KR930002807B1 - 반도체 소자의 본딩(Bonding)용 금선(金線) - Google Patents

반도체 소자의 본딩(Bonding)용 금선(金線) Download PDF

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Publication number
KR930002807B1
KR930002807B1 KR1019860004266A KR860004266A KR930002807B1 KR 930002807 B1 KR930002807 B1 KR 930002807B1 KR 1019860004266 A KR1019860004266 A KR 1019860004266A KR 860004266 A KR860004266 A KR 860004266A KR 930002807 B1 KR930002807 B1 KR 930002807B1
Authority
KR
South Korea
Prior art keywords
germanium
beryllium
strength
gold
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019860004266A
Other languages
English (en)
Korean (ko)
Other versions
KR870004508A (ko
Inventor
야스오 후꾸이
다이요오 야마모도
Original Assignee
다나까 덴시 고오교오 가부시기가이샤
가도오 요시아끼라
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다나까 덴시 고오교오 가부시기가이샤, 가도오 요시아끼라 filed Critical 다나까 덴시 고오교오 가부시기가이샤
Publication of KR870004508A publication Critical patent/KR870004508A/ko
Application granted granted Critical
Publication of KR930002807B1 publication Critical patent/KR930002807B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
KR1019860004266A 1985-10-26 1986-05-30 반도체 소자의 본딩(Bonding)용 금선(金線) Expired - Fee Related KR930002807B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP241121/85 1985-10-26
JP60241121A JPS62101061A (ja) 1985-10-26 1985-10-26 半導体素子のボンデイング用金線
JP241121 1985-10-26

Publications (2)

Publication Number Publication Date
KR870004508A KR870004508A (ko) 1987-05-11
KR930002807B1 true KR930002807B1 (ko) 1993-04-10

Family

ID=17069595

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004266A Expired - Fee Related KR930002807B1 (ko) 1985-10-26 1986-05-30 반도체 소자의 본딩(Bonding)용 금선(金線)

Country Status (2)

Country Link
JP (1) JPS62101061A (https=)
KR (1) KR930002807B1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0686637B2 (ja) * 1987-11-09 1994-11-02 三菱マテリアル株式会社 ループ成形性の優れた半導体素子ボンディング用Ａｕ合金細線

Also Published As

Publication number Publication date
JPS62101061A (ja) 1987-05-11
JPH0556652B2 (https=) 1993-08-20
KR870004508A (ko) 1987-05-11

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