JPS62225573A - 導電性ペ−スト用銅粉 - Google Patents

導電性ペ−スト用銅粉

Info

Publication number
JPS62225573A
JPS62225573A JP61069898A JP6989886A JPS62225573A JP S62225573 A JPS62225573 A JP S62225573A JP 61069898 A JP61069898 A JP 61069898A JP 6989886 A JP6989886 A JP 6989886A JP S62225573 A JPS62225573 A JP S62225573A
Authority
JP
Japan
Prior art keywords
copper powder
conductivity
conductive paste
boron
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61069898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140070B2 (en:Method
Inventor
Yukiyoshi Yoshitake
吉武　征義
Shigeru Kito
木藤　茂
Jiro Yamamoto
次郎 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Priority to JP61069898A priority Critical patent/JPS62225573A/ja
Priority to US07/029,232 priority patent/US4781980A/en
Publication of JPS62225573A publication Critical patent/JPS62225573A/ja
Publication of JPH0140070B2 publication Critical patent/JPH0140070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
JP61069898A 1986-03-28 1986-03-28 導電性ペ−スト用銅粉 Granted JPS62225573A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61069898A JPS62225573A (ja) 1986-03-28 1986-03-28 導電性ペ−スト用銅粉
US07/029,232 US4781980A (en) 1986-03-28 1987-03-23 Copper powder for use in conductive paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61069898A JPS62225573A (ja) 1986-03-28 1986-03-28 導電性ペ−スト用銅粉

Publications (2)

Publication Number Publication Date
JPS62225573A true JPS62225573A (ja) 1987-10-03
JPH0140070B2 JPH0140070B2 (en:Method) 1989-08-24

Family

ID=13415977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61069898A Granted JPS62225573A (ja) 1986-03-28 1986-03-28 導電性ペ−スト用銅粉

Country Status (2)

Country Link
US (1) US4781980A (en:Method)
JP (1) JPS62225573A (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01304717A (ja) * 1988-06-02 1989-12-08 Shoei Chem Ind Co 積層コンデンサ内部電極用導電性塗料
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2016178047A (ja) * 2015-03-23 2016-10-06 東洋インキＳｃホールディングス株式会社 導電性材料および導電性組成物
CN111627698A (zh) * 2020-06-08 2020-09-04 江苏国瓷泓源光电科技有限公司 一种mlcc用镍内电极浆料

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0615680B2 (ja) * 1987-10-20 1994-03-02 三井金属鉱業株式会社 導電塗料用銅粉およびその製造法
US5213704A (en) * 1988-05-13 1993-05-25 International Business Machines Corporation Process for making a compliant thermally conductive compound
JP2751966B2 (ja) * 1989-07-20 1998-05-18 住友金属鉱山株式会社 射出成形用組成物
US5061566A (en) * 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US5686676A (en) * 1996-05-07 1997-11-11 Brush Wellman Inc. Process for making improved copper/tungsten composites
AU6438398A (en) * 1997-02-24 1998-09-09 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6679937B1 (en) * 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
EP0989205A4 (en) * 1997-04-30 2003-05-28 Takamatsu Res Lab METAL PASTE AND PROCESS FOR PRODUCING A METAL LAYER
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US20050258533A1 (en) * 2004-05-21 2005-11-24 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting structure
KR101399920B1 (ko) 2007-09-13 2014-05-28 헨켈 아게 운트 코. 카게아아 전기 전도성 조성물
KR20100033143A (ko) * 2008-09-19 2010-03-29 삼성전자주식회사 유기금속 전구체 및 이를 이용한 금속 필름 또는 패턴
US10357825B2 (en) * 2015-06-12 2019-07-23 Nof Corporation Surface-coated copper filler, method for producing same and conductive composition
KR102475489B1 (ko) 2020-07-20 2022-12-07 주식회사 쿠라레 금속 입자 조성물, 금속 입자 조성물의 제조 방법, 및, 페이스트
CN115353788B (zh) * 2022-09-26 2023-07-21 杭州海维特化工科技有限公司 一种应用于汽车内饰膜的抗病毒肌肤触感光油及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094853A (en) * 1975-05-15 1978-06-13 Kenrich Petrochemicals, Inc. Alkoxy titanate salts useful as coupling agents
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
US4529555A (en) * 1982-09-27 1985-07-16 Kawaken Fine Chemicals Co., Ltd. Surface modifier for powdery or granular substance having hydrophilic surface comprising an aluminum chelate compound
JPS6058268A (ja) * 1983-09-08 1985-04-04 Tsudakoma Ind Co Ltd ロ−ラ接触式液剤付与装置のモ−タ制御方法
DE3602373A1 (de) * 1985-01-31 1986-08-07 Mitsubishi Petrochemical Co., Ltd., Tokio/Tokyo Metallpulverhaltige polymerisatzusammensetzung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01304717A (ja) * 1988-06-02 1989-12-08 Shoei Chem Ind Co 積層コンデンサ内部電極用導電性塗料
JP2002356630A (ja) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2016178047A (ja) * 2015-03-23 2016-10-06 東洋インキＳｃホールディングス株式会社 導電性材料および導電性組成物
CN111627698A (zh) * 2020-06-08 2020-09-04 江苏国瓷泓源光电科技有限公司 一种mlcc用镍内电极浆料

Also Published As

Publication number Publication date
JPH0140070B2 (en:Method) 1989-08-24
US4781980A (en) 1988-11-01

Similar Documents

Publication Publication Date Title
JPS62225573A (ja) 導電性ペ−スト用銅粉
JPH08502762A (ja) 炭素粒子の導電性組成物およびその製造法
JPS612202A (ja) 鑞付容易な電気伝導性組成物、その製法、該組成物が適用される基材の処理法および該組成物が適用されたプリント回路板
WO2003038838A1 (fr) Pate a compose ag
CN105802452A (zh) 一种石墨烯复合涂层、石墨烯复合涂料及其制备方法
CN102002294A (zh) 一种电磁屏蔽水性涂料及其制备方法
CN102101962B (zh) 一种聚苯胺环氧防腐涂料及其制备方法
JP2013140687A (ja) 導電ペースト、導電膜付き基材およびその製造方法
JP4497491B2 (ja) 銀コロイド水溶液、銀コロイド水溶液の製造方法、導電性被膜及び導電性被膜の形成方法
DE1720839A1 (de) Verfahren zur Herstellung von homogenen waessrigen Polyamidsaeureloesungen
WO2014013557A1 (ja) 銀含有組成物及び銀要素形成基材
JP2005310703A (ja) 導電性インクおよびそれを用いた導電性被膜
CN115083657B (zh) 一种低温固化导电银浆及其制备方法和用途
US3349055A (en) Manufacture of electroconductive inks containing polyvinyl methyl-maleic acid copolymers or salts thereof as adhesive
EP3335223B1 (en) Photonic sintering of a polymer thick film copper conductor composition
JPS62141078A (ja) 導電塗料用銅粉の処理方法
US2308988A (en) Aluminum stearate solution and process of preparing the same
CN115029026A (zh) 一种镁合金用石墨烯抗腐蚀涂料及其制备方法
JP3051308B2 (ja) 導電性組成物、導電体及びその形成方法
CN105694597A (zh) 添加导电炭黑的导电油墨及制备方法
CN114525067B (zh) 一种耐高温防静电涂料、制备方法及应用
JP3332293B2 (ja) 導電性組成物、導電体及びその形成方法
JPH02218762A (ja) 導電塗料用銅粉
CN103187115A (zh) 一种低温固化型的导电浆料
JPH0149390B2 (en:Method)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees