JPS6222559B2 - - Google Patents

Info

Publication number
JPS6222559B2
JPS6222559B2 JP56195265A JP19526581A JPS6222559B2 JP S6222559 B2 JPS6222559 B2 JP S6222559B2 JP 56195265 A JP56195265 A JP 56195265A JP 19526581 A JP19526581 A JP 19526581A JP S6222559 B2 JPS6222559 B2 JP S6222559B2
Authority
JP
Japan
Prior art keywords
mold
lead frame
light emitting
synthetic resin
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56195265A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5896785A (ja
Inventor
Ko Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP56195265A priority Critical patent/JPS5896785A/ja
Priority to US06/393,466 priority patent/US4486364A/en
Publication of JPS5896785A publication Critical patent/JPS5896785A/ja
Publication of JPS6222559B2 publication Critical patent/JPS6222559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/808—Lens mold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
JP56195265A 1981-12-04 1981-12-04 発光ダイオ−ドの合成樹脂レンズ成形方法 Granted JPS5896785A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56195265A JPS5896785A (ja) 1981-12-04 1981-12-04 発光ダイオ−ドの合成樹脂レンズ成形方法
US06/393,466 US4486364A (en) 1981-12-04 1982-06-29 Method and apparatus for molding a synthetic resin lens for a light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56195265A JPS5896785A (ja) 1981-12-04 1981-12-04 発光ダイオ−ドの合成樹脂レンズ成形方法

Publications (2)

Publication Number Publication Date
JPS5896785A JPS5896785A (ja) 1983-06-08
JPS6222559B2 true JPS6222559B2 (enExample) 1987-05-19

Family

ID=16338267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56195265A Granted JPS5896785A (ja) 1981-12-04 1981-12-04 発光ダイオ−ドの合成樹脂レンズ成形方法

Country Status (2)

Country Link
US (1) US4486364A (enExample)
JP (1) JPS5896785A (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
JPS61202015U (enExample) * 1985-06-10 1986-12-18
EP0273364B1 (en) * 1986-12-26 1992-03-25 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same
EP0424969A3 (en) * 1989-10-27 1992-08-19 Brother Kogyo Kabushiki Kaisha Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
US5595732A (en) * 1991-03-25 1997-01-21 Hoffmann-La Roche Inc. Polyethylene-protein conjugates
JP2994219B2 (ja) 1994-05-24 1999-12-27 シャープ株式会社 半導体デバイスの製造方法
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
DE19549818B4 (de) * 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
AU1307999A (en) * 1997-11-06 1999-05-31 Donnelly Corporation Light emitting element having an optical element molded in surface thereof
US6106137A (en) * 1998-02-20 2000-08-22 Lorin Industries, Inc. Reflector for automotive exterior lighting
US6670207B1 (en) * 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
RU2179295C1 (ru) * 2000-08-22 2002-02-10 Айриян Юрий Аршакович Способ наведения, устройство системы наведения, устройство ее носителя визуализируемой информации, а также устройство ее ориентации и способ изготовления элемента ее визирной части
US20050188569A1 (en) * 2001-11-23 2005-09-01 Derose Anthony Display signs and ornaments for holiday seasons
US7695166B2 (en) * 2001-11-23 2010-04-13 Derose Anthony Shaped LED light bulb
US20080084009A1 (en) * 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
US7042020B2 (en) * 2003-02-14 2006-05-09 Cree, Inc. Light emitting device incorporating a luminescent material
KR100686960B1 (ko) 2005-12-21 2007-02-26 주식회사 화이널포스트 렌즈 일체형 엘이디의 렌즈 성형 방법 및 렌즈 성형 장치
WO2007081719A2 (en) 2006-01-05 2007-07-19 Illumitex, Inc. Separate optical device for directing light from an led
TWI314790B (en) * 2006-09-13 2009-09-11 Ind Tech Res Inst Light-emitting diode packaging apparatus, mold base and supporting piece thereof
JP2010506402A (ja) 2006-10-02 2010-02-25 イルミテックス， インコーポレイテッド Ｌｅｄのシステムおよび方法
CN101939849A (zh) 2008-02-08 2011-01-05 伊鲁米特克有限公司 用于发射器层成形的系统和方法
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
CN103874882A (zh) * 2011-10-10 2014-06-18 普司科Led股份有限公司 基于光学半导体的照明设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE135425C (enExample) *
US3484536A (en) * 1967-11-29 1969-12-16 Sprague Electric Co Encapsulated component
US3805347A (en) * 1969-12-29 1974-04-23 Gen Electric Solid state lamp construction
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement
US3806766A (en) * 1972-12-27 1974-04-23 Western Electric Co Packaged electrical component assembly and method of fabrication
DE2509047C3 (de) * 1975-03-01 1980-07-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kunststoffgehäuse für eine Lumineszenzdiode
JPS53142176A (en) * 1977-05-17 1978-12-11 Nec Corp Manufacture of semiconductor device
US4188708A (en) * 1977-10-03 1980-02-19 National Semiconductor Corporation Integrated circuit package with optical input coupler
JPS5469063A (en) * 1977-11-11 1979-06-02 Omron Tateisi Electronics Co Manufacture of electronic device
US4152624A (en) * 1978-03-16 1979-05-01 Monsanto Company Molded LED indicator

Also Published As

Publication number Publication date
US4486364A (en) 1984-12-04
JPS5896785A (ja) 1983-06-08

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