JPS6161003A - X線によるメツキ層の厚さ測定方法、及び測定装置 - Google Patents
X線によるメツキ層の厚さ測定方法、及び測定装置Info
- Publication number
- JPS6161003A JPS6161003A JP18423584A JP18423584A JPS6161003A JP S6161003 A JPS6161003 A JP S6161003A JP 18423584 A JP18423584 A JP 18423584A JP 18423584 A JP18423584 A JP 18423584A JP S6161003 A JPS6161003 A JP S6161003A
- Authority
- JP
- Japan
- Prior art keywords
- rays
- measured
- plating layer
- ray tube
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title description 11
- 238000001514 detection method Methods 0.000 claims description 7
- 238000009751 slip forming Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 21
- 239000010410 layer Substances 0.000 description 18
- 230000003287 optical effect Effects 0.000 description 9
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18423584A JPS6161003A (ja) | 1984-09-03 | 1984-09-03 | X線によるメツキ層の厚さ測定方法、及び測定装置 |
| DE19853531460 DE3531460A1 (de) | 1984-09-03 | 1985-09-03 | Verfahren und vorrichtung zum messen der dicke einer plattierten schicht |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18423584A JPS6161003A (ja) | 1984-09-03 | 1984-09-03 | X線によるメツキ層の厚さ測定方法、及び測定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161003A true JPS6161003A (ja) | 1986-03-28 |
| JPH0253723B2 JPH0253723B2 (enrdf_load_stackoverflow) | 1990-11-19 |
Family
ID=16149738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18423584A Granted JPS6161003A (ja) | 1984-09-03 | 1984-09-03 | X線によるメツキ層の厚さ測定方法、及び測定装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6161003A (enrdf_load_stackoverflow) |
| DE (1) | DE3531460A1 (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01244346A (ja) * | 1987-11-03 | 1989-09-28 | Uk Government | 高熱工程のモニター装置及びモニター方法 |
| US5754621A (en) * | 1993-03-15 | 1998-05-19 | Hitachi, Ltd. | X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board |
| US6072899A (en) * | 1997-01-23 | 2000-06-06 | Hitachi, Ltd. | Method and device of inspecting three-dimensional shape defect |
| JP2015158398A (ja) * | 2014-02-24 | 2015-09-03 | セイコーエプソン株式会社 | 実装基板 |
| CN114047213A (zh) * | 2021-11-17 | 2022-02-15 | 马鞍山钢铁股份有限公司 | 一种x射线荧光法测定锌层重量的方法 |
-
1984
- 1984-09-03 JP JP18423584A patent/JPS6161003A/ja active Granted
-
1985
- 1985-09-03 DE DE19853531460 patent/DE3531460A1/de not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01244346A (ja) * | 1987-11-03 | 1989-09-28 | Uk Government | 高熱工程のモニター装置及びモニター方法 |
| US5754621A (en) * | 1993-03-15 | 1998-05-19 | Hitachi, Ltd. | X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board |
| US6072899A (en) * | 1997-01-23 | 2000-06-06 | Hitachi, Ltd. | Method and device of inspecting three-dimensional shape defect |
| JP2015158398A (ja) * | 2014-02-24 | 2015-09-03 | セイコーエプソン株式会社 | 実装基板 |
| CN114047213A (zh) * | 2021-11-17 | 2022-02-15 | 马鞍山钢铁股份有限公司 | 一种x射线荧光法测定锌层重量的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3531460A1 (de) | 1986-03-13 |
| JPH0253723B2 (enrdf_load_stackoverflow) | 1990-11-19 |
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