CN211415813U - Wire cutting device - Google Patents
Wire cutting device Download PDFInfo
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- CN211415813U CN211415813U CN201921710118.8U CN201921710118U CN211415813U CN 211415813 U CN211415813 U CN 211415813U CN 201921710118 U CN201921710118 U CN 201921710118U CN 211415813 U CN211415813 U CN 211415813U
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- crystal bar
- rotating assembly
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- wire cutting
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Abstract
A wire cutting apparatus, comprising: fixed part and cutting part, fixed part include the support, one side of support is fixed with rotating assembly, synchronous rotating assembly, two vacuum locking Assembly, rotating assembly is driven by electric power rotatory, synchronous rotating part is synchronous rotation under rotating assembly's drive, synchronous rotating assembly and rotating assembly are connected with a vacuum locking Assembly respectively, two vacuum locking Assembly are used for the both ends face vacuum centre gripping to the crystal bar, cutting part include line of cut and at least two line rollers pass through rotating assembly and drive fixed crystal bar and carry out the rotation cutting, area between few crystal bar and the line of cut when can reducing the cutting promotes cutting rate.
Description
Technical Field
A wire cutting device can be applied to a multi-wire cutting device of a large-size sapphire substrate material of an LED.
Background
In the prior art, a linear cutting process is mostly adopted for processing sapphire, during processing, the sapphire is sliced through a cutting line moving at a high speed, before slicing, a sapphire crystal bar needs to be adhered to a workbench, and in order to guarantee the slicing quality, when the sapphire crystal bar is adhered to the workbench, the crystal orientation precision related to the sapphire crystal bar needs to be guaranteed. The traditional sapphire is directly adhered to a workbench, and whether the crystal orientation angle meets the specification on the workbench is judged only through visual inspection by an operator, so that a sapphire crystal bar cannot be accurately positioned; and stick sticking is inefficient.
The wire cutting technology is that a metal wire is wound on a wire wheel, and two ends of the wire are respectively controlled by a wire releasing mechanism and a wire collecting mechanism, so that the wire wheel can rotate forwards or reversely to realize the reciprocating motion of a wire net. In the process, the grinding material is brought into a processing area to be rubbed with the wire and the material to be processed at a high speed, so that the processed piece can obtain better output and quality.
The conventional wire cutting mechanism is usually fixed to a dovetail base by a crystal bar, and the crystal orientation angle is positioned on an orientation device, and then the crystal bar is placed on an inner working table of a wire cutting machine to perform a cutting process. The mechanism is carried out in a mode that the workbench moves up and down and is matched with a swinging mode, or is carried out in a mode that the grooved wheel swings, the swinging angle is about 5-10 degrees, and each period is 5-8 seconds and other relevant process parameters.
The crystal bar is usually round, and if the crystal bar is cut in a fixed mode during cutting, parameters are set in a segmented mode according to different lines and crystal bar contact surfaces; when the wafer contacts the middle of the wafer (with the largest diameter), heat dissipation and chip removal are not easy, so that the wafer is not good in appearance after cutting. And because the fixed mode cutting of crystal bar can cause the wafer to bend and warp degree value to be large because of setting up the parameter by stage, and can produce specific topography, such as saddle type or asymmetric topography, cause the difficulty on the subsequent grinding technology operation, this phenomenon can be more obvious when the wafer size is more than 6 inches.
SUMMERY OF THE UTILITY MODEL
The utility model provides a following wire cutting device, it includes: fixed part and cutting part, fixed part include the support, one side of support is fixed with rotating assembly, synchronous rotating assembly, two vacuum locking subassemblies, rotating assembly is rotatory, synchronous rotating assembly is synchronous rotation under rotating assembly's drive by electric power, synchronous rotating assembly and rotating assembly are connected with a vacuum locking subassembly respectively, two vacuum locking subassemblies are used for the vacuum centre gripping of both ends face to the crystal bar, cutting part include line of cut and two at least line rollers.
Preferably, the cutting line is fixed by two line rollers, and the extending direction of the line is perpendicular to the axial direction of the ingot.
Preferably, the support is fixed above the cutting part and comprises a lifting control device for controlling the support to lift so as to realize the lifting or descending of the crystal bar.
Preferably, the support is fixed below the cutting part and comprises a lifting control device for controlling the lifting of the cutting part so as to realize the lifting or descending of the crystal bar.
Preferably, the rotating assembly comprises a connecting rod, the synchronous locking assembly comprises an ejector rod, one end of the connecting rod and one end of the ejector rod are respectively connected with a vacuum locking assembly, the other end of the ejector rod comprises a spiral handle and a spiral lead screw, the connecting rod is driven to rotate by electric power, and the ejector rod and the crystal bar are driven to synchronously rotate by the connecting rod.
Preferably, the support comprises a crystal bar angle adjusting guide rail, and the synchronous rotating assembly is arranged to be horizontally movable along the track of the crystal bar angle adjusting guide rail so as to adjust the crystal orientation angle.
Preferably, the support is fixed below the cutting part and comprises a lifting control device, and the lifting control device controls the support to lift so as to realize that the crystal bar descends and simultaneously the rotating assembly drives the crystal bar to rotate.
Preferably, the cutting part further comprises a wire breakage detecting device.
Preferably, the wire cutting device further comprises a cooling liquid spraying device.
Preferably, the wire cutting device further comprises a device for orienting the crystal orientation of the crystal bar.
Preferably, the means for orienting the wire cutting apparatus comprises a light emitter and a light receiving detector.
Preferably, one end of the wire is connected to the tension arm guide wheel.
Preferably, the disconnection detecting means includes a current rod.
The utility model discloses possess following beneficial effect:
1. the crystal bar is fixed by adopting vacuum adsorption, so that the loss of the wafer caused by extrusion after the cutting is finished can be effectively prevented;
2. the crystal bar angle detection device in the crystal bar fixing area can fix the angle of the crystal bar before cutting, so that the abnormal angle of the wafer is prevented;
3. a broken wire detection device such as a current rod is added to detect a broken wire signal, the broken wire detection rod passes current, and short circuit alarm can be realized when the broken wire is firstly put on, so that the phenomenon that a metal wire is easily broken off a grooved pulley or a guide pulley when abnormity occurs to cause loss is prevented;
4. a cooling liquid spraying device is added above the grooved wheel, and a spraying part sprays cutting liquid in the cutting process, so that the cooling and chip removal effects are achieved, and the influence of wafer deformation caused by high temperature in high-speed cutting on the cutting quality is prevented;
5. the cutting is more stable by adopting double-line roller transmission;
6. the wire distribution mode of the tension arm guide wheel is provided, and the cutting operation can be carried out on different lengths of crystal bars.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. Furthermore, the drawing figures are for a descriptive summary and are not drawn to scale.
FIG. 1 is a detailed embodiment of a wire cutting apparatus;
FIG. 2 is a schematic diagram of an embodiment in line cut form;
FIG. 3 is a graph of line cut location versus material removal rate for an embodiment;
FIG. 4 is a schematic view of a conventional line cut;
fig. 5 is a linear relationship between a line cutting position and a material cutting rate in the conventional line cutting method.
The reference numerals in the figures are indicated below:
1: a support; 2: a rotating assembly; 3: a synchronous rotation assembly; 4: the angle of the crystal bar is adjusted to form a movable guide rail; 5: a vacuum lock assembly; 6: a light emitter; 7: an optical receiver; 8: a locking assembly; 9: a wire roller; 10: cutting a line; 11: a guide wheel; 12: a guide wheel movable guide rail; 13: crystal bar; 14: a coolant spraying device.
Detailed Description
The wire cutting device of the present invention will be described in detail with reference to the accompanying drawings, and therefore, it is to be understood how to apply the technical means to solve the technical problems, and the implementation process to achieve the technical effects can be fully understood and implemented. It should be noted that, as long as no conflict is formed, the embodiments and the features in the embodiments of the present invention may be combined with each other, and the technical solutions formed are all within the scope of the present invention.
Example one
As shown in fig. 1, the present embodiment provides a wire saw device, which can be applied to a wire cutting process of a sapphire ingot or other single crystal ingot to obtain a wafer with a certain thickness. The wire cutting device comprises a fixing part and a cutting part, wherein the fixing part is provided with a support 1 and a support 1, a rotating component 2, a synchronous rotating component 3 and two vacuum locking components 5 are fixed below the support, the rotating component 2 comprises a component which is driven by electric power to rotate and at least comprises a motor (not shown in the figure) and a connecting rod, one end of the connecting rod is driven to rotate by the motor, and the motor drives the connecting rod to rotate by a belt. And a vacuum locking assembly 5 is fixed at the other end of the connecting rod, and the vacuum locking assembly 5 is used for fixing one end of the crystal bar.
The synchronous rotating component 3 at least comprises a push rod capable of movably rotating, and one end of the push rod is connected with another vacuum locking component for fixing the other end of the crystal bar 5. The motor drives the connecting rod to rotate, and simultaneously the crystal bar and the ejector rod also synchronously rotate.
The vacuum locking assembly 5 at least comprises a vacuum suction device and a vacuum suction valve, the vacuum suction valve is in contact with the end face of the crystal bar, the vacuum suction valve can be sucked by the vacuum suction device to form vacuum, and the vacuum generates a negative pressure to act on the end face of the crystal bar to horizontally support the two end faces of the crystal bar. The two end faces of the crystal bar are clamped between two vacuum locking assemblies 5. Under the drive of the rotating assembly, the crystal bar and the synchronous rotating assembly can synchronously rotate.
The support 1 is a liftable platform, and the support 1 of the embodiment is fixed above the cutting part and comprises a lifting control device (not shown in the figure) for controlling the support to lift so as to realize synchronous lifting or descending of the crystal bar.
Or as an alternative embodiment, wherein the bracket 1 is fixed below the cutting part, a lifting control device is included to control the lifting of the cutting part.
The other end of the ejector rod is connected with a locking assembly 8, the locking assembly 8 comprises a spiral lead screw and a spiral handle, and the locking assembly 8 is rotated to move the ejector rod to drive the vacuum locking assembly to abut against one end of the crystal bar.
The wire cutting device also comprises a crystal bar orientation device. The means for orienting the ingot comprises a light emitter 6 and a light receiving detector 7. The surface of the crystal bar is provided with a fixed detection crystal face, when the detection crystal face of the crystal bar is aligned with the light emitter or aligned at an angle, the light is emitted to the detection crystal face of the crystal bar and a diffraction signal is sent out, and the diffraction signal is received and detected to judge whether the position of the crystal bar is fixed accurately. The light source is preferably a laser.
The support 1 can also include a crystal bar angle adjustment guide rail 4, the synchronous rotation component 3 is set to move along the track of the crystal bar angle adjustment guide rail 4 to a proper position, specifically, the synchronous rotation component 3 includes a pulley or a gear and other components connected on the crystal bar angle adjustment guide rail 4, the angle of the crystal bar can be effectively adjusted by adjusting the horizontal movement of the synchronous rotation component 3 along the crystal bar position adjustment guide rail 4, and therefore the detection crystal face of the crystal bar is adjusted to be aligned with the light emitter 6.
Preferably, the crystal bar angle adjusting guide rail is arc-shaped.
The cutting section comprises at least two wire rollers 9 and a cutting wire 10.
As shown in fig. 1, the cutting line 10 of the cutting part may be a diamond line, the cutting line 10 is wound on two line rollers 9 in parallel and at a certain interval to form a line net, and the extending direction of the cutting line 10 is perpendicular to the axial direction of the ingot 13. Two ends of the cutting wire 10 are respectively connected with a guide wheel 11, the guide wheel 11 is connected on a guide wheel movable guide rail 12 through a tension arm, and the width of the wire mesh can be adjusted through the sliding position of the guide wheel 11 on the guide wheel movable guide rail 12.
Wherein the wire roller 9 is connected with another motor (not shown in the figure), the wire roller 9 is driven by the other motor to rotate, and the cutting wire 10 is driven to move towards the parallel direction.
Example two
As a modification of the first embodiment, the cutting portion further comprises a wire breakage detecting device, such as a current bar (not shown). The current rod is connected with the cutting line to detect a wire breakage signal, the wire breakage detection rod allows current to pass through, the metal wire is hit on the current rod after the wire breakage to cause a ground short circuit, the electric signal can be sent to the central control computer to send an alarm stop instruction, and the metal wire is prevented from easily breaking the grooved pulley or the guide pulley when an abnormality occurs to cause loss.
EXAMPLE III
As a modification of the first or second embodiment, as shown in fig. 1, the wire cutting apparatus further includes a cooling liquid spraying device 14, and the spraying device sprays cutting liquid onto the cutting wires 10 during cutting to perform cooling and chip removal functions, so as to prevent the wafer deformation caused by high temperature during high-speed cutting from affecting the cutting quality.
Example four
The utility model discloses the process of device wire-electrode cutting sapphire crystal bar is described below with the accompanying drawing:
1. fixing a crystal bar: the crystal bar is a sapphire crystal bar, firstly, the fixed center position of the crystal bar is determined through measuring by a graduated scale, one end of the center position of the crystal bar is fixed on the vacuum locking assembly at one end of the connecting rod, then, the spiral handle of the locking assembly is twisted, the vacuum locking assembly connected with one end of the ejector rod is adjusted to be close to the crystal bar until one end of the crystal bar is propped against, and the vacuum suction device of the vacuum locking assembly is started to enable two ends of the crystal bar to be vacuum-adsorbed by the vacuum suction valve.
2. Adjusting the cutting angle of the crystal bar: according to the laser emission, diffraction and the angle signal obtained at the laser receiving position, the synchronous rotating component adjusts the crystal face angle of the crystal bar through the horizontal movement of the crystal bar angle adjusting movable guide rail, and the required crystal bar cutting angle is adjusted.
3. Adjusting the length of the wire mesh: according to the length of the crystal bar, the movable guide rail of the guide wheel is adjusted, the position of the guide wheel is adjusted, the length of the wire mesh is confirmed, cutting to the fixed part is prevented, the horizontal position and the vertical position of the wire mesh corresponding to the crystal bar are determined, and the angle deviation of the wafer after cutting is avoided. And starting the current rod and detecting a wire breaking signal.
4. Starting a motor, driving the two synchronous rotating assemblies by the rotating assembly, driving the crystal bar to rotate, starting the lifting device, enabling the support to descend to be in contact with the cutting line, starting a cutting process, and keeping the crystal bar to descend at a certain speed in the cutting process. The cutting line is stably transmitted to the cutting chamber through the tension arm and the guide wheel, the distribution line width of the grooved wheels is stable, and the thickness of the cut wafer is determined by the distance between the grooved wheels. And the prepared cutting cooling liquid flows out from the mortar nozzle in the cutting process to bring out heat energy generated in the cutting process and cutting scraps.
5. And when the wafer is cut to the center of the crystal bar by 5 mm, the crystal bar is stopped to rotate, and the crystal bar is cut off under the action of the lifting platform, so that the wafer is prevented from being thrown away under the action of inertia.
The utility model discloses following technological effect can be reached:
1. the crystal bar is fixed by adopting vacuum adsorption, so that loss of the wafer caused by extrusion can be effectively prevented, the rotating part is driven by the motor to drive the crystal to rotate and move from top to bottom, and the rotating motion of the crystal bar is matched with the relative motion of the diamond wire; as shown in the schematic diagram of the linear cutting mode of this embodiment shown in fig. 2 and the linear relationship diagram of the linear cutting position and the material removal rate shown in fig. 3, it can be seen that the cutting line and the ingot are always in a point-tangent mode, the cutting speed is increased by cutting the ingot, and the method effectively increases the cutting speed by 70%. Fig. 4 shows a conventional wire cutting method and fig. 5 shows a linear relationship between a conventional wire cutting position and a material removal rate.
2. And the cutting is more stable by adopting double-line roller transmission.
3. The wire distribution mode of the tension arm guide wheel is provided, and the cutting operation can be carried out on different lengths of crystal bars.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. A wire cutting apparatus, comprising: fixed part and cutting part, fixed part include the support, one side of support is fixed with rotating assembly, synchronous rotating assembly, rotating assembly is rotatory, synchronous rotating assembly is synchronous rotation under rotating assembly's drive by electric power drive, cutting part include line of cut and two at least line rollers, its characterized in that: and one side of the bracket is also fixedly provided with two vacuum locking assemblies, the synchronous rotating assembly and the rotating assembly are respectively connected with one vacuum locking assembly, and the two vacuum locking assemblies are used for vacuum clamping two end faces of the crystal bar.
2. The wire cutting device according to claim 1, wherein: the cutting line is fixed by two line rollers, and the extending direction of the line is vertical to the axial direction of the crystal bar.
3. The wire cutting device according to claim 1, wherein: the support is fixed above the cutting part and comprises a lifting control device which controls the support to lift so as to realize the rising or falling of the crystal bar.
4. The wire cutting device according to claim 1, wherein: the support is fixed below the cutting part and comprises a lifting control device which controls the cutting part to lift so as to realize the rising or falling of the crystal bar.
5. The wire cutting device according to claim 1, wherein: the rotating assembly comprises a connecting rod, the synchronous rotating assembly comprises an ejector rod, one end of the connecting rod and one end of the ejector rod are respectively connected with a vacuum locking assembly, the other end of the ejector rod comprises a spiral handle and a spiral lead screw, the connecting rod is driven to rotate by electric power, and the ejector rod and the crystal bar are driven to synchronously rotate by the connecting rod.
6. The wire cutting device according to claim 1, wherein: the support comprises a crystal bar angle adjusting guide rail, and the synchronous rotating assembly is arranged to horizontally move along the track of the crystal bar angle adjusting guide rail so as to adjust the crystal orientation angle.
7. The wire cutting device according to claim 1, wherein: the support is fixed below the cutting part and comprises a lifting control device, and the rotating assembly drives the crystal bar to rotate while the support is controlled to lift so as to realize the descending of the crystal bar.
8. The wire cutting device according to claim 1, wherein: the cutting part also comprises a broken wire detection device.
9. The wire cutting device according to claim 1, wherein: wherein the wire cutting device also comprises a cooling liquid spraying device.
10. The wire cutting device according to claim 1, wherein: wherein the wire cutting device also comprises a device for orienting the crystal orientation of the crystal bar.
11. The wire cutting device according to claim 10, wherein: the device for orienting the wire cutting device comprises a light emitter and a light receiving detector.
12. The wire cutting device according to claim 1, wherein: one end of the cutting wire is connected to the tension arm guide wheel.
13. The wire cutting device according to claim 8, wherein: the broken wire detection device comprises a current rod.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019211032409 | 2019-07-15 | ||
| CN201921103240 | 2019-07-15 |
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| Publication Number | Publication Date |
|---|---|
| CN211415813U true CN211415813U (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921710118.8U Active CN211415813U (en) | 2019-07-15 | 2019-10-14 | Wire cutting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112140375A (en) * | 2020-09-28 | 2020-12-29 | 中电化合物半导体有限公司 | Multi-wire cutting system and method for silicon carbide wafer |
| CN112936627A (en) * | 2021-02-01 | 2021-06-11 | 西安奕斯伟硅片技术有限公司 | Method and device for multi-wire cutting of crystal bar |
-
2019
- 2019-10-14 CN CN201921710118.8U patent/CN211415813U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112140375A (en) * | 2020-09-28 | 2020-12-29 | 中电化合物半导体有限公司 | Multi-wire cutting system and method for silicon carbide wafer |
| CN112936627A (en) * | 2021-02-01 | 2021-06-11 | 西安奕斯伟硅片技术有限公司 | Method and device for multi-wire cutting of crystal bar |
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