JPS617479A - 集積回路の検査方法 - Google Patents
集積回路の検査方法Info
- Publication number
- JPS617479A JPS617479A JP59281909A JP28190984A JPS617479A JP S617479 A JPS617479 A JP S617479A JP 59281909 A JP59281909 A JP 59281909A JP 28190984 A JP28190984 A JP 28190984A JP S617479 A JPS617479 A JP S617479A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- data
- sensing
- contact
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000000523 sample Substances 0.000 claims description 179
- 239000004065 semiconductor Substances 0.000 claims description 64
- 238000012360 testing method Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 description 23
- 239000010409 thin film Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000003708 edge detection Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87356478A | 1978-01-30 | 1978-01-30 | |
| US873564 | 1978-01-30 | ||
| US893118 | 1986-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617479A true JPS617479A (ja) | 1986-01-14 |
| JPH0562310B2 JPH0562310B2 (OSRAM) | 1993-09-08 |
Family
ID=25361883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59281909A Granted JPS617479A (ja) | 1978-01-30 | 1984-12-26 | 集積回路の検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617479A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244854A (ja) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | プロ−ブ装置 |
| US8803773B2 (en) | 1997-07-02 | 2014-08-12 | Intellectual Keystone Technology Llc | Display apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178692A (OSRAM) * | 1974-12-29 | 1976-07-08 | Sony Corp |
-
1984
- 1984-12-26 JP JP59281909A patent/JPS617479A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178692A (OSRAM) * | 1974-12-29 | 1976-07-08 | Sony Corp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63244854A (ja) * | 1987-03-31 | 1988-10-12 | Tokyo Electron Ltd | プロ−ブ装置 |
| US8803773B2 (en) | 1997-07-02 | 2014-08-12 | Intellectual Keystone Technology Llc | Display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0562310B2 (OSRAM) | 1993-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4195259A (en) | Multiprobe test system and method of using same | |
| JPH039425B2 (OSRAM) | ||
| US4219771A (en) | Four-quadrant, multiprobe-edge sensor for semiconductor wafer probing | |
| US7061259B2 (en) | Inspection method and inspection apparatus | |
| TWI226931B (en) | Needle assembly of probe card | |
| JPH07321170A (ja) | Ｉｃ回路試験用プローブ集成体 | |
| JP2000249722A (ja) | フォトリソグラフィで形成するコンタクトストラクチャ | |
| JP2001159642A (ja) | シリコン・フィンガ・コンタクタを有するコンタクトストラクチャおよびそれを用いた総合組立構造 | |
| WO2004109306A1 (ja) | 被検査体の電気的特性を検査する検査方法及び検査装置 | |
| JP2799973B2 (ja) | 垂直作動式プローブカード | |
| JPS617479A (ja) | 集積回路の検査方法 | |
| JP4024023B2 (ja) | 電子部品測定装置及び方法 | |
| JP4679059B2 (ja) | パワー半導体素子の試験装置およびこれを用いた試験方法 | |
| JP4018010B2 (ja) | 半導体装置の特性評価装置 | |
| KR830000281B1 (ko) | 푸로브 접점을 결정하기 위한 방법 | |
| JPH09230005A (ja) | 回路基板検査装置 | |
| JPS635542A (ja) | 半導体ウエハプロ−バ | |
| JP3249865B2 (ja) | 半導体集積回路装置の製造方法 | |
| JPS6362343A (ja) | プロ−ブ・カ−ド | |
| JPH1164385A (ja) | 検査用基板のプローブ | |
| KR100676612B1 (ko) | 반도체 소자의 패드 | |
| EP0028719B1 (en) | Probe assembly for testing integrated circuits | |
| JPH062266Y2 (ja) | エッジセンサー | |
| JP2985432B2 (ja) | 電気的特性検査装置 | |
| JP2531042Y2 (ja) | プローブヘッド |