JPS62122258A - マルチチツプパツケ−ジ - Google Patents

マルチチツプパツケ−ジ

Info

Publication number
JPS62122258A
JPS62122258A JP60261483A JP26148385A JPS62122258A JP S62122258 A JPS62122258 A JP S62122258A JP 60261483 A JP60261483 A JP 60261483A JP 26148385 A JP26148385 A JP 26148385A JP S62122258 A JPS62122258 A JP S62122258A
Authority
JP
Japan
Prior art keywords
insulating layer
polyimide
gold
vertical wiring
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60261483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554697B2 (cg-RX-API-DMAC10.html
Inventor
Shoji Nakakita
中北　昭二
Hikari Kimura
光 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60261483A priority Critical patent/JPS62122258A/ja
Publication of JPS62122258A publication Critical patent/JPS62122258A/ja
Priority to US07/259,319 priority patent/US4874721A/en
Publication of JPH0554697B2 publication Critical patent/JPH0554697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60261483A 1985-11-11 1985-11-22 マルチチツプパツケ−ジ Granted JPS62122258A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60261483A JPS62122258A (ja) 1985-11-22 1985-11-22 マルチチツプパツケ−ジ
US07/259,319 US4874721A (en) 1985-11-11 1988-10-18 Method of manufacturing a multichip package with increased adhesive strength

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60261483A JPS62122258A (ja) 1985-11-22 1985-11-22 マルチチツプパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62122258A true JPS62122258A (ja) 1987-06-03
JPH0554697B2 JPH0554697B2 (cg-RX-API-DMAC10.html) 1993-08-13

Family

ID=17362530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60261483A Granted JPS62122258A (ja) 1985-11-11 1985-11-22 マルチチツプパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS62122258A (cg-RX-API-DMAC10.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427390U (cg-RX-API-DMAC10.html) * 1987-08-10 1989-02-16
WO1992017901A1 (en) * 1991-03-27 1992-10-15 Integrated System Assemblies Corporation Multichip integrated circuit module and method of fabrication
FR2675946A1 (fr) * 1991-04-25 1992-10-30 Sorep Procede de montage d'une puce a circuit integre sur un substrat de cablage.
US5250843A (en) * 1991-03-27 1993-10-05 Integrated System Assemblies Corp. Multichip integrated circuit modules
US5375042A (en) * 1990-11-30 1994-12-20 Hitachi, Ltd. Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
US8836149B2 (en) 2010-12-15 2014-09-16 Samsung Electronics Co., Ltd. Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427390U (cg-RX-API-DMAC10.html) * 1987-08-10 1989-02-16
US5375042A (en) * 1990-11-30 1994-12-20 Hitachi, Ltd. Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit
WO1992017901A1 (en) * 1991-03-27 1992-10-15 Integrated System Assemblies Corporation Multichip integrated circuit module and method of fabrication
US5250843A (en) * 1991-03-27 1993-10-05 Integrated System Assemblies Corp. Multichip integrated circuit modules
AU648417B2 (en) * 1991-03-27 1994-04-21 Integrated System Assemblies Corporation Multichip integrated circuit module and method of fabrication
FR2675946A1 (fr) * 1991-04-25 1992-10-30 Sorep Procede de montage d'une puce a circuit integre sur un substrat de cablage.
WO1992020101A1 (fr) * 1991-04-25 1992-11-12 Societe Rennaise D'electronique Professionnelle (S.O.R.E.P.) Procede de montage d'une puce a circuit integre sur un substrat de cablage
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
US6159767A (en) * 1996-05-20 2000-12-12 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
US8836149B2 (en) 2010-12-15 2014-09-16 Samsung Electronics Co., Ltd. Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
US9460937B2 (en) 2010-12-15 2016-10-04 Samsung Electronics Co., Ltd. Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
US9620494B2 (en) 2010-12-15 2017-04-11 Samsung Electronics Co., Ltd. Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

Also Published As

Publication number Publication date
JPH0554697B2 (cg-RX-API-DMAC10.html) 1993-08-13

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