JPH0454383B2 - - Google Patents

Info

Publication number
JPH0454383B2
JPH0454383B2 JP58203873A JP20387383A JPH0454383B2 JP H0454383 B2 JPH0454383 B2 JP H0454383B2 JP 58203873 A JP58203873 A JP 58203873A JP 20387383 A JP20387383 A JP 20387383A JP H0454383 B2 JPH0454383 B2 JP H0454383B2
Authority
JP
Japan
Prior art keywords
bonding
wire
added
strength
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203873A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6095948A (ja
Inventor
Shozo Hayashi
Shinji Shirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203873A priority Critical patent/JPS6095948A/ja
Publication of JPS6095948A publication Critical patent/JPS6095948A/ja
Publication of JPH0454383B2 publication Critical patent/JPH0454383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)
JP58203873A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095948A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203873A JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203873A JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095948A JPS6095948A (ja) 1985-05-29
JPH0454383B2 true JPH0454383B2 (https=) 1992-08-31

Family

ID=16481122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203873A Granted JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095948A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240071978A1 (en) * 2021-02-05 2024-02-29 Nippon Micrometal Corporation Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
EP4289985A4 (en) * 2021-02-05 2025-10-29 Nippon Micrometal Corp ALUMINUM CABLING MATERIAL

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6095948A (ja) 1985-05-29

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