JPS5775765A - Cutting method for wire made of hard fragil member - Google Patents
Cutting method for wire made of hard fragil memberInfo
- Publication number
- JPS5775765A JPS5775765A JP15138080A JP15138080A JPS5775765A JP S5775765 A JPS5775765 A JP S5775765A JP 15138080 A JP15138080 A JP 15138080A JP 15138080 A JP15138080 A JP 15138080A JP S5775765 A JPS5775765 A JP S5775765A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- rolling
- center
- rolling angle
- worked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005096 rolling process Methods 0.000 abstract 8
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5775765A true JPS5775765A (en) | 1982-05-12 |
| JPS6229177B2 JPS6229177B2 (enrdf_load_stackoverflow) | 1987-06-24 |
Family
ID=15517297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15138080A Granted JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5775765A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6179564A (ja) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | 切断機の材料支持装置 |
| JPS6393558A (ja) * | 1986-10-03 | 1988-04-23 | Kenichi Ishikawa | 電着ダイヤモンドワイヤ−による硬脆材料の切断装置 |
| EP0749817A1 (en) * | 1995-06-22 | 1996-12-27 | Shin-Etsu Handotai Company Limited | Wire saw slicing apparatus and slicing method |
| JP2008522838A (ja) * | 2004-12-10 | 2008-07-03 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | ワークホルダ及びワイヤーソーイング方法 |
-
1980
- 1980-10-30 JP JP15138080A patent/JPS5775765A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6179564A (ja) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | 切断機の材料支持装置 |
| JPS6393558A (ja) * | 1986-10-03 | 1988-04-23 | Kenichi Ishikawa | 電着ダイヤモンドワイヤ−による硬脆材料の切断装置 |
| EP0749817A1 (en) * | 1995-06-22 | 1996-12-27 | Shin-Etsu Handotai Company Limited | Wire saw slicing apparatus and slicing method |
| US5947798A (en) * | 1995-06-22 | 1999-09-07 | Shin-Etsu Handotai Co., Ltd. | Wire saw cutting apparatus synchronizing workpiece feed speed with wire speed |
| JP2008522838A (ja) * | 2004-12-10 | 2008-07-03 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | ワークホルダ及びワイヤーソーイング方法 |
| US8061345B2 (en) | 2004-12-10 | 2011-11-22 | Freiberger Compound Materials Gmbh | Method for wire sawing |
| JP4874262B2 (ja) * | 2004-12-10 | 2012-02-15 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | ワイヤーソーイング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6229177B2 (enrdf_load_stackoverflow) | 1987-06-24 |
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