JPS6216540B2 - - Google Patents

Info

Publication number
JPS6216540B2
JPS6216540B2 JP55134839A JP13483980A JPS6216540B2 JP S6216540 B2 JPS6216540 B2 JP S6216540B2 JP 55134839 A JP55134839 A JP 55134839A JP 13483980 A JP13483980 A JP 13483980A JP S6216540 B2 JPS6216540 B2 JP S6216540B2
Authority
JP
Japan
Prior art keywords
wiring board
semiconductor chip
devices
combination
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55134839A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5759341A (en
Inventor
Juichi Yoshida
Juji Matsuda
Masaru Iwasaki
Takashi Nukui
Shigeo Nakatake
Katsuteru Awane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP55134839A priority Critical patent/JPS5759341A/ja
Publication of JPS5759341A publication Critical patent/JPS5759341A/ja
Publication of JPS6216540B2 publication Critical patent/JPS6216540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP55134839A 1980-09-26 1980-09-26 Automatic bonding method for device Granted JPS5759341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Publications (2)

Publication Number Publication Date
JPS5759341A JPS5759341A (en) 1982-04-09
JPS6216540B2 true JPS6216540B2 (cg-RX-API-DMAC7.html) 1987-04-13

Family

ID=15137662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134839A Granted JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Country Status (1)

Country Link
JP (1) JPS5759341A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565701B2 (ja) * 1987-01-13 1996-12-18 アルプス電気株式会社 光書き込みヘッド
AU2907392A (en) * 1991-11-07 1993-06-07 Omron Corporation Automatic soldering apparatus, teaching apparatus thereof and teaching method thereof, soldering inspection apparatus and its inspection method, and automatic soldering correction apparatus and its correction method

Also Published As

Publication number Publication date
JPS5759341A (en) 1982-04-09

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