JPS6229177B2 - - Google Patents
Info
- Publication number
- JPS6229177B2 JPS6229177B2 JP15138080A JP15138080A JPS6229177B2 JP S6229177 B2 JPS6229177 B2 JP S6229177B2 JP 15138080 A JP15138080 A JP 15138080A JP 15138080 A JP15138080 A JP 15138080A JP S6229177 B2 JPS6229177 B2 JP S6229177B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cut
- workpiece
- wire
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 16
- 230000010355 oscillation Effects 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5775765A JPS5775765A (en) | 1982-05-12 |
JPS6229177B2 true JPS6229177B2 (enrdf_load_stackoverflow) | 1987-06-24 |
Family
ID=15517297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15138080A Granted JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5775765A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6179564A (ja) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | 切断機の材料支持装置 |
JPS6393558A (ja) * | 1986-10-03 | 1988-04-23 | Kenichi Ishikawa | 電着ダイヤモンドワイヤ−による硬脆材料の切断装置 |
JP2891187B2 (ja) * | 1995-06-22 | 1999-05-17 | 信越半導体株式会社 | ワイヤーソー装置及び切断方法 |
WO2006061043A1 (de) | 2004-12-10 | 2006-06-15 | Freiberger Compound Materials Gmbh | Werkstückhalterung und verfahren zum drahtsägen |
-
1980
- 1980-10-30 JP JP15138080A patent/JPS5775765A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5775765A (en) | 1982-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI699269B (zh) | 晶圓生成方法 | |
JPH11320356A (ja) | 薄板ワークの平面研削方法およびその研削装置 | |
JPH0938854A (ja) | マルチワイヤーソーのワイヤー供給装置 | |
JPH1170457A (ja) | 固定砥粒ワイヤソー及びその被加工物切断方法 | |
JP6168689B2 (ja) | ワイヤソー及び切断加工方法 | |
JPS6229177B2 (enrdf_load_stackoverflow) | ||
CN211415813U (zh) | 一种线切割装置 | |
JPH07323420A (ja) | ウェーハ製造方法及びその装置 | |
JPH10128738A (ja) | ワイヤソーのワーク切断方法 | |
JPH1128654A (ja) | 固定砥粒ワイヤソーのドレッシング方法及び装置 | |
JPH05318460A (ja) | 半導体ウエハのスライシング方法 | |
JPS58137554A (ja) | 両面同時研磨機のソフト加圧機構および研磨方法 | |
JPH07136818A (ja) | 超音波穴明け加工方法及びそのための加工装置並びにこれに用いる加工具 | |
JPS6377647A (ja) | 板状体の研削方法及びその装置 | |
CN115958711B (zh) | 一种自动上下料截断机 | |
JPH10249699A (ja) | マルチワイヤーソー | |
JPS6140457Y2 (enrdf_load_stackoverflow) | ||
JP2612130B2 (ja) | スライシングマシンの内周刃ドレッシング方法 | |
JPH0115363B2 (enrdf_load_stackoverflow) | ||
JPH0679717A (ja) | 半導体ウエハのスライシング方法及びその装置 | |
JPS626931B2 (enrdf_load_stackoverflow) | ||
JP3170779B2 (ja) | 半導体ウエハの揺動スライシング方法 | |
JPS62114875A (ja) | 横軸自動平面研削盤での送り時間短縮方法 | |
CN117226524A (zh) | 一种弧形磁芯的加工结构及磁芯加工方法 | |
JPH018291Y2 (enrdf_load_stackoverflow) |