JPS5010897A - - Google Patents
Info
- Publication number
- JPS5010897A JPS5010897A JP6202773A JP6202773A JPS5010897A JP S5010897 A JPS5010897 A JP S5010897A JP 6202773 A JP6202773 A JP 6202773A JP 6202773 A JP6202773 A JP 6202773A JP S5010897 A JPS5010897 A JP S5010897A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6202773A JPS5010897A (enrdf_load_stackoverflow) | 1973-06-04 | 1973-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6202773A JPS5010897A (enrdf_load_stackoverflow) | 1973-06-04 | 1973-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5010897A true JPS5010897A (enrdf_load_stackoverflow) | 1975-02-04 |
Family
ID=13188263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6202773A Pending JPS5010897A (enrdf_load_stackoverflow) | 1973-06-04 | 1973-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5010897A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
| JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
| JPS582322A (ja) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPS58141207A (ja) * | 1982-02-15 | 1983-08-22 | Hitachi Chem Co Ltd | 積層板用樹脂組成物 |
| JPS6018519A (ja) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
-
1973
- 1973-06-04 JP JP6202773A patent/JPS5010897A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
| JPS57109642A (en) * | 1980-12-27 | 1982-07-08 | Toshiba Chem Prod | Copper plated laminated board |
| JPS582322A (ja) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPS58141207A (ja) * | 1982-02-15 | 1983-08-22 | Hitachi Chem Co Ltd | 積層板用樹脂組成物 |
| JPS6018519A (ja) * | 1983-07-09 | 1985-01-30 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |