JPS6212189A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS6212189A JPS6212189A JP15063785A JP15063785A JPS6212189A JP S6212189 A JPS6212189 A JP S6212189A JP 15063785 A JP15063785 A JP 15063785A JP 15063785 A JP15063785 A JP 15063785A JP S6212189 A JPS6212189 A JP S6212189A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- precious metal
- hole
- wiring board
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010970 precious metal Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 16
- 229910000510 noble metal Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- MMOXZBCLCQITDF-UHFFFAOYSA-N N,N-diethyl-m-toluamide Chemical compound CCN(CC)C(=O)C1=CC=CC(C)=C1 MMOXZBCLCQITDF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15063785A JPS6212189A (ja) | 1985-07-09 | 1985-07-09 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15063785A JPS6212189A (ja) | 1985-07-09 | 1985-07-09 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6212189A true JPS6212189A (ja) | 1987-01-21 |
| JPH0362034B2 JPH0362034B2 (enrdf_load_stackoverflow) | 1991-09-24 |
Family
ID=15501198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15063785A Granted JPS6212189A (ja) | 1985-07-09 | 1985-07-09 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6212189A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0572160U (ja) * | 1992-03-02 | 1993-09-28 | 日本アビオニクス株式会社 | 多層プリント配線板 |
| KR100932429B1 (ko) | 2007-01-23 | 2009-12-17 | 미쓰미덴기가부시기가이샤 | 전지 팩 및 전지 보호 모듈 및 전지 보호 모듈용 기판의제조 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5062773A (enrdf_load_stackoverflow) * | 1973-10-04 | 1975-05-28 |
-
1985
- 1985-07-09 JP JP15063785A patent/JPS6212189A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5062773A (enrdf_load_stackoverflow) * | 1973-10-04 | 1975-05-28 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0572160U (ja) * | 1992-03-02 | 1993-09-28 | 日本アビオニクス株式会社 | 多層プリント配線板 |
| KR100932429B1 (ko) | 2007-01-23 | 2009-12-17 | 미쓰미덴기가부시기가이샤 | 전지 팩 및 전지 보호 모듈 및 전지 보호 모듈용 기판의제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0362034B2 (enrdf_load_stackoverflow) | 1991-09-24 |
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