JPS6210009B2 - - Google Patents

Info

Publication number
JPS6210009B2
JPS6210009B2 JP54061991A JP6199179A JPS6210009B2 JP S6210009 B2 JPS6210009 B2 JP S6210009B2 JP 54061991 A JP54061991 A JP 54061991A JP 6199179 A JP6199179 A JP 6199179A JP S6210009 B2 JPS6210009 B2 JP S6210009B2
Authority
JP
Japan
Prior art keywords
electron beam
mark
burr
resist
marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54061991A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55153334A (en
Inventor
Masaki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6199179A priority Critical patent/JPS55153334A/ja
Publication of JPS55153334A publication Critical patent/JPS55153334A/ja
Publication of JPS6210009B2 publication Critical patent/JPS6210009B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
JP6199179A 1979-05-18 1979-05-18 Manufacture of integrated element Granted JPS55153334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6199179A JPS55153334A (en) 1979-05-18 1979-05-18 Manufacture of integrated element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6199179A JPS55153334A (en) 1979-05-18 1979-05-18 Manufacture of integrated element

Publications (2)

Publication Number Publication Date
JPS55153334A JPS55153334A (en) 1980-11-29
JPS6210009B2 true JPS6210009B2 (enrdf_load_stackoverflow) 1987-03-04

Family

ID=13187163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6199179A Granted JPS55153334A (en) 1979-05-18 1979-05-18 Manufacture of integrated element

Country Status (1)

Country Link
JP (1) JPS55153334A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261407U (enrdf_load_stackoverflow) * 1988-10-24 1990-05-08
JPH0670813U (ja) * 1993-03-16 1994-10-04 鐘紡株式会社 フィルターハウジング

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917434B2 (ja) * 1977-10-14 1984-04-21 ヤマハ株式会社 電子楽器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261407U (enrdf_load_stackoverflow) * 1988-10-24 1990-05-08
JPH0670813U (ja) * 1993-03-16 1994-10-04 鐘紡株式会社 フィルターハウジング

Also Published As

Publication number Publication date
JPS55153334A (en) 1980-11-29

Similar Documents

Publication Publication Date Title
US5627110A (en) Method for eliminating window mask process in the fabrication of a semiconductor wafer when chemical-mechanical polish planarization is used
JPH0210716A (ja) アライメント・マークの形成方法及びアライテント・マークを有する半導体ウエハ
JPS6210009B2 (enrdf_load_stackoverflow)
US4797334A (en) Patterning optical and X-ray masks for integrated circuit fabrication
EP0230648B1 (en) Method of forming an alignment mark
US5700381A (en) Method for manufacturing thin film magnetic head
JP2003140366A (ja) アライメントマーク作製方法
JP2976986B2 (ja) 位置合わせマークの形成方法
JPS6154247B2 (enrdf_load_stackoverflow)
JPS5856422A (ja) パタ−ン形成法
JPH07161684A (ja) 半導体装置の製造方法
JPH01196822A (ja) 半導体集積回路装置
JPH02276237A (ja) 荷電ビームレジストの積層方法
JPH08176799A (ja) 選択成膜マスク及びその製造方法
JPS6210010B2 (enrdf_load_stackoverflow)
JPH0262939B2 (enrdf_load_stackoverflow)
JPS63197336A (ja) 位置合せマ−ク
JP3314832B2 (ja) パターン形成方法
JPH0722307A (ja) アライメント方法および半導体装置の製造装置
JPH07161721A (ja) 厚膜レジストの平坦化方法
JPS6210008B2 (enrdf_load_stackoverflow)
JPH06250395A (ja) 金属印刷刷版の製造方法
JPH07111231A (ja) 半導体装置およびその製造方法
JPH06177027A (ja) 電子ビーム描画方法及び半導体装置
JPH06342851A (ja) 半導体装置の製造方法