JP3142391B2 - 自動ワイヤボンダ用放電電極 - Google Patents

自動ワイヤボンダ用放電電極

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Publication number
JP3142391B2
JP3142391B2 JP04262222A JP26222292A JP3142391B2 JP 3142391 B2 JP3142391 B2 JP 3142391B2 JP 04262222 A JP04262222 A JP 04262222A JP 26222292 A JP26222292 A JP 26222292A JP 3142391 B2 JP3142391 B2 JP 3142391B2
Authority
JP
Japan
Prior art keywords
discharge electrode
sample
ball
automatic wire
wire bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04262222A
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English (en)
Other versions
JPH06112263A (ja
Inventor
一光 板橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
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Priority to JP04262222A priority Critical patent/JP3142391B2/ja
Publication of JPH06112263A publication Critical patent/JPH06112263A/ja
Application granted granted Critical
Publication of JP3142391B2 publication Critical patent/JP3142391B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2224/45099—Material
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    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、半導体素子のチップ電
極と、外部リードとを接続するために用いられる自動ワ
イヤボンダに関し、さらに詳しくは、前記ワイヤボンダ
におけるボール形成用の放電電極に関する。
【０００２】
【従来の技術】従来から図１に示すように、例えばキャ
ピラリー１ａの先端に垂下せしめたＡｕ線２の先端を，
放電電極１ｂの先端ヘッド部１ｂ’からの放電により溶
融させてボール２’を形成し、このボール２’をチップ
上のＡｌ又はＡｌ合金からなる電極に圧着・切断してバ
ンプ電極を形成するバンプ接続法や、前記ボール２’を
チップ電極に圧着，接合せしめた後、ループ状に外部リ
ードまで導いて該外部リードに圧着・切断することによ
り、チップ電極と外部リードを接続させるワイヤボンデ
ィング法が知られている。
【０００３】また、この種ボンディング法に用いるに有
用な自動ワイヤボンダ１として、Ｗ−Ｙ，Ｗ−Ｌａ等の
高融点金属に少量の不純物を添加して放電電極１ｂを形
成したものが知られている（特開平１−２５６１３４
号）。
【０００４】
【発明が解決しようとする課題】しかし乍ら上記従来の
ワイヤボンダでは、Ｗ−Ｙ，Ｗ−Ｌａが酸化し易く、放
電電極表面に酸化被膜を形成してしまうことから放電が
不安定なものになり、形成されるボール径にばらつきが
生じる結果、ボンディング後の接続強度が低くなる不具
合があった。
【０００５】本発明はこのような従来事情に鑑みてなさ
れたものであり、その目的とするところは、放電電極か
らの放電をより安定性あるものとして、ボール形成時に
おけるボール径のばらつきを低減させることにある。
【０００６】
【課題を解決するための手段】以上の目的を達成するた
めに本発明は、半導体素子のボンディング時において安
定した径のボンディングボールを自動ワイヤボンダによ
り形成するための放電電極であって、該放電電極が溶解
鋳造工程を経て得られたものであり、その組成が、Ｐｔ
またはＰｔ合金であることを特徴とする。
【０００７】また、後述の理由から、上記放電電極にお
けるＰｔ合金の組成が、Ｉｒ１〜３５ｗｔ％，Ｐｄ１〜
３０ｗｔ％，Ａｕ１〜２０ｗｔ％，Ｎｉ１〜２５ｗｔ
％，Ｗ１〜１０ｗｔ％，Ｒｕ１〜１５ｗｔ％の中から何
れか１種または２種以上を含有し、残部Ｐｔ６５ｗｔ％
以上であることもよい。
【０００８】
【作用】上記の構成によれば、Ｐｔまたは、Ｉｒ，Ｐ
ｄ，Ａｕ，Ｎｉ，Ｗ，Ｒｕを添加してなるＰｔ合金は、
酸化しても４００℃程度で蒸発してしまうので、放電時
に高温（約３０００℃程度）になる放電電極表面には酸
化膜が形成されず、該電極からの放電が安定したものと
なる。よって、ボール径のばらつきを極めて小範囲なも
のとし、ボンディング後の接続強度を改善できる。
【０００９】また、放電電極は放電時に高温になること
から、Ｐｔ合金を形成する添加元素に高融点なもの、即
ち、Ｉｒ，Ｐｄ，Ａｕ，Ｎｉ，Ｗ，Ｒｕを選んだ。
【００１０】しかし乍ら、上記各元素各々の添加量が、
３５wt％（Ｉｒ），３０wt％（Ｐｄ），２０wt％（Ａ
ｕ），２５wt％（Ｎｉ），１０wt％（Ｗ），１５wt％
（Ｒｕ）を越えると偏析が生じ、Ｐｔ合金が不均一なも
のになるので好ましくない。
【００１１】従って、Ｉｒ，Ｐｄ，Ａｕ，Ｎｉ，Ｗ，Ｒ
ｕの添加量を上記の範囲に各々設定した。
【００１２】
【実施例】以下、具体的な実施例と比較例について説明
する。純度９９．９％以上のＰｔに、Ｉｒ，Ｐｄ，Ａ
ｕ，Ｎｉ，Ｗ，Ｒｕを表１中に示す含有率に基づき添加
して溶解鋳造し、各試料とした。
【００１３】表１中の試料Ｎｏ．１は純度９９．９％の
Ｐｔに何も添加しない本発明実施品、試料Ｎｏ．２〜１
３はＩｒ，Ｐｄ，Ａｕ，Ｎｉ，Ｗ，Ｒｕの中から１種を
添加し、残部Ｐｔが６５wt％以上である本発明実施品、
試料ＮＯ．１４は前記添加元素の中からＩｒとＮｉを選
んで所定量を添加した本発明実施品である。
【００１４】また、表１中の試料Ｎｏ．１５はＩｒの添
加量が３５wt％を越える比較品、試料Ｎｏ．１６はＰｄ
の添加量が３０wt％を越える比較品、試料Ｎｏ．１７は
Ａｕの添加量が２０wt％を越える比較品、試料Ｎｏ．１
８はＮｉの添加量が２５wt％を越える比較品、試料Ｎ
ｏ．１９はＷの添加量が１０wt％を越える比較品、試料
Ｎｏ．２０はＲｕの添加量が１５wt％を越える比較品で
ある。試料Ｎｏ．２１はＷ−Ｙ合金からなる比較品であ
る。
【００１５】上記のようにして作製した各試料を用い
て、図１に示すような放電電極１ｂ及びそのヘッド部１
ｂ’を成形するをもって自動ワイヤボンダ１を構成し
た。そうして、一般に使用されるＡｕワイヤ（φ２５μ
ｍ）を用いて、放電時間４ｍｓに固定してボール径６
２．５μｍになるよう放電電流を調整し、各々５万回放
電後に、ボールを１０個作製した際のボール径の平均値
と標準偏差を測定した。これらの結果も表１中に示す。
【００１６】
【表１】
【００１７】而して、試料Ｎｏ．１の測定結果から、高
純度のＰｔからなる放電電極を用いたボンダを使用すれ
ば、ボール径のばらつきを極めて小範囲なものとし得る
ことが確認できた。また、試料ＮＯ．２〜１４の測定結
果から、各添加元素（Ｉｒ，Ｐｄ，Ａｕ，Ｎｉ，Ｗ，Ｒ
ｕ）の中からを１種または２種以上を所定量添加し、且
つ残部Ｐｔを６５wt％としてなる放電電極を用いたボン
ダを使用すれば、試料Ｎｏ．１同様、ボール径のばらつ
きを極めて小範囲なものとし得ることが確認できた。
【００１８】さらに、試料Ｎｏ．１５〜２０の測定結果
から、前記各添加元素の含有量が設定範囲を越える場合
は、上記本発明実施品に比して、ボール径のばらつきが
極めて大きいことが確認できた。同様に、試料Ｎｏ．２
１の測定結果から、Ｗ−Ｙ合金からなる放電電極を用い
た場合も、ボール径のばらつきが極めて大きいことが確
認できた。
【００１９】尚、本実施例においては放電電極１ｂとヘ
ッド部１ｂ’を一体成形物として両者を上記各試料で成
形したが、これら両者を別体物としてヘッド部１ｂ’の
み上記各試料で成形することも可能であり、この場合に
おいても、上述と同様の測定結果，効果が得られること
はいうまでもない。
【００２０】
【発明の効果】本発明は以上説明したように、Ｐｔ、ま
たは、Ｉｒ，Ｐｄ，Ａｕ，Ｎｉ，Ｗ，Ｒｕを所定量添加
したＰｔ合金からなる放電電極を用いることで、ボール
成形時におけるボール径のばらつきを極めて小範囲なも
のとし得た。
【００２１】従って、ボンディング後におけるボールと
チップ電極の接合強度を著しく改善して、ワイヤボンデ
ィング法及びバンプ接続法に用いるに極めて有用な自動
ワイヤボンダ並びにその放電電極を提供できた。
【図面の簡単な説明】
【図１】一般的な自動ワイヤボンダの要部を表す拡大
図。

Claims (2)

    (57)【特許請求の範囲】
  1. 【請求項１】 半導体素子のボンディング時において安
    定した径のボンディングボールを自動ワイヤボンダによ
    り形成するための放電電極であって、該放電電極が溶解
    鋳造工程を経て得られたものであり、その組成が、Ｐｔ
    またはＰｔ合金であることを特徴とする自動ワイヤボン
    ダ用放電電極。
  2. 【請求項２】 上記Ｐｔ合金が、Ｉｒ：１〜３５ｗｔ
    ％，Ｐｄ：１〜３０ｗｔ％，Ａｕ：１〜２０ｗｔ％，Ｎ
    ｉ：１〜２５ｗｔ％，Ｗ：１〜１０ｗｔ％，Ｒｕ：１〜
    １５ｗｔ％の中から何れか１種または２種以上を含有
    し、残部Ｐｔ６５ｗｔ％以上であることを特徴とする請
    求項１記載の自動ワイヤボンダ用放電電極。
JP04262222A 1992-09-30 1992-09-30 自動ワイヤボンダ用放電電極 Expired - Fee Related JP3142391B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04262222A JP3142391B2 (ja) 1992-09-30 1992-09-30 自動ワイヤボンダ用放電電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04262222A JP3142391B2 (ja) 1992-09-30 1992-09-30 自動ワイヤボンダ用放電電極

Publications (2)

Publication Number Publication Date
JPH06112263A JPH06112263A (ja) 1994-04-22
JP3142391B2 true JP3142391B2 (ja) 2001-03-07

Family

ID=17372779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04262222A Expired - Fee Related JP3142391B2 (ja) 1992-09-30 1992-09-30 自動ワイヤボンダ用放電電極

Country Status (1)

Country Link
JP (1) JP3142391B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013220646A (ja) * 2012-04-19 2013-10-28 Rational Shokai:Kk 手帳カバー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013220646A (ja) * 2012-04-19 2013-10-28 Rational Shokai:Kk 手帳カバー

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Publication number Publication date
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