JPS62207320A - 熱硬化性樹脂組成物で封止してなる半導体装置 - Google Patents

熱硬化性樹脂組成物で封止してなる半導体装置

Info

Publication number
JPS62207320A
JPS62207320A JP61048348A JP4834886A JPS62207320A JP S62207320 A JPS62207320 A JP S62207320A JP 61048348 A JP61048348 A JP 61048348A JP 4834886 A JP4834886 A JP 4834886A JP S62207320 A JPS62207320 A JP S62207320A
Authority
JP
Japan
Prior art keywords
resin composition
formula
crosslinking agent
tables
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61048348A
Other languages
English (en)
Japanese (ja)
Other versions
JPH045041B2 (enExample
Inventor
Akio Nishikawa
西川　昭夫
Toru Koyama
徹 小山
Shu Kanno
管野　周
Nobuo Shibata
芝田　信雄
Motoyo Wajima
和嶋　元世
Ritsuro Tada
多田　律郎
Toshikazu Narahara
奈良原　俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61048348A priority Critical patent/JPS62207320A/ja
Priority to KR1019870001666A priority patent/KR940001716B1/ko
Priority to EP87301854A priority patent/EP0237255A3/en
Priority to EP19920201125 priority patent/EP0503744A3/en
Publication of JPS62207320A publication Critical patent/JPS62207320A/ja
Publication of JPH045041B2 publication Critical patent/JPH045041B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/10—Homopolymers or copolymers of unsaturated ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02—Devices for feeding articles or materials to conveyors
    • B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP61048348A 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置 Granted JPS62207320A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61048348A JPS62207320A (ja) 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置
KR1019870001666A KR940001716B1 (ko) 1986-03-07 1987-02-26 경화성 수지조성물 및 이 조성물로 피복 및 밀봉한 반도체장치
EP87301854A EP0237255A3 (en) 1986-03-07 1987-03-03 Curable resin compositions and semiconductor devices coated and sealed with the same
EP19920201125 EP0503744A3 (en) 1986-03-07 1987-03-03 Curable resin compositions and semiconductor devices coated and sealed with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61048348A JPS62207320A (ja) 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置

Publications (2)

Publication Number Publication Date
JPS62207320A true JPS62207320A (ja) 1987-09-11
JPH045041B2 JPH045041B2 (enExample) 1992-01-30

Family

ID=12800875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61048348A Granted JPS62207320A (ja) 1986-03-07 1986-03-07 熱硬化性樹脂組成物で封止してなる半導体装置

Country Status (3)

Country Link
EP (2) EP0237255A3 (enExample)
JP (1) JPS62207320A (enExample)
KR (1) KR940001716B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62218413A (ja) * 1986-03-19 1987-09-25 Toshiba Chem Corp 半導体ペレット搭載用ペースト
KR100728852B1 (ko) * 2004-05-21 2007-06-15 샤프 가부시키가이샤 반도체 장치
WO2016009730A1 (ja) * 2014-07-16 2016-01-21 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02298510A (ja) * 1989-05-12 1990-12-10 Daicel Chem Ind Ltd エポキシ化合物
DE4330684A1 (de) * 1993-09-10 1995-03-16 Ruetgerswerke Ag Härtbare Bindemittel
US5618891A (en) * 1995-03-29 1997-04-08 General Electric Co. Solventless resin composition having minimal reactivity at room temperature
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100569617B1 (ko) * 1997-01-21 2006-04-11 다우 글로벌 테크놀로지스 인크. 에폭시 수지 조성물
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
KR100557610B1 (ko) * 1999-10-11 2006-03-10 주식회사 하이닉스반도체 신규한 포토레지스트 단량체, 그의 중합체 및 이를 함유하는 포토레지스트 조성물
TW200303439A (en) 2002-02-04 2003-09-01 Mitsui Chemicals Inc Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell
CN110330648B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑双马来酰亚胺树脂用预聚体及其应用
CN110330647B (zh) * 2019-07-30 2021-06-18 苏州大学 可重塑形状记忆双马来酰亚胺树脂及其应用
CN110330650B (zh) * 2019-07-30 2021-07-09 苏州大学 双马来酰亚胺树脂预聚体及其应用
CN110330649B (zh) * 2019-07-30 2021-04-27 苏州大学 可重塑双马来酰亚胺树脂及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170620A (ja) * 1984-02-16 1985-09-04 Daicel Chem Ind Ltd 新規なエポキシ樹脂組成物
JPS61197621A (ja) * 1985-02-27 1986-09-01 Daicel Chem Ind Ltd 封止剤
JPS61233012A (ja) * 1985-04-10 1986-10-17 Daicel Chem Ind Ltd 繊維強化プラスチツクス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB904549A (en) * 1959-05-06 1962-08-29 British Celanese Preparation of epoxy ethers and formation of cured resinous products therefrom
US4273916A (en) * 1979-02-14 1981-06-16 Trw Inc. Curable cycloaliphatic epoxy-polyimide compositions
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
US4565859A (en) * 1984-01-30 1986-01-21 Daicel Chemical Industries, Ltd. Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170620A (ja) * 1984-02-16 1985-09-04 Daicel Chem Ind Ltd 新規なエポキシ樹脂組成物
JPS61197621A (ja) * 1985-02-27 1986-09-01 Daicel Chem Ind Ltd 封止剤
JPS61233012A (ja) * 1985-04-10 1986-10-17 Daicel Chem Ind Ltd 繊維強化プラスチツクス

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62218413A (ja) * 1986-03-19 1987-09-25 Toshiba Chem Corp 半導体ペレット搭載用ペースト
KR100728852B1 (ko) * 2004-05-21 2007-06-15 샤프 가부시키가이샤 반도체 장치
WO2016009730A1 (ja) * 2014-07-16 2016-01-21 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
JP2016020464A (ja) * 2014-07-16 2016-02-04 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
JPH045041B2 (enExample) 1992-01-30
KR870008949A (ko) 1987-10-22
EP0237255A3 (en) 1990-05-30
KR940001716B1 (ko) 1994-03-05
EP0503744A3 (en) 1992-12-09
EP0503744A2 (en) 1992-09-16
EP0237255A2 (en) 1987-09-16

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