JPS62101061A - 半導体素子のボンデイング用金線 - Google Patents

半導体素子のボンデイング用金線

Info

Publication number
JPS62101061A
JPS62101061A JP60241121A JP24112185A JPS62101061A JP S62101061 A JPS62101061 A JP S62101061A JP 60241121 A JP60241121 A JP 60241121A JP 24112185 A JP24112185 A JP 24112185A JP S62101061 A JPS62101061 A JP S62101061A
Authority
JP
Japan
Prior art keywords
germanium
gold wire
strength
gold
beryllium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60241121A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556652B2 (https=
Inventor
Yasuo Fukui
福井　康夫
Taiyo Yamamoto
山本　太洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60241121A priority Critical patent/JPS62101061A/ja
Priority to US06/863,530 priority patent/US4775512A/en
Priority to KR1019860004266A priority patent/KR930002807B1/ko
Priority to DE19863618560 priority patent/DE3618560A1/de
Priority to GB8613580A priority patent/GB2181157B/en
Publication of JPS62101061A publication Critical patent/JPS62101061A/ja
Publication of JPH0556652B2 publication Critical patent/JPH0556652B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP60241121A 1985-10-01 1985-10-26 半導体素子のボンデイング用金線 Granted JPS62101061A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60241121A JPS62101061A (ja) 1985-10-26 1985-10-26 半導体素子のボンデイング用金線
US06/863,530 US4775512A (en) 1985-10-01 1986-05-15 Gold line for bonding semiconductor element
KR1019860004266A KR930002807B1 (ko) 1985-10-26 1986-05-30 반도체 소자의 본딩(Bonding)용 금선(金線)
DE19863618560 DE3618560A1 (de) 1985-10-01 1986-06-03 Goldleitung zum verbinden von halbleiterelementen
GB8613580A GB2181157B (en) 1985-10-01 1986-06-04 Gold line for bonding semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60241121A JPS62101061A (ja) 1985-10-26 1985-10-26 半導体素子のボンデイング用金線

Publications (2)

Publication Number Publication Date
JPS62101061A true JPS62101061A (ja) 1987-05-11
JPH0556652B2 JPH0556652B2 (https=) 1993-08-20

Family

ID=17069595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60241121A Granted JPS62101061A (ja) 1985-10-01 1985-10-26 半導体素子のボンデイング用金線

Country Status (2)

Country Link
JP (1) JPS62101061A (https=)
KR (1) KR930002807B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127635A (ja) * 1987-11-09 1989-05-19 Mitsubishi Metal Corp ループ成形性の優れた半導体素子ボンディング用Ａｕ合金細線

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127635A (ja) * 1987-11-09 1989-05-19 Mitsubishi Metal Corp ループ成形性の優れた半導体素子ボンディング用Ａｕ合金細線

Also Published As

Publication number Publication date
KR930002807B1 (ko) 1993-04-10
JPH0556652B2 (https=) 1993-08-20
KR870004508A (ko) 1987-05-11

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