JPS6217604B2 - - Google Patents

Info

Publication number
JPS6217604B2
JPS6217604B2 JP56102675A JP10267581A JPS6217604B2 JP S6217604 B2 JPS6217604 B2 JP S6217604B2 JP 56102675 A JP56102675 A JP 56102675A JP 10267581 A JP10267581 A JP 10267581A JP S6217604 B2 JPS6217604 B2 JP S6217604B2
Authority
JP
Japan
Prior art keywords
epoxy resin
less
ion content
phenol
10ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56102675A
Other languages
English (en)
Japanese (ja)
Other versions
JPS582322A (ja
Inventor
Kazuyuki Miki
Kazuo Iko
Yasuhito Momota
Takahiro Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP10267581A priority Critical patent/JPS582322A/ja
Publication of JPS582322A publication Critical patent/JPS582322A/ja
Publication of JPS6217604B2 publication Critical patent/JPS6217604B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10267581A 1981-06-30 1981-06-30 半導体封止用エポキシ樹脂組成物 Granted JPS582322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10267581A JPS582322A (ja) 1981-06-30 1981-06-30 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10267581A JPS582322A (ja) 1981-06-30 1981-06-30 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS582322A JPS582322A (ja) 1983-01-07
JPS6217604B2 true JPS6217604B2 (enrdf_load_stackoverflow) 1987-04-18

Family

ID=14333801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10267581A Granted JPS582322A (ja) 1981-06-30 1981-06-30 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS582322A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59210933A (ja) * 1983-05-17 1984-11-29 Toshiba Chem Corp 封止用樹脂組成物
JPS59210932A (ja) * 1983-05-17 1984-11-29 Toshiba Chem Corp 封止用樹脂組成物
JPS6018519A (ja) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPS6259626A (ja) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JP2525357B2 (ja) * 1985-12-25 1996-08-21 東レ株式会社 樹脂封止電子部品
US4842800A (en) * 1987-10-01 1989-06-27 General Electric Company Method of encapsulating electronic devices
KR100995678B1 (ko) * 2008-09-01 2010-11-22 주식회사 코오롱 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS5010897A (enrdf_load_stackoverflow) * 1973-06-04 1975-02-04
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
JPS5328960A (en) * 1976-08-30 1978-03-17 Kubota Ltd Nitration treatment
JPS53134059A (en) * 1977-04-28 1978-11-22 Hitachi Chem Co Ltd Molding material of epoxy resin
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
DE2831362A1 (de) * 1978-07-17 1980-01-31 Siemens Ag Elektroakustischer wandler
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS567299A (en) * 1979-06-25 1981-01-24 Fujitsu Ltd Error correcting circuit
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part
JPS5672046A (en) * 1979-11-19 1981-06-16 Toshiba Corp Epoxy resin molding material
JPS572329A (en) * 1980-06-05 1982-01-07 Toshiba Corp Epoxy resin type composition and semiconductor device of resin sealing type

Also Published As

Publication number Publication date
JPS582322A (ja) 1983-01-07

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