JPS62295493A - 高速素子実装用回路基板の製造方法 - Google Patents
高速素子実装用回路基板の製造方法Info
- Publication number
- JPS62295493A JPS62295493A JP13731786A JP13731786A JPS62295493A JP S62295493 A JPS62295493 A JP S62295493A JP 13731786 A JP13731786 A JP 13731786A JP 13731786 A JP13731786 A JP 13731786A JP S62295493 A JPS62295493 A JP S62295493A
- Authority
- JP
- Japan
- Prior art keywords
- film
- etching
- circuit board
- wiring
- layer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 4
- 238000012805 post-processing Methods 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 20
- 238000001020 plasma etching Methods 0.000 description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13731786A JPS62295493A (ja) | 1986-06-14 | 1986-06-14 | 高速素子実装用回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13731786A JPS62295493A (ja) | 1986-06-14 | 1986-06-14 | 高速素子実装用回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62295493A true JPS62295493A (ja) | 1987-12-22 |
| JPH0151076B2 JPH0151076B2 (de) | 1989-11-01 |
Family
ID=15195856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13731786A Granted JPS62295493A (ja) | 1986-06-14 | 1986-06-14 | 高速素子実装用回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295493A (de) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01150383A (ja) * | 1987-12-07 | 1989-06-13 | Mitsutoyo Corp | パターン配線用電極体 |
| JPH01150390A (ja) * | 1987-12-07 | 1989-06-13 | Mitsutoyo Corp | 立体パターン配線構造およびその製造方法 |
| JPH0298994A (ja) * | 1988-10-06 | 1990-04-11 | Ibiden Co Ltd | ポリイミド絶縁層上への導体層形成方法 |
| JPH0746755B2 (ja) * | 1990-11-15 | 1995-05-17 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層薄膜構造の製造方法 |
| JPH09289378A (ja) * | 1996-04-19 | 1997-11-04 | Fuji Xerox Co Ltd | プリント配線板及びその製造方法 |
-
1986
- 1986-06-14 JP JP13731786A patent/JPS62295493A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01150383A (ja) * | 1987-12-07 | 1989-06-13 | Mitsutoyo Corp | パターン配線用電極体 |
| JPH01150390A (ja) * | 1987-12-07 | 1989-06-13 | Mitsutoyo Corp | 立体パターン配線構造およびその製造方法 |
| JPH0298994A (ja) * | 1988-10-06 | 1990-04-11 | Ibiden Co Ltd | ポリイミド絶縁層上への導体層形成方法 |
| JPH0746755B2 (ja) * | 1990-11-15 | 1995-05-17 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層薄膜構造の製造方法 |
| JPH09289378A (ja) * | 1996-04-19 | 1997-11-04 | Fuji Xerox Co Ltd | プリント配線板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0151076B2 (de) | 1989-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |