JPS62250671A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS62250671A JPS62250671A JP9325086A JP9325086A JPS62250671A JP S62250671 A JPS62250671 A JP S62250671A JP 9325086 A JP9325086 A JP 9325086A JP 9325086 A JP9325086 A JP 9325086A JP S62250671 A JPS62250671 A JP S62250671A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- region
- gate electrode
- island
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000012535 impurity Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 18
- 230000005855 radiation Effects 0.000 abstract description 14
- 230000003071 parasitic effect Effects 0.000 abstract description 8
- 238000010276 construction Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- BJZRPPPHLTTXMO-UHFFFAOYSA-N 3-oxoprop-2-enal Chemical compound O=CC=C=O BJZRPPPHLTTXMO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9325086A JPS62250671A (ja) | 1986-04-24 | 1986-04-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9325086A JPS62250671A (ja) | 1986-04-24 | 1986-04-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62250671A true JPS62250671A (ja) | 1987-10-31 |
JPH0575187B2 JPH0575187B2 (enrdf_load_stackoverflow) | 1993-10-20 |
Family
ID=14077258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9325086A Granted JPS62250671A (ja) | 1986-04-24 | 1986-04-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62250671A (enrdf_load_stackoverflow) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228174A (ja) * | 1988-03-08 | 1989-09-12 | Nec Corp | 半導体装置 |
JPH01293667A (ja) * | 1988-05-23 | 1989-11-27 | Nec Corp | Mos電界効果トランジスタ |
US5144394A (en) * | 1989-09-01 | 1992-09-01 | Hitachi, Ltd. | Semiconductor device and method for fabricating same |
US5192993A (en) * | 1988-09-27 | 1993-03-09 | Kabushiki Kaisha Toshiba | Semiconductor device having improved element isolation area |
JPH07106571A (ja) * | 1993-10-08 | 1995-04-21 | Nec Corp | 半導体装置 |
JP2007523481A (ja) * | 2004-02-17 | 2007-08-16 | シリコン・スペース・テクノロジー・コーポレイション | 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法 |
WO2007108104A1 (ja) * | 2006-03-20 | 2007-09-27 | Fujitsu Limited | 半導体装置及びその製造方法 |
US8252642B2 (en) | 2005-10-14 | 2012-08-28 | Silicon Space Technology Corp. | Fabrication methods for radiation hardened isolation structures |
CN108231883A (zh) * | 2016-12-15 | 2018-06-29 | 财团法人工业技术研究院 | 晶体管装置 |
US10038058B2 (en) | 2016-05-07 | 2018-07-31 | Silicon Space Technology Corporation | FinFET device structure and method for forming same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154570A (ja) * | 1984-01-24 | 1985-08-14 | Nec Corp | 耐放射線性の強化された半導体装置 |
-
1986
- 1986-04-24 JP JP9325086A patent/JPS62250671A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60154570A (ja) * | 1984-01-24 | 1985-08-14 | Nec Corp | 耐放射線性の強化された半導体装置 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228174A (ja) * | 1988-03-08 | 1989-09-12 | Nec Corp | 半導体装置 |
JPH01293667A (ja) * | 1988-05-23 | 1989-11-27 | Nec Corp | Mos電界効果トランジスタ |
US5192993A (en) * | 1988-09-27 | 1993-03-09 | Kabushiki Kaisha Toshiba | Semiconductor device having improved element isolation area |
US5144394A (en) * | 1989-09-01 | 1992-09-01 | Hitachi, Ltd. | Semiconductor device and method for fabricating same |
JPH07106571A (ja) * | 1993-10-08 | 1995-04-21 | Nec Corp | 半導体装置 |
US5498894A (en) * | 1993-10-08 | 1996-03-12 | Nec Corporation | Semiconductor device |
US8093145B2 (en) | 2004-02-17 | 2012-01-10 | Silicon Space Technology Corp. | Methods for operating and fabricating a semiconductor device having a buried guard ring structure |
JP2007523481A (ja) * | 2004-02-17 | 2007-08-16 | シリコン・スペース・テクノロジー・コーポレイション | 埋め込みガードリング及び耐放射線性分離構造並びにその製造方法 |
US8497195B2 (en) | 2004-02-17 | 2013-07-30 | Silicon Space Technology Corporation | Method for radiation hardening a semiconductor device |
US8729640B2 (en) | 2004-02-17 | 2014-05-20 | Silicon Space Technology Corporation | Method and structure for radiation hardening a semiconductor device |
US8252642B2 (en) | 2005-10-14 | 2012-08-28 | Silicon Space Technology Corp. | Fabrication methods for radiation hardened isolation structures |
US8278719B2 (en) | 2005-10-14 | 2012-10-02 | Silicon Space Technology Corp. | Radiation hardened isolation structures and fabrication methods |
WO2007108104A1 (ja) * | 2006-03-20 | 2007-09-27 | Fujitsu Limited | 半導体装置及びその製造方法 |
US10038058B2 (en) | 2016-05-07 | 2018-07-31 | Silicon Space Technology Corporation | FinFET device structure and method for forming same |
US10615260B1 (en) | 2016-05-07 | 2020-04-07 | Silicon Space Technology Corporation | Method for forming FinFET device structure |
CN108231883A (zh) * | 2016-12-15 | 2018-06-29 | 财团法人工业技术研究院 | 晶体管装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0575187B2 (enrdf_load_stackoverflow) | 1993-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |