JPS6161254B2 - - Google Patents
Info
- Publication number
- JPS6161254B2 JPS6161254B2 JP14833477A JP14833477A JPS6161254B2 JP S6161254 B2 JPS6161254 B2 JP S6161254B2 JP 14833477 A JP14833477 A JP 14833477A JP 14833477 A JP14833477 A JP 14833477A JP S6161254 B2 JPS6161254 B2 JP S6161254B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- electrode
- ohmic metal
- glass
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 230000008018 melting Effects 0.000 description 15
- 238000002844 melting Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14833477A JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14833477A JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5480684A JPS5480684A (en) | 1979-06-27 |
JPS6161254B2 true JPS6161254B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-12-24 |
Family
ID=15450438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14833477A Granted JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5480684A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297710U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-01-17 | 1990-08-03 | ||
JPH02119302U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-03-13 | 1990-09-26 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2610420B2 (ja) * | 1986-09-05 | 1997-05-14 | ロ−ム株式会社 | 半導体基板のエツチング方法 |
-
1977
- 1977-12-09 JP JP14833477A patent/JPS5480684A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297710U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-01-17 | 1990-08-03 | ||
JPH02119302U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-03-13 | 1990-09-26 |
Also Published As
Publication number | Publication date |
---|---|
JPS5480684A (en) | 1979-06-27 |