JPS6193652A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS6193652A
JPS6193652A JP60195882A JP19588285A JPS6193652A JP S6193652 A JPS6193652 A JP S6193652A JP 60195882 A JP60195882 A JP 60195882A JP 19588285 A JP19588285 A JP 19588285A JP S6193652 A JPS6193652 A JP S6193652A
Authority
JP
Japan
Prior art keywords
support plate
resin
semiconductor pellet
resin body
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60195882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63950B2 (https=
Inventor
Masao Yamaguchi
正男 山口
Joga Imai
今井　丈我
Kazuo Kanbayashi
神林　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60195882A priority Critical patent/JPS6193652A/ja
Publication of JPS6193652A publication Critical patent/JPS6193652A/ja
Publication of JPS63950B2 publication Critical patent/JPS63950B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60195882A 1985-09-06 1985-09-06 樹脂封止型半導体装置 Granted JPS6193652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60195882A JPS6193652A (ja) 1985-09-06 1985-09-06 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60195882A JPS6193652A (ja) 1985-09-06 1985-09-06 樹脂封止型半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59186307A Division JPS60105257A (ja) 1984-09-07 1984-09-07 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6193652A true JPS6193652A (ja) 1986-05-12
JPS63950B2 JPS63950B2 (https=) 1988-01-09

Family

ID=16348553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60195882A Granted JPS6193652A (ja) 1985-09-06 1985-09-06 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6193652A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514913A (en) * 1991-12-05 1996-05-07 Consorzio Per La Ricerca Sulla Microelettronica Net Mezzogiorno Resin-encapsulated semiconductor device having improved adhesion

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4726210B2 (ja) * 2005-08-19 2011-07-20 日本インター株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514913A (en) * 1991-12-05 1996-05-07 Consorzio Per La Ricerca Sulla Microelettronica Net Mezzogiorno Resin-encapsulated semiconductor device having improved adhesion
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink

Also Published As

Publication number Publication date
JPS63950B2 (https=) 1988-01-09

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