JPS62211930A - 基板導体層への突起製造方法 - Google Patents

基板導体層への突起製造方法

Info

Publication number
JPS62211930A
JPS62211930A JP61054424A JP5442486A JPS62211930A JP S62211930 A JPS62211930 A JP S62211930A JP 61054424 A JP61054424 A JP 61054424A JP 5442486 A JP5442486 A JP 5442486A JP S62211930 A JPS62211930 A JP S62211930A
Authority
JP
Japan
Prior art keywords
conductor layer
etching
inner lead
photoresist
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61054424A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0474865B2 (https=
Inventor
Sadasumi Uchiyama
内山　貞住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP61054424A priority Critical patent/JPS62211930A/ja
Priority to US07/017,419 priority patent/US4786545A/en
Priority to GB8704425A priority patent/GB2187331B/en
Publication of JPS62211930A publication Critical patent/JPS62211930A/ja
Priority to GB8901825A priority patent/GB2211351B/en
Priority to SG1392A priority patent/SG1392G/en
Priority to SG14/92A priority patent/SG1492G/en
Publication of JPH0474865B2 publication Critical patent/JPH0474865B2/ja
Priority to HK360/93A priority patent/HK36093A/xx
Priority to HK359/93A priority patent/HK35993A/xx
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Wire Bonding (AREA)
JP61054424A 1986-02-28 1986-03-12 基板導体層への突起製造方法 Granted JPS62211930A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP61054424A JPS62211930A (ja) 1986-03-12 1986-03-12 基板導体層への突起製造方法
US07/017,419 US4786545A (en) 1986-02-28 1987-02-24 Circuit substrate and method for forming bumps on the circuit substrate
GB8704425A GB2187331B (en) 1986-02-28 1987-02-25 Method of forming an integrated circuit assembly or part thereof
GB8901825A GB2211351B (en) 1986-02-28 1989-01-27 Method of forming an integrated circuit assembly or part thereof
SG1392A SG1392G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
SG14/92A SG1492G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
HK360/93A HK36093A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof
HK359/93A HK35993A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61054424A JPS62211930A (ja) 1986-03-12 1986-03-12 基板導体層への突起製造方法

Publications (2)

Publication Number Publication Date
JPS62211930A true JPS62211930A (ja) 1987-09-17
JPH0474865B2 JPH0474865B2 (https=) 1992-11-27

Family

ID=12970328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61054424A Granted JPS62211930A (ja) 1986-02-28 1986-03-12 基板導体層への突起製造方法

Country Status (1)

Country Link
JP (1) JPS62211930A (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138864A (en) * 1979-04-16 1980-10-30 Sharp Corp Method of fabricating semiconductor assembling substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138864A (en) * 1979-04-16 1980-10-30 Sharp Corp Method of fabricating semiconductor assembling substrate

Also Published As

Publication number Publication date
JPH0474865B2 (https=) 1992-11-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term