Granted JPS62295928A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13898286A JPS62295928A (ja) 1986-06-14 1986-06-14 樹脂含浸基材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13898286A JPS62295928A (ja) 1986-06-14 1986-06-14 樹脂含浸基材の製造方法

Publications (2)

Publication Number Publication Date
JPS62295928A true JPS62295928A (ja) 1987-12-23
JPH0331736B2 JPH0331736B2 (enrdf_load_stackoverflow) 1991-05-08

Family

ID=15234711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13898286A Granted JPS62295928A (ja) 1986-06-14 1986-06-14 樹脂含浸基材の製造方法

Country Status (1)

Country Link
JP (1) JPS62295928A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0331736B2 (enrdf_load_stackoverflow) 1991-05-08

Similar Documents

Publication Publication Date Title
JPS62295928A (ja) 樹脂含浸基材の製造方法
JPH0578642A (ja) 接着剤組成物
JPH072853B2 (ja) 樹脂含浸基材の製造方法
JP2000129087A (ja) エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔及び積層板
JPS6364306B2 (enrdf_load_stackoverflow)
JPS5865649A (ja) 積層板の製造法
JPS6037812B2 (ja) 積層板の製造方法
JPH0320138B2 (enrdf_load_stackoverflow)
JP3111577B2 (ja) 積層板の製造方法
JP3179145B2 (ja) フェノール樹脂組成物
JPH04209647A (ja) フェノール樹脂組成物および銅張積層板
JPS62148259A (ja) 難燃性フェノ−ル系樹脂含浸基材の製法
JPH08230106A (ja) 銅張積層板の製造方法
JPH09164646A (ja) フェノール樹脂積層板の製造方法
JPH01126344A (ja) 積層板の製造方法
JPH0441546A (ja) 積層用フェノール樹脂組成物および銅張積層板
JPH0538789A (ja) プリプレグの製造方法及び銀スルーホール印刷配線板用積層板
DE2203672A1 (de) Oberflaechenkaschierte schichtstoffe mit deckschichten aus mit glasfasern besonderer art verstaerkten und gefuellten epoxyd-glasfaser-vliesen auf der basis modifizierter auftragsmassen
JPS6067145A (ja) 銅張積層板の製造方法
JPS61236835A (ja) 積層板
JPH0584866A (ja) 金属箔張積層板の製造方法
JPS61293847A (ja) 繊維補強樹脂シ−ト
JPH03162410A (ja) 積層用フェノール樹脂組成物
JPH0211321A (ja) フェノール樹脂銅張積層板
JPH06107822A (ja) エポキシ樹脂積層板の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees