JPS62163376A - 半導体記憶装置の製造方法 - Google Patents
半導体記憶装置の製造方法Info
- Publication number
- JPS62163376A JPS62163376A JP61005310A JP531086A JPS62163376A JP S62163376 A JPS62163376 A JP S62163376A JP 61005310 A JP61005310 A JP 61005310A JP 531086 A JP531086 A JP 531086A JP S62163376 A JPS62163376 A JP S62163376A
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- gate electrode
- forming
- substrate
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/685—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection from the channel
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61005310A JPS62163376A (ja) | 1986-01-14 | 1986-01-14 | 半導体記憶装置の製造方法 |
US06/941,439 US4734887A (en) | 1986-01-14 | 1986-12-15 | Erasable programmable read only memory (EPROM) device and a process to fabricate thereof |
KR1019870000077A KR900003875B1 (ko) | 1986-01-14 | 1987-01-08 | 소거가능 프로그래머블 판독전용 메모리장치 및 그의 제조방법 |
EP87100310A EP0236676B1 (en) | 1986-01-14 | 1987-01-13 | Erasable programmable read only memory using floating gate field effect transistors |
DE8787100310T DE3780484T2 (de) | 1986-01-14 | 1987-01-13 | Loeschbarer programmierbarer nurlesespeicher mit gleitgate-feldeffekttransistoren. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61005310A JPS62163376A (ja) | 1986-01-14 | 1986-01-14 | 半導体記憶装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62163376A true JPS62163376A (ja) | 1987-07-20 |
JPH0560671B2 JPH0560671B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-02 |
Family
ID=11607698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61005310A Granted JPS62163376A (ja) | 1986-01-14 | 1986-01-14 | 半導体記憶装置の製造方法 |
Country Status (5)
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01173651A (ja) * | 1987-12-28 | 1989-07-10 | Toshiba Corp | 不揮発性半導体メモリ装置の製造方法 |
JPH01225364A (ja) * | 1988-03-04 | 1989-09-08 | Sony Corp | 不揮発性半導体記憶装置 |
JPH0265175A (ja) * | 1988-08-31 | 1990-03-05 | Toshiba Corp | 半導体不揮発性記憶装置及びその製造方法 |
US4997784A (en) * | 1988-06-24 | 1991-03-05 | Thomson-Csf | Fabrication method for a CCD frame transfer photosensitive matrix with vertical anti-blooming system |
US6667211B2 (en) | 1997-06-06 | 2003-12-23 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device and method of manufacturing the same |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2616576B1 (fr) * | 1987-06-12 | 1992-09-18 | Commissariat Energie Atomique | Cellule de memoire eprom et son procede de fabrication |
US5143860A (en) * | 1987-12-23 | 1992-09-01 | Texas Instruments Incorporated | High density EPROM fabricaiton method having sidewall floating gates |
US5268318A (en) * | 1988-06-08 | 1993-12-07 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
US5296396A (en) * | 1988-12-05 | 1994-03-22 | Sgs-Thomson Microelectronics S.R.L. | Matrix of EPROM memory cells with a tablecloth structure having an improved capacitative ratio and a process for its manufacture |
IT1227989B (it) * | 1988-12-05 | 1991-05-20 | Sgs Thomson Microelectronics | Matrice di celle di memoria eprom con struttura a tovaglia con migliorato rapporto capacitivo e processo per la sua fabbricazione |
JPH0821638B2 (ja) * | 1989-12-15 | 1996-03-04 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
JPH088316B2 (ja) * | 1990-01-31 | 1996-01-29 | 株式会社東芝 | 紫外線消去型不揮発性半導体メモリ装置 |
JPH088317B2 (ja) * | 1990-04-24 | 1996-01-29 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
US5057447A (en) * | 1990-07-09 | 1991-10-15 | Texas Instruments Incorporated | Silicide/metal floating gate process |
KR970000533B1 (ko) * | 1990-12-20 | 1997-01-13 | 후지쓰 가부시끼가이샤 | Eprom 및 그 제조방법 |
EP0537677B1 (en) * | 1991-10-16 | 1998-08-19 | Sony Corporation | Method of forming an SOI structure with a DRAM |
JP3160966B2 (ja) * | 1991-10-16 | 2001-04-25 | ソニー株式会社 | Soi基板の製造方法 |
KR100215840B1 (ko) * | 1996-02-28 | 1999-08-16 | 구본준 | 반도체 메모리셀 구조 및 제조방법 |
DE19926500C2 (de) * | 1999-06-10 | 2001-09-20 | Infineon Technologies Ag | Nichtflüchtige Halbleiter-Speicherzelle mit einer eine hohe relative Dielektrizitätskonstante aufweisenden dielektrischen Schicht und Verfahren zu deren Herstellung |
US6744094B2 (en) | 2001-08-24 | 2004-06-01 | Micron Technology Inc. | Floating gate transistor with horizontal gate layers stacked next to vertical body |
US7288821B2 (en) * | 2005-04-08 | 2007-10-30 | International Business Machines Corporation | Structure and method of three dimensional hybrid orientation technology |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5742169A (en) * | 1980-08-26 | 1982-03-09 | Toshiba Corp | Production of semiconductor device |
JPS59178773A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 半導体装置の製造方法 |
JPS6243180A (ja) * | 1985-08-20 | 1987-02-25 | Nec Corp | 不揮発性半導体記憶装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4258466A (en) * | 1978-11-02 | 1981-03-31 | Texas Instruments Incorporated | High density electrically programmable ROM |
JPS5929155B2 (ja) * | 1979-11-12 | 1984-07-18 | 富士通株式会社 | 半導体記憶装置 |
US4493057A (en) * | 1980-01-07 | 1985-01-08 | Texas Instruments Incorporated | Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like |
JPS59111370A (ja) * | 1982-12-16 | 1984-06-27 | Seiko Instr & Electronics Ltd | 不揮発性半導体メモリ |
US4618876A (en) * | 1984-07-23 | 1986-10-21 | Rca Corporation | Electrically alterable, nonvolatile floating gate memory device |
-
1986
- 1986-01-14 JP JP61005310A patent/JPS62163376A/ja active Granted
- 1986-12-15 US US06/941,439 patent/US4734887A/en not_active Expired - Fee Related
-
1987
- 1987-01-08 KR KR1019870000077A patent/KR900003875B1/ko not_active Expired
- 1987-01-13 DE DE8787100310T patent/DE3780484T2/de not_active Expired - Fee Related
- 1987-01-13 EP EP87100310A patent/EP0236676B1/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5742169A (en) * | 1980-08-26 | 1982-03-09 | Toshiba Corp | Production of semiconductor device |
JPS59178773A (ja) * | 1983-03-30 | 1984-10-11 | Toshiba Corp | 半導体装置の製造方法 |
JPS6243180A (ja) * | 1985-08-20 | 1987-02-25 | Nec Corp | 不揮発性半導体記憶装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01173651A (ja) * | 1987-12-28 | 1989-07-10 | Toshiba Corp | 不揮発性半導体メモリ装置の製造方法 |
JPH01225364A (ja) * | 1988-03-04 | 1989-09-08 | Sony Corp | 不揮発性半導体記憶装置 |
US4997784A (en) * | 1988-06-24 | 1991-03-05 | Thomson-Csf | Fabrication method for a CCD frame transfer photosensitive matrix with vertical anti-blooming system |
JPH0265175A (ja) * | 1988-08-31 | 1990-03-05 | Toshiba Corp | 半導体不揮発性記憶装置及びその製造方法 |
US6667211B2 (en) | 1997-06-06 | 2003-12-23 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
KR900003875B1 (ko) | 1990-06-02 |
JPH0560671B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-02 |
EP0236676A2 (en) | 1987-09-16 |
DE3780484D1 (de) | 1992-08-27 |
US4734887A (en) | 1988-03-29 |
KR870007571A (ko) | 1987-08-20 |
EP0236676A3 (en) | 1989-11-02 |
EP0236676B1 (en) | 1992-07-22 |
DE3780484T2 (de) | 1993-01-21 |
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