JPS6225889Y2 - - Google Patents
Info
- Publication number
- JPS6225889Y2 JPS6225889Y2 JP11437282U JP11437282U JPS6225889Y2 JP S6225889 Y2 JPS6225889 Y2 JP S6225889Y2 JP 11437282 U JP11437282 U JP 11437282U JP 11437282 U JP11437282 U JP 11437282U JP S6225889 Y2 JPS6225889 Y2 JP S6225889Y2
- Authority
- JP
- Japan
- Prior art keywords
- defective
- wire
- bonding
- semiconductor
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002950 deficient Effects 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 22
- 238000005259 measurement Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 17
- 239000000523 sample Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437282U JPS5918432U (ja) | 1982-07-27 | 1982-07-27 | 半導体素子特性測定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437282U JPS5918432U (ja) | 1982-07-27 | 1982-07-27 | 半導体素子特性測定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918432U JPS5918432U (ja) | 1984-02-04 |
| JPS6225889Y2 true JPS6225889Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-02 |
Family
ID=30264407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11437282U Granted JPS5918432U (ja) | 1982-07-27 | 1982-07-27 | 半導体素子特性測定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918432U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-07-27 JP JP11437282U patent/JPS5918432U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5918432U (ja) | 1984-02-04 |