JPH0579188B2 - - Google Patents

Info

Publication number

JPH0579188B2

JPH0579188B2 JP11413086A JP11413086A JPH0579188B2 JP H0579188 B2 JPH0579188 B2 JP H0579188B2 JP 11413086 A JP11413086 A JP 11413086A JP 11413086 A JP11413086 A JP 11413086A JP H0579188 B2 JPH0579188 B2 JP H0579188B2

Authority

JP

Japan

Prior art keywords

film

molybdenum

titanium

forming

nickel

Prior art date

1986-05-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 37
• ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 33
• 229910052750 molybdenum Inorganic materials 0.000 claims description 33
• 239000011733 molybdenum Substances 0.000 claims description 33
• RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 21
• 239000010936 titanium Substances 0.000 claims description 21
• 229910052719 titanium Inorganic materials 0.000 claims description 21
• 229910052759 nickel Inorganic materials 0.000 claims description 18
• 238000005530 etching Methods 0.000 claims description 13
• 238000000034 method Methods 0.000 claims description 11
• 239000000243 solution Substances 0.000 claims description 10
• NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
• 229910052782 aluminium Inorganic materials 0.000 claims description 7
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
• KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
• 239000007864 aqueous solution Substances 0.000 claims description 6
• 239000004065 semiconductor Substances 0.000 claims description 5
• 239000000758 substrate Substances 0.000 claims description 5
• GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
• 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
• 229910017604 nitric acid Inorganic materials 0.000 claims description 4
• 238000010438 heat treatment Methods 0.000 description 6
• 229910045601 alloy Inorganic materials 0.000 description 5
• 239000000956 alloy Substances 0.000 description 5
• 238000000137 annealing Methods 0.000 description 3
• 229910052751 metal Inorganic materials 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 229910052710 silicon Inorganic materials 0.000 description 3
• 239000010703 silicon Substances 0.000 description 3
• 230000004888 barrier function Effects 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 238000005566 electron beam evaporation Methods 0.000 description 2
• 229910001295 No alloy Inorganic materials 0.000 description 1
• 229910002065 alloy metal Inorganic materials 0.000 description 1
• 238000005275 alloying Methods 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 239000007772 electrode material Substances 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 238000000059 patterning Methods 0.000 description 1
• 229920006268 silicone film Polymers 0.000 description 1
• 238000004544 sputter deposition Methods 0.000 description 1
• 230000008646 thermal stress Effects 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1