JPS6164882A - めつき材料の製造方法 - Google Patents

めつき材料の製造方法

Info

Publication number
JPS6164882A
JPS6164882A JP18451984A JP18451984A JPS6164882A JP S6164882 A JPS6164882 A JP S6164882A JP 18451984 A JP18451984 A JP 18451984A JP 18451984 A JP18451984 A JP 18451984A JP S6164882 A JPS6164882 A JP S6164882A
Authority
JP
Japan
Prior art keywords
plating
powder
noble metal
plated
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18451984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0344149B2 (zh
Inventor
Tokuzo Kanbe
神戸　徳蔵
Hiroshi Kawakami
浩 川上
Yaozo Kumagai
態谷　八百三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Nippon Chemical Industrial Co Ltd filed Critical Agency of Industrial Science and Technology
Priority to JP18451984A priority Critical patent/JPS6164882A/ja
Publication of JPS6164882A publication Critical patent/JPS6164882A/ja
Publication of JPH0344149B2 publication Critical patent/JPH0344149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP18451984A 1984-09-05 1984-09-05 めつき材料の製造方法 Granted JPS6164882A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18451984A JPS6164882A (ja) 1984-09-05 1984-09-05 めつき材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18451984A JPS6164882A (ja) 1984-09-05 1984-09-05 めつき材料の製造方法

Publications (2)

Publication Number Publication Date
JPS6164882A true JPS6164882A (ja) 1986-04-03
JPH0344149B2 JPH0344149B2 (zh) 1991-07-05

Family

ID=16154615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18451984A Granted JPS6164882A (ja) 1984-09-05 1984-09-05 めつき材料の製造方法

Country Status (1)

Country Link
JP (1) JPS6164882A (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01225776A (ja) * 1988-03-07 1989-09-08 Mitsubishi Metal Corp 銀被覆球状フエノール樹脂粉末
JPH02312300A (ja) * 1989-05-26 1990-12-27 Mitsubishi Materials Corp 金被覆球状樹脂
JP2001026880A (ja) * 1999-07-14 2001-01-30 Fujitsu Ltd 導体パターン形成方法
JP2006169566A (ja) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd 着色粒子の製造方法
KR100813614B1 (ko) * 2006-03-23 2008-03-17 주식회사 휘닉스엠앤엠 이방성 전도성 필름용 도전성 입자 및 그의 제조 방법
DE102004005999B4 (de) * 2004-02-06 2009-02-12 Nippon Chemical Industrial Co., Ltd. Leitfähiges, stromlos metallisiertes Pulver und Methode zur Herstellung desselben
WO2009054386A1 (ja) 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
US8124232B2 (en) 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
WO2012070515A1 (ja) 2010-11-22 2012-05-31 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
US20130277623A1 (en) * 2010-10-29 2013-10-24 Conpart As Process for the surface modification of a polymer particle
KR20150029835A (ko) 2013-09-10 2015-03-19 한국기계연구원 고반응성 금속분말의 산화막 제어방법
CN114307883A (zh) * 2021-12-29 2022-04-12 苏州纳微科技股份有限公司 一种适于各向异性导电的镀镍微球的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007610A3 (nl) * 1993-10-11 1995-08-22 Philips Electronics Nv Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154375A (zh) * 1974-06-04 1975-12-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154375A (zh) * 1974-06-04 1975-12-12

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01225776A (ja) * 1988-03-07 1989-09-08 Mitsubishi Metal Corp 銀被覆球状フエノール樹脂粉末
JPH02312300A (ja) * 1989-05-26 1990-12-27 Mitsubishi Materials Corp 金被覆球状樹脂
JP2001026880A (ja) * 1999-07-14 2001-01-30 Fujitsu Ltd 導体パターン形成方法
DE102004005999B4 (de) * 2004-02-06 2009-02-12 Nippon Chemical Industrial Co., Ltd. Leitfähiges, stromlos metallisiertes Pulver und Methode zur Herstellung desselben
JP4637559B2 (ja) * 2004-12-14 2011-02-23 エスケー化研株式会社 着色粒子の製造方法
JP2006169566A (ja) * 2004-12-14 2006-06-29 Sk Kaken Co Ltd 着色粒子の製造方法
KR100813614B1 (ko) * 2006-03-23 2008-03-17 주식회사 휘닉스엠앤엠 이방성 전도성 필름용 도전성 입자 및 그의 제조 방법
WO2009054386A1 (ja) 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
US8124232B2 (en) 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
US20130277623A1 (en) * 2010-10-29 2013-10-24 Conpart As Process for the surface modification of a polymer particle
US9840762B2 (en) * 2010-10-29 2017-12-12 Conpart As Process for the surface modification of a polymer particle
WO2012070515A1 (ja) 2010-11-22 2012-05-31 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
US8696946B2 (en) 2010-11-22 2014-04-15 Nippon Chemical Industrial Co., Ltd. Conductive powder, conductive material containing the same, and method for producing the same
KR20150029835A (ko) 2013-09-10 2015-03-19 한국기계연구원 고반응성 금속분말의 산화막 제어방법
CN114307883A (zh) * 2021-12-29 2022-04-12 苏州纳微科技股份有限公司 一种适于各向异性导电的镀镍微球的制备方法

Also Published As

Publication number Publication date
JPH0344149B2 (zh) 1991-07-05

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