JPS621877A - ポリエチレンテレフタレ−ト成形体の金属めつき方法 - Google Patents
ポリエチレンテレフタレ−ト成形体の金属めつき方法Info
- Publication number
- JPS621877A JPS621877A JP14079085A JP14079085A JPS621877A JP S621877 A JPS621877 A JP S621877A JP 14079085 A JP14079085 A JP 14079085A JP 14079085 A JP14079085 A JP 14079085A JP S621877 A JPS621877 A JP S621877A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- palladium
- hydrosol
- polyethylene terephthalate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14079085A JPS621877A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14079085A JPS621877A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS621877A true JPS621877A (ja) | 1987-01-07 |
JPH0257148B2 JPH0257148B2 (zh) | 1990-12-04 |
Family
ID=15276801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14079085A Granted JPS621877A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS621877A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203774A (ja) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | 非電導性物質への無電解メツキ方法 |
JPH0243370A (ja) * | 1988-06-16 | 1990-02-13 | General Electric Co <Ge> | 重合体表面をめっき処理に備えて予備処理する改良法及びそれにより形成された改善された金属めっきプラスチック物品 |
JPH02285175A (ja) * | 1989-04-26 | 1990-11-22 | Shimizu Corp | 免震建築構造物 |
CN113562318A (zh) * | 2020-04-29 | 2021-10-29 | 永记造漆工业股份有限公司 | 油漆涂料包装袋 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117242A (en) * | 1976-03-25 | 1977-10-01 | Western Electric Co | Metal attaching method |
JPS60140789A (ja) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | 基板の位置決め方法 |
-
1985
- 1985-06-27 JP JP14079085A patent/JPS621877A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117242A (en) * | 1976-03-25 | 1977-10-01 | Western Electric Co | Metal attaching method |
JPS60140789A (ja) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | 基板の位置決め方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203774A (ja) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | 非電導性物質への無電解メツキ方法 |
JPH0243370A (ja) * | 1988-06-16 | 1990-02-13 | General Electric Co <Ge> | 重合体表面をめっき処理に備えて予備処理する改良法及びそれにより形成された改善された金属めっきプラスチック物品 |
JPH02285175A (ja) * | 1989-04-26 | 1990-11-22 | Shimizu Corp | 免震建築構造物 |
CN113562318A (zh) * | 2020-04-29 | 2021-10-29 | 永记造漆工业股份有限公司 | 油漆涂料包装袋 |
Also Published As
Publication number | Publication date |
---|---|
JPH0257148B2 (zh) | 1990-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |