JPS62230967A - 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法 - Google Patents
光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法Info
- Publication number
- JPS62230967A JPS62230967A JP7405186A JP7405186A JPS62230967A JP S62230967 A JPS62230967 A JP S62230967A JP 7405186 A JP7405186 A JP 7405186A JP 7405186 A JP7405186 A JP 7405186A JP S62230967 A JPS62230967 A JP S62230967A
- Authority
- JP
- Japan
- Prior art keywords
- target
- powder
- container
- sputtering
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 38
- 238000004544 sputter deposition Methods 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 238000009792 diffusion process Methods 0.000 claims abstract description 7
- 239000013077 target material Substances 0.000 claims description 16
- 238000011069 regeneration method Methods 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims 1
- 238000005242 forging Methods 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 description 15
- 229910001220 stainless steel Inorganic materials 0.000 description 15
- 230000005291 magnetic effect Effects 0.000 description 12
- 230000004907 flux Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011812 mixed powder Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000001172 regenerating effect Effects 0.000 description 3
- 241000252233 Cyprinus carpio Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- GQPLMRYTRLFLPF-UHFFFAOYSA-N nitrous oxide Inorganic materials [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405186A JPS62230967A (ja) | 1986-03-31 | 1986-03-31 | 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405186A JPS62230967A (ja) | 1986-03-31 | 1986-03-31 | 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62230967A true JPS62230967A (ja) | 1987-10-09 |
| JPH0354189B2 JPH0354189B2 (fr) | 1991-08-19 |
Family
ID=13535999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7405186A Granted JPS62230967A (ja) | 1986-03-31 | 1986-03-31 | 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62230967A (fr) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003025244A2 (fr) * | 2001-09-17 | 2003-03-27 | Heraeus, Inc. | Remise a neuf des cibles de pulverisation |
| EP2087144A1 (fr) * | 2007-07-17 | 2009-08-12 | Williams Advanced Materials Inc. | Procédé de remise en état d'une cible de pulvérisation cathodique |
| CN102747329A (zh) * | 2011-04-20 | 2012-10-24 | 光洋应用材料科技股份有限公司 | 再生溅镀靶材及其制作方法 |
| JP2013001971A (ja) * | 2011-06-17 | 2013-01-07 | Solar Applied Materials Technology Corp | 再製スパッタリングターゲット及びその製造方法 |
| US8460602B2 (en) | 2008-12-26 | 2013-06-11 | Tanaka Holdings Co., Ltd | Method for producing regenerated target |
| US8961867B2 (en) | 2008-09-09 | 2015-02-24 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
| JP2015120974A (ja) * | 2013-11-25 | 2015-07-02 | 株式会社フルヤ金属 | スパッタリングターゲットの再生方法及び再生スパッタリングターゲット |
| US9095932B2 (en) | 2006-12-13 | 2015-08-04 | H.C. Starck Inc. | Methods of joining metallic protective layers |
| US9108273B2 (en) | 2011-09-29 | 2015-08-18 | H.C. Starck Inc. | Methods of manufacturing large-area sputtering targets using interlocking joints |
| US9783882B2 (en) | 2007-05-04 | 2017-10-10 | H.C. Starck Inc. | Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom |
| CN114477992A (zh) * | 2022-01-18 | 2022-05-13 | 宁波江丰热等静压技术有限公司 | 一种溅射后氧化铟锡靶材的再生方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043404A (ja) * | 1983-08-16 | 1985-03-08 | Mitsubishi Metal Corp | 超硬合金製リング状部材の再生方法 |
-
1986
- 1986-03-31 JP JP7405186A patent/JPS62230967A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043404A (ja) * | 1983-08-16 | 1985-03-08 | Mitsubishi Metal Corp | 超硬合金製リング状部材の再生方法 |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003025244A2 (fr) * | 2001-09-17 | 2003-03-27 | Heraeus, Inc. | Remise a neuf des cibles de pulverisation |
| WO2003025244A3 (fr) * | 2001-09-17 | 2004-10-14 | Heraeus Inc | Remise a neuf des cibles de pulverisation |
| KR100617402B1 (ko) * | 2001-09-17 | 2006-09-01 | 헤래우스 인코포레이티드 | 사용된 스퍼터링 타깃을 보수하는 방법 및 보수된 스퍼터타깃 |
| US7175802B2 (en) | 2001-09-17 | 2007-02-13 | Heraeus, Inc. | Refurbishing spent sputtering targets |
| US9095932B2 (en) | 2006-12-13 | 2015-08-04 | H.C. Starck Inc. | Methods of joining metallic protective layers |
| US9783882B2 (en) | 2007-05-04 | 2017-10-10 | H.C. Starck Inc. | Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom |
| EP2087144A1 (fr) * | 2007-07-17 | 2009-08-12 | Williams Advanced Materials Inc. | Procédé de remise en état d'une cible de pulvérisation cathodique |
| JP2010514921A (ja) * | 2007-07-17 | 2010-05-06 | ウィリアムズ アドバンスト マテリアルズ インコーポレイティド | スパッタリングターゲット修復用の方法 |
| EP2087144A4 (fr) * | 2007-07-17 | 2011-04-13 | Williams Advanced Materials Inc | Procédé de remise en état d'une cible de pulvérisation cathodique |
| US8961867B2 (en) | 2008-09-09 | 2015-02-24 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
| US8460602B2 (en) | 2008-12-26 | 2013-06-11 | Tanaka Holdings Co., Ltd | Method for producing regenerated target |
| US8999227B2 (en) | 2008-12-26 | 2015-04-07 | Tanaka Holdings Co., Ltd | Method for producing regenerated target |
| CN102747329A (zh) * | 2011-04-20 | 2012-10-24 | 光洋应用材料科技股份有限公司 | 再生溅镀靶材及其制作方法 |
| JP2013001971A (ja) * | 2011-06-17 | 2013-01-07 | Solar Applied Materials Technology Corp | 再製スパッタリングターゲット及びその製造方法 |
| US9108273B2 (en) | 2011-09-29 | 2015-08-18 | H.C. Starck Inc. | Methods of manufacturing large-area sputtering targets using interlocking joints |
| US9120183B2 (en) | 2011-09-29 | 2015-09-01 | H.C. Starck Inc. | Methods of manufacturing large-area sputtering targets |
| US9293306B2 (en) | 2011-09-29 | 2016-03-22 | H.C. Starck, Inc. | Methods of manufacturing large-area sputtering targets using interlocking joints |
| US9412568B2 (en) | 2011-09-29 | 2016-08-09 | H.C. Starck, Inc. | Large-area sputtering targets |
| JP2015120974A (ja) * | 2013-11-25 | 2015-07-02 | 株式会社フルヤ金属 | スパッタリングターゲットの再生方法及び再生スパッタリングターゲット |
| CN114477992A (zh) * | 2022-01-18 | 2022-05-13 | 宁波江丰热等静压技术有限公司 | 一种溅射后氧化铟锡靶材的再生方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354189B2 (fr) | 1991-08-19 |
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