JPH048944B2 - - Google Patents

Info

Publication number
JPH048944B2
JPH048944B2 JP57232099A JP23209982A JPH048944B2 JP H048944 B2 JPH048944 B2 JP H048944B2 JP 57232099 A JP57232099 A JP 57232099A JP 23209982 A JP23209982 A JP 23209982A JP H048944 B2 JPH048944 B2 JP H048944B2
Authority
JP
Japan
Prior art keywords
wire
tensile strength
temperature
bonding
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57232099A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59119752A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57232099A priority Critical patent/JPS59119752A/ja
Publication of JPS59119752A publication Critical patent/JPS59119752A/ja
Publication of JPH048944B2 publication Critical patent/JPH048944B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP57232099A 1982-12-24 1982-12-24 半導体素子用ボンデイング金線 Granted JPS59119752A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57232099A JPS59119752A (ja) 1982-12-24 1982-12-24 半導体素子用ボンデイング金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57232099A JPS59119752A (ja) 1982-12-24 1982-12-24 半導体素子用ボンデイング金線

Publications (2)

Publication Number Publication Date
JPS59119752A JPS59119752A (ja) 1984-07-11
JPH048944B2 true JPH048944B2 (https=) 1992-02-18

Family

ID=16933986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57232099A Granted JPS59119752A (ja) 1982-12-24 1982-12-24 半導体素子用ボンデイング金線

Country Status (1)

Country Link
JP (1) JPS59119752A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
JP2003047216A (ja) * 2001-08-03 2003-02-14 Moric Co Ltd 電機子巻線方法及び装置並びに電機子
JP2003047217A (ja) * 2001-08-03 2003-02-14 Moric Co Ltd 回転界磁型電気機器の電機子巻線方法および電機子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826662B2 (ja) * 1977-03-11 1983-06-04 田中電子工業株式会社 半導体素子のボンデイング用金線
JPS5790954A (en) * 1980-11-27 1982-06-05 Nippon Mining Co Ltd Gold wire for bonding

Also Published As

Publication number Publication date
JPS59119752A (ja) 1984-07-11

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