JPS6229177B2 - - Google Patents
Info
- Publication number
- JPS6229177B2 JPS6229177B2 JP15138080A JP15138080A JPS6229177B2 JP S6229177 B2 JPS6229177 B2 JP S6229177B2 JP 15138080 A JP15138080 A JP 15138080A JP 15138080 A JP15138080 A JP 15138080A JP S6229177 B2 JPS6229177 B2 JP S6229177B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cut
- workpiece
- wire
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 16
- 230000010355 oscillation Effects 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】
本発明は、半導体部材のような硬脆性部材をワ
イヤで切断する方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved method for cutting hard and brittle members, such as semiconductor members, with a wire.
従来柱状の半導体部材から薄片状のウエハを得
る方法としてワイヤ切断方法が広く採用されてい
る。 Conventionally, a wire cutting method has been widely adopted as a method for obtaining flaky wafers from columnar semiconductor members.
この方法は複数本のワイヤを平行に張架して往
復動させながら半導体部材(以下被加工物と称
す)に押圧し、この押圧部位に砥粒と油を混合し
たスラリを供給してラツピングにより切断する方
法である。この方法は切断砥石などによる他の方
法に比べて得られるウエハの精度がよい点ですぐ
れているが、切断速度が非常に遅く能率が悪い欠
点がある。すなわちこの切断方法は切込み始めは
ワイヤと被加工物の接触長さが短く、切込みも浅
いので、十分スラリが供給され、切断速度も大き
いが、切込み深さが大きくなると、接触長さは大
となり、一方加工部位も深くなるので十分加工部
位にスラリが供給されなくなる。また接触長さも
最初と中間(被加工物の大径部)とでは大きく異
なるので、ラツピング圧も大きく変わるため常に
適切なラツピング圧に保つことが困難であるなど
のため切断速度は遅いのである。 In this method, multiple wires are stretched in parallel and pressed against a semiconductor member (hereinafter referred to as the workpiece) while reciprocating, and a slurry containing a mixture of abrasive grains and oil is supplied to the pressed area to perform wrapping. This is a method of cutting. This method is superior to other methods such as those using a cutting grindstone in that the precision of the wafer obtained is high, but it has the drawback that the cutting speed is very slow and efficiency is poor. In other words, in this cutting method, the contact length between the wire and the workpiece is short at the beginning of the cut, and the depth of cut is shallow, so sufficient slurry is supplied and the cutting speed is high, but as the depth of cut increases, the contact length increases. On the other hand, since the processing area also becomes deep, slurry cannot be sufficiently supplied to the processing area. In addition, since the contact length differs greatly between the beginning and the middle (large diameter part of the workpiece), the wrapping pressure also changes greatly, making it difficult to maintain an appropriate wrapping pressure at all times, and the cutting speed is slow.
上述の不都合を解決するため、被加工物を揺動
させながら切断することも行なわれている。揺動
させることにより、切断線は円弧状により、ほぼ
直線状に張られたワイヤはわずかな円弧で接触す
るので、ラツピング圧も従来に比べればはるかに
変化が少なく、スリラの供給も円滑に行なわれる
ため、従来の不都合が大幅に改良される。 In order to solve the above-mentioned problems, cutting the workpiece while swinging it has also been practiced. By swinging, the cutting line is in an arc shape, and the almost straight wire is brought into contact with a slight arc, so the wrapping pressure changes much less than in the past, and the sriller can be fed smoothly. Therefore, the disadvantages of the conventional method are greatly improved.
しかるにこの揺動切断方法は揺動角度が終始一
定のため被加工物の中心部(最大径部分)に至る
までは揺動の両端においてラツピングされない時
間が多く能率は悪いという不都合があつた。また
切断初期においてもワイヤが被加工物から離間
し、切込み初期における精度が悪く、切断最終時
においても揺動のため被加工物に割れが生じるな
どの不都合があつた。 However, in this oscillating cutting method, since the oscillating angle is constant throughout, there is a disadvantage that there is a long period of time during which wrapping is not performed at both ends of the oscillation until the center (maximum diameter portion) of the workpiece is reached, resulting in poor efficiency. In addition, the wire separates from the workpiece even at the beginning of cutting, resulting in poor precision at the beginning of cutting, and even at the end of cutting, the swinging causes cracks in the workpiece.
本発明は上述の不都合を除去するためになされ
たもので、切断初期および切断終期は揺動させず
に切込み、被加工物の中心近傍までは順次揺動角
を大に、中心近傍では一定に、中心近傍を過ぎて
から順次揺動角を小にして切断することにより精
度よく、しかも能率よく切断する硬脆性部材のワ
イヤ切断方法である。 The present invention was made in order to eliminate the above-mentioned disadvantages, and the cutting is made without swinging at the beginning and end of cutting, and the swinging angle is gradually increased up to the vicinity of the center of the workpiece, and is kept constant near the center. This is a wire cutting method for a hard and brittle member that cuts the hard and brittle member with high precision and efficiency by sequentially decreasing the swing angle after passing near the center.
以下本発明の詳細を一実施例により説明する。
まず、本発明を実施した装置につき略述する。複
数本のワイヤ1,…を往復動自在に並列張架して
構成した加工部2と、これに対向して下方に設け
られて、被加工物3を支持する本体部4と、これ
を制御する制御部5とから構成されている。本体
部4は、圧力調節自在な油圧装置6のピストン棒
7に加工テーブル8を取付け、これの上面にモー
タ、減速機、歯車列などからなる揺動駆動機構9
を取付け、ブラケツト10により支持された揺動
テーブル11を揺動させるようになつていて、こ
の揺動テーブル11上に円柱状の被加工物3がセ
ラミツクスなどからなる補助部材13を介して固
定されている。制御部5は揺動駆動機構9を制御
するモータ制御回路20と、油圧装置6を制御す
る油圧制御回路21と、加工テーブル8の高さを
検出する2組の検出体22,22とを具えてい
る。検出体22は光源を内蔵した投光体23を加
工テーブル8の一端に設け、また複数個(本実施
例においては5mm毎)の光電変換素子を上下方向
に一列に等間隔に配設した受光体24を投光体2
3に対向して設けて構成されている。そして加工
テーブル8の上下動により各投光体23も上下動
し、これから投射される検出光を、これに対向し
た各光電変換素子が受けることにより加工テーブ
ル8の高さに応じた電気信号を各検出体22,2
2から送出する。これら電気信号の中一方はモー
タ制御回路20に入り、加工テーブル8の高さに
応じて予め設定されたモータの回転数に切換わ
り、それに応じて揺動角度がそれぞれ決定され
る。また他方の電気信号は油圧制御回路21に入
り、油圧装置6の油圧が加工テーブル8の高さに
応じて予め設定された圧力に切換わり、ワイヤ1
に対する被加工物3の荷重がそれぞれ決定され
る。 The details of the present invention will be explained below using one example.
First, the apparatus implementing the present invention will be briefly described. A processing section 2 constituted by a plurality of wires 1, ... stretched in parallel so as to be able to reciprocate, a main body section 4 provided below opposite to this and supporting a workpiece 3, and a main body section 4 for controlling the processing section 2. It is composed of a control section 5. In the main body 4, a processing table 8 is attached to a piston rod 7 of a hydraulic device 6 that can freely adjust pressure, and a swing drive mechanism 9 consisting of a motor, a reduction gear, a gear train, etc. is mounted on the top surface of the processing table 8.
A swing table 11 supported by a bracket 10 is mounted on the swing table 11, and a cylindrical workpiece 3 is fixed on the swing table 11 via an auxiliary member 13 made of ceramics or the like. ing. The control unit 5 includes a motor control circuit 20 that controls the swing drive mechanism 9, a hydraulic control circuit 21 that controls the hydraulic device 6, and two sets of detection bodies 22, 22 that detect the height of the processing table 8. It is growing. The detection object 22 is a light receiving object that includes a light emitter 23 with a built-in light source installed at one end of the processing table 8, and a plurality of photoelectric conversion elements (in this example, every 5 mm) arranged vertically in a row at equal intervals. The body 24 is the projector 2
3 and are arranged opposite to each other. As the processing table 8 moves up and down, each light projecting body 23 also moves up and down, and each photoelectric conversion element facing the detection light that is projected from this receives an electric signal corresponding to the height of the processing table 8. Each detection object 22, 2
Send from 2. One of these electric signals enters the motor control circuit 20, and the rotation speed of the motor is switched to a preset motor rotation speed according to the height of the processing table 8, and the swing angles are determined accordingly. The other electric signal enters the hydraulic control circuit 21, and the hydraulic pressure of the hydraulic device 6 is switched to a preset pressure according to the height of the processing table 8, and the wire 1
The load of the workpiece 3 on each is determined.
次に上述の装置の作動とともに本発明方法の一
実施例を説明する。 Next, an embodiment of the method of the present invention will be described along with the operation of the above-described apparatus.
本実施例における切込み深さtと揺動角度θと
の関係および切込み深さtと荷重との関係は第2
図に示すように設定され、これに基づいて加工す
る。 The relationship between the depth of cut t and the swing angle θ and the relationship between the depth of cut t and the load in this example are as follows.
The settings are as shown in the figure, and processing is performed based on these settings.
第2図は、その横軸は切断開始点からの切込み
深さtを表わし、曲線Aについては縦軸は揺動角
を、曲線Bについてはラツピング圧(荷重W)を
表わしたものである。揺動角θは第1図に示すよ
うに被加工物3が揺動する角度で、ワイヤ1によ
り形成される包絡線からなる切断線Rの両端(被
加工物3の外周との交点)が揺動中心Cにおいて
形成する角度θ(実際はこれより若干大)であ
る。またラツピング圧(荷重W)は油圧装置6に
より被加工物3がワイヤ1を押圧する力のことで
ある。これらの線図A,Bを参照して加工態様を
説明する。まず揺動角θは、曲線Aに示すよう
に、最初は揺動させずに切込みを入れ、切込み深
さt1、において初めて揺動を開始する。切込み深
さtが増すにつれて切断線Rは増加するのでこれ
に対応して揺動角を増加させて行く。なおこの増
加は曲線Aにおいては便宜上直線的に示してある
が、検出体22は不連続に加工テーブル8の高さ
を検出するので段階的に増加して行く。切込みが
被加工物3の中心O近傍すなわち、被加工物の直
径のほぼ1/3程度のt2に達すると、増加を停止
し、一定の揺動角θ2で切断が続けられ、中心O
を過ぎ切込みがほぼ2/3のt3に至つて揺動角を順
次減少させて行き切断完了位置近傍の切込み深さ
t4に至つて揺動を停止し、最初と同様にして切断
を終る。 In FIG. 2, the horizontal axis represents the depth of cut t from the cutting start point, the vertical axis for curve A represents the swing angle, and the curve B represents the wrapping pressure (load W). The swing angle θ is the angle at which the workpiece 3 swings, as shown in FIG. This is the angle θ formed at the swing center C (actually, it is slightly larger than this). Further, the wrapping pressure (load W) is the force with which the workpiece 3 presses the wire 1 by the hydraulic device 6. The processing mode will be explained with reference to these diagrams A and B. First, as for the swing angle θ, as shown by curve A, the cut is made without swinging at first, and swinging is started for the first time at the cutting depth t 1 . As the cutting depth t increases, the cutting line R increases, and the swing angle increases accordingly. Although this increase is shown linearly in curve A for convenience, since the detection body 22 detects the height of the processing table 8 discontinuously, it increases stepwise. When the depth of cut reaches t 2 near the center O of the workpiece 3, that is, approximately 1/3 of the diameter of the workpiece, it stops increasing and continues cutting at a constant swing angle θ 2 until the center O
The oscillation angle is gradually decreased until the depth of cut reaches t 3 , which is approximately 2/3, and the depth of cut is reached near the cutting completion position.
At t 4 , the rocking is stopped and the cutting is completed in the same manner as the beginning.
また押圧力(荷重W)は曲線Bに示すように、
数mm(t′1)切込んだ後順次切込みtに応じて増加
して行き、切込みt2より前の切込みt′2において増
加を止め、以降切断完了位置近傍の切込みt′4迄
切断し、ここから順次押圧力を減少させて、切断
完了時t5にはほぼ最初の押圧力になる。 In addition, the pressing force (load W) is as shown in curve B.
After cutting several mm (t' 1 ), it increases sequentially according to the depth of cut t, stops increasing at the depth of cut t' 2 , which is before the depth of cut t2 , and continues cutting until the depth of cut t' 4 , which is near the cutting completion position. , the pressing force is gradually decreased from here, and reaches almost the initial pressing force at t5 when cutting is completed.
なお、上述のスケジユールは検出体22の電気
信号により実施されるもので、切込み深さtに対
応した加工テーブル8の高さが検出されると、こ
れに対応した揺動角、押圧力がとられるように各
制御回路20,21には予め適切な値が設置され
ている。 Note that the above-mentioned schedule is implemented by an electric signal from the detection body 22, and when the height of the processing table 8 corresponding to the depth of cut t is detected, the corresponding swing angle and pressing force are adjusted. Appropriate values are set in advance in each of the control circuits 20 and 21 so that the control circuits 20 and 21 can be used.
以上詳述したように本発明の硬脆性部材のワイ
ヤ切断方法は、最初は揺動させずに切込みを入れ
るので、ワイヤが被加工物から外れたり、欠けを
生じるようなことなく、正確に切込みが進行し、
ワイヤが安定してからは被加工物を揺動させなが
ら切断するので、その切断線は揺動により円弧状
となり、ワイヤと被加工物の接触面積は従来の直
線的切断方法に比べてはるかに小さく、しかもほ
ぼ一定に保たれるので、ラツプ圧の管理も容易
で、しかもスラリの流入流出が円滑に行なわれる
ので切断能率がよく、さらに揺動角度を切断深さ
に応じて変化させるので、揺動両端における無駄
がなく、さらに能率が向上する。また切断完了点
近傍においては揺動を止めて切断するので切断終
了時の不所望な折損が防止され、後工程における
処理も大幅に軽減され、歩留りも向上するなどの
効果を奏するものである。 As detailed above, in the wire cutting method for hard and brittle members of the present invention, the cut is made without rocking at first, so the wire is not detached from the workpiece or chipped, and the cut is made accurately. progresses,
After the wire stabilizes, the workpiece is cut while swinging, so the cutting line becomes arcuate due to the swinging, and the contact area between the wire and workpiece is much larger than with conventional straight cutting methods. Since it is small and kept almost constant, it is easy to manage the lap pressure, and the slurry flows in and out smoothly, resulting in good cutting efficiency.Furthermore, since the swing angle changes according to the cutting depth, There is no waste at both ends of the swing, further improving efficiency. In addition, since the swinging is stopped near the cutting completion point, undesired breakage is prevented at the end of cutting, processing in subsequent steps is significantly reduced, and the yield is improved.
なお本実施例のように押圧力を切込み初めは、
小に保ち、揺動中は大に保つて切断する方法は、
最初の切込みが正確に精度よく行なわれ、しかも
揺動中はワイヤの接触面積が増加して切断能率が
さらに向上するという効果を有する。 In addition, as in this example, when the pressing force is initially cut,
The method of cutting by keeping it small and keeping it large during rocking is as follows.
The first cut is made accurately and accurately, and the contact area of the wire increases during swinging, further improving cutting efficiency.
第1図は本発明の一実施例を実施するための装
置の要部を示す正面図、第2図は同じく一実施例
のスケジユールを説明するための線図である。
1:ワイヤ、3:被加工物、θ:揺動角度、
O:被加工物の中心。
FIG. 1 is a front view showing the main parts of an apparatus for implementing an embodiment of the present invention, and FIG. 2 is a diagram for explaining the schedule of the embodiment. 1: wire, 3: workpiece, θ: swing angle,
O: Center of the workpiece.
Claims (1)
からなる被加工物に押圧し押圧部位に砥粒を供給
して切込み上記被加工物を切断するワイヤ切断方
法において、所定切込み深さに達する迄上記被加
工物を揺動させずに切込み所定切込み深さに達し
た後上記揺動を開始し切込み深さに応じて順次上
記揺動の揺動角度を増加し、上記被加工物の中心
近傍において最大揺動角度とし上記近傍通過物順
次切込み深さに応じて上記揺動角を減少し切断完
了部位近傍に至つて上記揺動を停止して切断分離
することを特徴とする硬脆性部材のワイヤ切断方
法。1 In a wire cutting method in which a wire is pressed against a workpiece made of a columnar hard brittle member while reciprocating, and abrasive grains are supplied to the pressed area to cut the workpiece, the above-mentioned cutting process is performed until a predetermined depth of cut is reached. After reaching the predetermined depth of cut without oscillating the workpiece, the oscillation is started, and the oscillation angle of the oscillation is sequentially increased according to the depth of cut. A wire of a hard brittle member, characterized in that the swinging angle is set at a maximum, and the swinging angle is decreased in accordance with the cutting depth of the object passing through the vicinity, and when the swinging angle reaches the vicinity of the cutting completion part, the swinging is stopped and the wire is cut and separated. Cutting method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138080A JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5775765A JPS5775765A (en) | 1982-05-12 |
JPS6229177B2 true JPS6229177B2 (en) | 1987-06-24 |
Family
ID=15517297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15138080A Granted JPS5775765A (en) | 1980-10-30 | 1980-10-30 | Cutting method for wire made of hard fragil member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5775765A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6179564A (en) * | 1984-09-26 | 1986-04-23 | Hirabayashi:Kk | Material supporting device for cutting machine |
JPS6393558A (en) * | 1986-10-03 | 1988-04-23 | Kenichi Ishikawa | Cutting device for hard and brittle material by electro-deposited diamond wire |
JP2891187B2 (en) * | 1995-06-22 | 1999-05-17 | 信越半導体株式会社 | Wire saw device and cutting method |
EP1819473A1 (en) | 2004-12-10 | 2007-08-22 | Freiberger Compound Materials GmbH | Workpiece holder and method for wire sawing |
-
1980
- 1980-10-30 JP JP15138080A patent/JPS5775765A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5775765A (en) | 1982-05-12 |
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