EP1819473A1 - Workpiece holder and method for wire sawing - Google Patents
Workpiece holder and method for wire sawingInfo
- Publication number
- EP1819473A1 EP1819473A1 EP04822533A EP04822533A EP1819473A1 EP 1819473 A1 EP1819473 A1 EP 1819473A1 EP 04822533 A EP04822533 A EP 04822533A EP 04822533 A EP04822533 A EP 04822533A EP 1819473 A1 EP1819473 A1 EP 1819473A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- workpiece
- wire
- saw
- saw bar
- longitudinal axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Definitions
- the invention relates to a method for separating a workpiece, in particular a single crystal, in a wire saw, as well as a wire saw, a saw bar for carrying out this method, and a semiconductor wafer.
- FIGS. 5a and 5b the surface profile of a GaAs wafer after separation of a GaAs single crystal by the known wire saw method is shown, as recorded with a stylus instrument (Perthometer from Mahr) along the scan line 44 in FIG.
- the depth of the groove or the height of the heel (saw mark) clearly stands out with 7 ⁇ m in FIG. 5a or 10 ⁇ m in FIG. 5b from the remaining surface roughness!
- the height of the heel may also assume significantly higher values of more than 20 ⁇ m given unfavorable choice of the properties of the abrasive.
- the properties of the abrasive such as the hard material content or the viscosity of the carrier influence the scoring.
- the scoring can be minimized.
- the properties of the abrasive also affect other surface parameters of the wheels, such as the warp, the bow or the surface roughness. It is not always possible in the known wire sawing method to select the properties of the abrasive so that the formation of grooves or shoulders and the aforementioned further surface parameters are optimized at the same time, since in some cases different properties are required for both optimization criteria.
- Optimizing the abrasive to prevent scoring and scaling while optimizing surface parameters greatly limits the abrasive properties of the abrasive and limits the life of the abrasive.
- the abrasive is usually held in wire sawing in a closed circuit. When wire sawing GaAs disks, valuable gallium can be recovered from the abrasive slurry. For reasons of economy, therefore, the abrasive is preferably kept in the closed loop until it has a high content of GaAs (about 10%). However, a high GaAs content in the abrasive in the prior art process negatively affects the score and step formation as the wire passes from the workpiece to the saw bar.
- the object is achieved by a saw bar for fastening a workpiece in a wire saw according to claim 1, by a method for separating a workpiece in a wire saw according to claim 6, by a wire saw according to claim 15 or 17 and by a semiconductor wafer according to claim 18.
- the method according to the invention and the devices according to the invention have the particular advantage that on the cut surfaces of a workpiece separated in a wire saw, regardless of the composition of the abrasive used, the formation of scoring or shouldering during the transition of the wire from the workpiece to the sawing bar is either reduced or completely avoided can.
- the property parameters of the abrasive can therefore be optimized with a purpose other than the avoidance of scoring or shouldering.
- the abrasive may e.g. be optimized so that surface parameters of the cut surface such as warp, bow and surface roughness are minimized. Further, in GaAs disc production, the GaAs content of the closed loop abrasive can be increased.
- the invention further has the advantage that a complex post-processing of the cut surface such as lapping or grinding can be omitted. Further, in the separation of a workpiece in a wire saw, in which high demands are placed on the surface quality of the cut surface, the yield can be increased.
- the edge region 42 (see Fig. 3), which can not be used for the production of semiconductor devices - the so-called edge exclusion of the semiconductor wafer - can be minimized. If, in the production of wheels, the edge area in which the saw mark is located is removed after sawing by edge rounding, then the invention can minimize the removal by edge rounding, thereby saving costly material.
- Fig. 1 is a schematic sectional view of a
- Fig. Ia is a perspective view of the saw bar according to the first embodiment
- Fig. 2 is a schematic sectional view of a
- 5a and 5b each show the section through a surface profile of a separation surface produced by the known method in a wire saw.
- a workpiece 1 with a saw bar 2 when disconnected in a wire saw according to the first embodiment is shown in a schematic sectional view.
- the workpiece 1 has the shape of a cylinder.
- the material of the workpiece 1 may be a single crystal, in particular a semiconductor single crystal such as a Si single crystal or a GaAs single crystal, but also any other material that can be cut with a wire saw.
- a saw bar 2 is fixed, with which the workpiece 1 is fixed in a wire saw.
- the saw bar 2 may for example be made of graphite, but also of any other material that can be cut with a wire saw.
- a wire 3 is stretched over rollers (not shown) such that a plurality of wire sections span a wire plane perpendicular to the image plane in FIG.
- the wire saw has a feed device 12, to which the workpiece 1 is attached via the saw bar 2 for separation.
- the workpiece 1 With the feed device 12, the workpiece 1 can be moved relative to the wire plane in a feed direction 4, which is perpendicular to the wire plane.
- a device 14 for applying abrasive to the wire 3 is provided in the wire saw. It is Further, a drive unit (not shown) provided for moving the wire 3 along its longitudinal direction.
- the saw bar 2 according to the first embodiment is, as shown in Fig. Ia, substantially formed as an elongated cuboid having a recess which is adapted to the outer shape of the cylindrical workpiece. Through the recess, a bearing surface 5 of the saw bar is formed, which serves as a contact surface for the workpiece 1 in the adhered to the workpiece 1 state.
- the recess is formed such that the cross-sectional area A (hatched area in Fig. Ia) of the saw bar 2 perpendicular to its longitudinal axis L is asymmetrical.
- a flat side surface 6 of the saw bar 2 serves as a stop for attachment of the saw bar 2 to the feed device 12.
- This flat side surface 6 is aligned parallel to the wire plane (perpendicular to the image plane of FIG. 1) in the installed state. Seen in cross section, the two sides 13, 13 ', which connect the flat side surface 6 with the contact surface 5 of different lengths. Due to their asymmetry, the saw bar 2 is glued laterally displaced onto the workpiece 1 in the state installed in the wire saw relative to a plane 11 extending through the central longitudinal axis M of the workpiece 1 perpendicular to the wire 3. Here, the center longitudinal axis M in Fig. 1 is perpendicular to the image plane.
- the saw bar 2 is secured to the workpiece 1 prior to cutting.
- it can be glued to the workpiece, for example.
- an adhesive for example, an epoxy resin can be used.
- the workpiece 1 is fixed in the wire saw.
- the feed device 12 has a stop surface 6 'parallel to the wire plane.
- the wire sections 3 are always in one during the separation process via the rollers (not shown)
- Direction of sense 8 moves along its longitudinal axis, while the workpiece 1 is pressed in a feed direction 4 perpendicular to the wire plane on the wire sections 3 and moved through the wire plane. Thereby, the workpiece 1 is separated into a plurality of disks.
- the workpiece 1 and the saw bar 2 constitute a composite body whose surface is pierced by each wire section 3 forming the wire plane during the separating operation at two piercing points 9 and 10.
- the wire enters the separating gap along its longitudinal direction with a constant sense of direction 8, while it emerges from the separating gap at the other piercing point 10. It has been found that the cut along the cut during separation is formed at the point at which the entry-side puncture point 9 merges from the surface of the workpiece 1 to the surface of the saw bar 2.
- the piercing point lying on the surface of the workpiece is the entry-side piercing point.
- the effect of the method according to the invention can be attributed to the fact that the transport of the inlet side of the Wire 3 applied abrasive can be transported largely without interference by the saw bar 2 in the separation gap in the workpiece 1, as long as the entry-side puncture point 9 is located on the surface of the workpiece.
- a saw bar 22 known per se can be used whose cross-sectional area is symmetrical perpendicular to its longitudinal axis L in order to carry out the method according to the invention.
- a wire saw according to the second embodiment is different from the wire saw according to the first embodiment in that the saw bar 22 is held obliquely in the wire saw relative to a plane 31 perpendicular to the wire plane.
- the feed device 32 is provided with a stop surface 26 'for the saw bar 22, which is tilted against the wire plane so that the plane defined by the stop surface 26' E with the wire plane forms an angle ⁇ .
- the saw bar 22 rests with a bearing surface 25 on the workpiece.
- the support surface 25 opposite a flat side surface 26 of the saw bar 22 serves as a stop for attachment of the saw bar 22 on the abutment surface 26 'of the feed device 32.
- the flat side surface 26 is in the installed state parallel to the abutment surface 26' of the feed device 32, while the support surface 25 represents a contact surface between the workpiece 21 and saw bar 22.
- the saw bar 22 in the installed state in the wire saw relative to a through the central longitudinal axis M of the workpiece 21 perpendicular to the wire 23 extending plane 31 laterally staggered on the workpiece 21 glued.
- the method according to the invention can be carried out, in which the composite of the material 21 and the saw bar 22 body is moved through the wire plane that at least temporarily a puncture point 29, by which the wire portion 23 pierces the assembled body on the surface of the workpiece 21 and at the same time the other piercing points 30, through which the wire portion 23 pierces the assembled body, on the surface of the saw bar 22 is located.
- the contact surface 25 between the saw bar 22 and the workpiece 21 in the installed state exclusively or at least for the most part on one side of the through the center longitudinal axis M of the workpiece 21 and a solder on the portion of the wire 23rd , by which the workpiece 21 is moved, plane clamped 31 lies.
- the saw bar 22 in the wire saw is aligned such that it is moved exclusively on one side through the center longitudinal axis M of the workpiece 21 and a perpendicular onto the portion of the wire 23 through which the workpiece 21 is moved.
- spanned level 31 is located.
- at least one of the two puncture points 29 and 30 always lies on the surface of the workpiece 21 during the entire time of cutting the workpiece 21.
- the abrasive applied to the wire 23 on the inlet side can therefore be used without interruption by the saw bar during the entire separation process be transported with the wire in the separating gap.
- Fig. 3 the position of the groove 40 is shown on a semiconductor wafer, which was prepared by the inventive method according to one of the two embodiments of a semiconductor single crystal as a workpiece.
- the position of the groove 41 is shown, which is formed in the known wire sawing of the semiconductor single crystal on the semiconductor wafer.
- the inner region 43 is the region of the semiconductor wafer which remains after a subsequent rounding of the semiconductor wafers. With the method according to the invention, the position of the groove can be shifted into this region 42, which is removed during the rounding of the disk after the workpiece has been cut off, or the scoring can be completely avoided.
- FIG. 4 shows a section through the surface profile of a GaAs wafer produced by the method according to the invention.
- the surface profile was taken along the scan line 7 in FIG. 1 with a stylus instrument (Perthometer from Mahr).
- the improvement of the surface profile compared to the measurements on conventionally produced GaAs disks in FIGS. 5a and 5b can be clearly seen.
- a disc which has no SAgemarke in the unrounded state, ie without performing an edge rounding after separation in the wire saw.
- This disk may consist of a polycrystalline or a monocrystalline material such as GaAs or InP.
- the invention has been described so that either the saw bar or a stop surface for holding the workpiece with a known saw bar in the wire saw is provided so that the contact surface between the saw bar and the workpiece in the installed state exclusively or at least for the most part on one side which lies through the center longitudinal axis M of the workpiece and a solder on the portion of the wire through which the workpiece is moved, spanned plane.
- the invention has been described so that the shape of the workpiece is a cylinder.
- the shape of the workpiece is not limited to this form.
- the workpiece can have any other cross-sectional area.
- the feed mechanism has been described in the embodiments of the invention as being perpendicular to the wire plane.
- the feed direction may be a different direction as long as it has a component perpendicular to the wire plane.
- the direction of the longitudinal axis of the wire may change during the separation process relative to the saw bar, as long as the entry-side piercing point of the wire is on the surface of the workpiece and thereby does not migrate to the O- surface of the saw bar.
- separation operation first in rocking mode and in the final phase without rocking with fixed alignment of the wire relative to the saw bar perform.
- Another possibility is to coordinate the periodic rocking movement and the change in the sense of direction of the movement of the wire along its longitudinal axis so that during the time during which one of the two puncture points lies on the workpiece and at the same time the other puncture point on the saw bar, the puncture point on the workpiece is always on the inlet side.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2004/014108 WO2006061043A1 (en) | 2004-12-10 | 2004-12-10 | Workpiece holder and method for wire sawing |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1819473A1 true EP1819473A1 (en) | 2007-08-22 |
Family
ID=34959411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04822533A Ceased EP1819473A1 (en) | 2004-12-10 | 2004-12-10 | Workpiece holder and method for wire sawing |
Country Status (4)
Country | Link |
---|---|
US (2) | US8061345B2 (en) |
EP (1) | EP1819473A1 (en) |
JP (1) | JP4874262B2 (en) |
WO (1) | WO2006061043A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006032432B3 (en) | 2006-07-13 | 2007-09-27 | Siltronic Ag | Saw member for use in combustion engines provides improved power control |
JP5475772B2 (en) * | 2008-07-11 | 2014-04-16 | サンーゴバン アブレイシブズ,インコーポレイティド | Wire slicing system |
DE102010010886A1 (en) * | 2010-03-10 | 2011-09-15 | Siltronic Ag | Process for processing a semiconductor wafer |
DE102013200467A1 (en) | 2013-01-15 | 2014-07-17 | Siltronic Ag | Clampable putty for a wire sawing process |
Family Cites Families (41)
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US3032026A (en) | 1959-07-18 | 1962-05-01 | Bosch Gmbh Robert | Device for slicing semiconductor crystals and the like |
US4105012A (en) | 1975-08-20 | 1978-08-08 | Siemens Aktiengesellschaft | Apparatus for cutting up hard and brittle material |
US4160439A (en) * | 1975-11-07 | 1979-07-10 | Sotarem S.A. | Cutting-off machine for hard bodies |
US4281827A (en) | 1979-10-29 | 1981-08-04 | Horwath Gary W | Miter boxes |
JPS5775765A (en) * | 1980-10-30 | 1982-05-12 | Toshiba Corp | Cutting method for wire made of hard fragil member |
US4766875A (en) * | 1982-11-22 | 1988-08-30 | Stanford University | Endless wire saw having material recovery capability |
JPH0635107B2 (en) * | 1987-12-26 | 1994-05-11 | 株式会社タカトリハイテック | Wire saw |
JP2673544B2 (en) * | 1988-06-14 | 1997-11-05 | 株式会社日平トヤマ | Cutting method for brittle materials |
JP2765307B2 (en) * | 1991-10-03 | 1998-06-11 | 住友金属工業株式会社 | Cutting method with multi-wire saw |
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JPH07205141A (en) * | 1994-01-10 | 1995-08-08 | Tokyo Seimitsu Co Ltd | Method and apparatus for cutting wafer by wire saw |
US6067976A (en) * | 1994-01-10 | 2000-05-30 | Tokyo Seimitsu Co., Ltd. | Wafer cut method with wire saw apparatus and apparatus thereof |
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JPH07314436A (en) * | 1994-05-19 | 1995-12-05 | M Setetsuku Kk | Wire saw device |
EP0738572B1 (en) | 1995-04-22 | 2004-01-21 | HCT Shaping Systems SA | Method for orienting monocrystals for cutting in a cutting machine and device for performing the method |
DE19519460A1 (en) * | 1995-05-26 | 1996-11-28 | Wacker Siltronic Halbleitermat | Wire saw and method for cutting slices from a workpiece |
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JPH0985736A (en) * | 1995-09-22 | 1997-03-31 | Toray Eng Co Ltd | Wire type cutting device |
JPH09286021A (en) * | 1996-04-22 | 1997-11-04 | Komatsu Electron Metals Co Ltd | Cutting method of semiconductor ingot |
CH690907A5 (en) * | 1996-05-23 | 2001-02-28 | Hct Shaping Systems Sa | Wire sawing device |
WO1998000273A1 (en) * | 1996-06-28 | 1998-01-08 | Crystal Systems, Inc. | Method and apparatus to produce a radial cut profile |
JP3810170B2 (en) | 1997-01-29 | 2006-08-16 | 信越半導体株式会社 | Method of cutting workpiece with wire saw and wire saw |
JP3672146B2 (en) * | 1997-03-27 | 2005-07-13 | 三菱住友シリコン株式会社 | Wire saw and ingot cutting method |
EP0980303B1 (en) * | 1997-05-07 | 2002-09-18 | HCT Shaping Systems SA | Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers |
JPH10321564A (en) | 1997-05-20 | 1998-12-04 | Tokyo Seimitsu Co Ltd | Wafer recovery device |
DE19739965A1 (en) | 1997-09-11 | 1999-03-18 | Wacker Siltronic Halbleitermat | Saw bar for fixing a crystal and method for cutting off disks |
JPH11188602A (en) * | 1997-12-22 | 1999-07-13 | Tokyo Seimitsu Co Ltd | Endless wire saw with fixed abrasive grains |
JPH11262917A (en) * | 1998-03-18 | 1999-09-28 | Shin Etsu Handotai Co Ltd | Slicing method of semiconductor single crystal ingot |
US6270604B1 (en) * | 1998-07-23 | 2001-08-07 | Molecular Optoelectronics Corporation | Method for fabricating an optical waveguide |
JP3314921B2 (en) * | 1999-06-08 | 2002-08-19 | 三菱住友シリコン株式会社 | Cutting and processing methods for semiconductor materials |
DE19959414A1 (en) * | 1999-12-09 | 2001-06-21 | Wacker Chemie Gmbh | Device for simultaneously separating number of discs from workpiece has framesaw with number of individual wires and device for holding workpiece and turning it about longitudinal axis |
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US7114423B2 (en) | 2003-05-13 | 2006-10-03 | Kelley Donald R | Pipe notcher |
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KR20070004073A (en) * | 2004-03-30 | 2007-01-05 | 솔라익스 인코퍼레이티드 | Method and apparatus for cutting ultra thin silicon wafers |
US8205534B2 (en) | 2006-06-30 | 2012-06-26 | Nagasaki University | Cutting methods and cutting apparatus |
-
2004
- 2004-12-10 WO PCT/EP2004/014108 patent/WO2006061043A1/en active Application Filing
- 2004-12-10 EP EP04822533A patent/EP1819473A1/en not_active Ceased
- 2004-12-10 JP JP2007544743A patent/JP4874262B2/en active Active
-
2006
- 2006-02-01 US US11/344,540 patent/US8061345B2/en active Active
-
2008
- 2008-11-12 US US12/269,738 patent/US20090064982A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO2006061043A1 * |
Also Published As
Publication number | Publication date |
---|---|
US8061345B2 (en) | 2011-11-22 |
US20090064982A1 (en) | 2009-03-12 |
JP2008522838A (en) | 2008-07-03 |
US20060243265A1 (en) | 2006-11-02 |
WO2006061043A1 (en) | 2006-06-15 |
JP4874262B2 (en) | 2012-02-15 |
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