JPS621269B2 - - Google Patents
Info
- Publication number
- JPS621269B2 JPS621269B2 JP55040642A JP4064280A JPS621269B2 JP S621269 B2 JPS621269 B2 JP S621269B2 JP 55040642 A JP55040642 A JP 55040642A JP 4064280 A JP4064280 A JP 4064280A JP S621269 B2 JPS621269 B2 JP S621269B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- polycrystalline silicon
- layer
- semiconductor device
- silicon layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 12
- 238000005468 ion implantation Methods 0.000 claims description 10
- 238000005224 laser annealing Methods 0.000 claims description 8
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 230000006378 damage Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 33
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 29
- 239000012535 impurity Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- -1 arsenic ions Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical compound [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4064280A JPS56135972A (en) | 1980-03-28 | 1980-03-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4064280A JPS56135972A (en) | 1980-03-28 | 1980-03-28 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56135972A JPS56135972A (en) | 1981-10-23 |
JPS621269B2 true JPS621269B2 (enrdf_load_stackoverflow) | 1987-01-12 |
Family
ID=12586205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4064280A Granted JPS56135972A (en) | 1980-03-28 | 1980-03-28 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56135972A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4727044A (en) * | 1984-05-18 | 1988-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor with laser recrystallized source and drain |
US4621411A (en) * | 1984-09-28 | 1986-11-11 | Texas Instruments Incorporated | Laser-enhanced drive in of source and drain diffusions |
US6747245B2 (en) * | 2002-11-06 | 2004-06-08 | Ultratech Stepper, Inc. | Laser scanning apparatus and methods for thermal processing |
-
1980
- 1980-03-28 JP JP4064280A patent/JPS56135972A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56135972A (en) | 1981-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4420872A (en) | Method of manufacturing a semiconductor device | |
US6815737B2 (en) | Method for selective trimming of gate structures and apparatus formed thereby | |
JPH05109737A (ja) | 薄膜トランジスタの製造方法 | |
JP3277533B2 (ja) | 半導体装置の製造方法 | |
JPH07153969A (ja) | 分離型多結晶シリコン内構成体の製造方法 | |
JPS6359251B2 (enrdf_load_stackoverflow) | ||
US5225357A (en) | Low P+ contact resistance formation by double implant | |
JP2679579B2 (ja) | 半導体装置の製造方法 | |
JPH07273224A (ja) | 半導体装置の製造方法 | |
JP3165051B2 (ja) | 半導体素子のウェル形成方法 | |
JPS621269B2 (enrdf_load_stackoverflow) | ||
KR100244272B1 (ko) | 반도체소자의 격리막 형성방법 | |
JP3125429B2 (ja) | 半導体装置及びその製造方法 | |
JP2794594B2 (ja) | 半導体装置の製法 | |
JPS6317227B2 (enrdf_load_stackoverflow) | ||
JPS628007B2 (enrdf_load_stackoverflow) | ||
JPS6161268B2 (enrdf_load_stackoverflow) | ||
JP2774019B2 (ja) | 半導体装置の製造方法 | |
JP3311082B2 (ja) | 半導体装置の製造方法 | |
JP2584887B2 (ja) | 半導体装置の製造方法 | |
JPH0587016B2 (enrdf_load_stackoverflow) | ||
JP3182887B2 (ja) | 半導体装置の製造方法 | |
JP2668380B2 (ja) | 半導体装置の製造方法 | |
JP3700210B2 (ja) | 半導体装置の製造方法 | |
JP2763225B2 (ja) | 半導体装置の製造方法 |