JPS6161003A - X線によるメツキ層の厚さ測定方法、及び測定装置 - Google Patents

X線によるメツキ層の厚さ測定方法、及び測定装置

Info

Publication number
JPS6161003A
JPS6161003A JP18423584A JP18423584A JPS6161003A JP S6161003 A JPS6161003 A JP S6161003A JP 18423584 A JP18423584 A JP 18423584A JP 18423584 A JP18423584 A JP 18423584A JP S6161003 A JPS6161003 A JP S6161003A
Authority
JP
Japan
Prior art keywords
rays
measured
plating layer
ray tube
fluorescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18423584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0253723B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Ishijima
石島 博史
Susumu Hiradate
平舘 暹
Yutaka Ichinomiya
豊 一宮
Minoru Handa
伴田 稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP18423584A priority Critical patent/JPS6161003A/ja
Priority to DE19853531460 priority patent/DE3531460A1/de
Publication of JPS6161003A publication Critical patent/JPS6161003A/ja
Publication of JPH0253723B2 publication Critical patent/JPH0253723B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP18423584A 1984-09-03 1984-09-03 X線によるメツキ層の厚さ測定方法、及び測定装置 Granted JPS6161003A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP18423584A JPS6161003A (ja) 1984-09-03 1984-09-03 X線によるメツキ層の厚さ測定方法、及び測定装置
DE19853531460 DE3531460A1 (de) 1984-09-03 1985-09-03 Verfahren und vorrichtung zum messen der dicke einer plattierten schicht

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18423584A JPS6161003A (ja) 1984-09-03 1984-09-03 X線によるメツキ層の厚さ測定方法、及び測定装置

Publications (2)

Publication Number Publication Date
JPS6161003A true JPS6161003A (ja) 1986-03-28
JPH0253723B2 JPH0253723B2 (enrdf_load_stackoverflow) 1990-11-19

Family

ID=16149738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18423584A Granted JPS6161003A (ja) 1984-09-03 1984-09-03 X線によるメツキ層の厚さ測定方法、及び測定装置

Country Status (2)

Country Link
JP (1) JPS6161003A (enrdf_load_stackoverflow)
DE (1) DE3531460A1 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244346A (ja) * 1987-11-03 1989-09-28 Uk Government 高熱工程のモニター装置及びモニター方法
US5754621A (en) * 1993-03-15 1998-05-19 Hitachi, Ltd. X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board
US6072899A (en) * 1997-01-23 2000-06-06 Hitachi, Ltd. Method and device of inspecting three-dimensional shape defect
JP2015158398A (ja) * 2014-02-24 2015-09-03 セイコーエプソン株式会社 実装基板
CN114047213A (zh) * 2021-11-17 2022-02-15 马鞍山钢铁股份有限公司 一种x射线荧光法测定锌层重量的方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244346A (ja) * 1987-11-03 1989-09-28 Uk Government 高熱工程のモニター装置及びモニター方法
US5754621A (en) * 1993-03-15 1998-05-19 Hitachi, Ltd. X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board
US6072899A (en) * 1997-01-23 2000-06-06 Hitachi, Ltd. Method and device of inspecting three-dimensional shape defect
JP2015158398A (ja) * 2014-02-24 2015-09-03 セイコーエプソン株式会社 実装基板
CN114047213A (zh) * 2021-11-17 2022-02-15 马鞍山钢铁股份有限公司 一种x射线荧光法测定锌层重量的方法

Also Published As

Publication number Publication date
DE3531460A1 (de) 1986-03-13
JPH0253723B2 (enrdf_load_stackoverflow) 1990-11-19

Similar Documents

Publication Publication Date Title
CN104020184B (zh) 一种上照式x荧光光谱仪及其控制方法
JP2001092414A5 (enrdf_load_stackoverflow)
WO2009047350A1 (en) A system and method for monitoring a laser drilling process
CN112666595B (zh) 质子束流的测量装置和方法
CN104181130A (zh) 基于光致发光法的硅片、太阳能电池在线分拣装置
JPS6161003A (ja) X線によるメツキ層の厚さ測定方法、及び測定装置
CN218723862U (zh) 光学检测装置及激光加工设备
JP2012194101A (ja) X線異物検出装置
CN1038874C (zh) 微区x射线荧光黄金首饰分析装置
JP4574755B2 (ja) X線発生装置及び検査システム
US20070171420A1 (en) Pulsed ellipsometer device
WO2021077548A1 (zh) 量子点荧光探测装置、量子点荧光监测仪及其监测方法
US7130048B2 (en) Method and apparatus for forming substrate for semiconductor or the like
CN214953134U (zh) 光学检测系统及检测设备
JPH02259515A (ja) ケイ光x線膜厚測定装置
KR920003041B1 (ko) 광택 측정장치
JPS59182341A (ja) 試料発光の異方性測定装置
CN220062892U (zh) 一种焊条焊料轮廓检测器及焊条偏心度在线连续测量装置
KR100736485B1 (ko) 투사형 표시 시스템의 램프 위치 조정 장치 및 방법
CN221198892U (zh) 一种用于皮秒激光器的测光斑装置
CN219980782U (zh) 一种电池检测装置
CN223092148U (zh) 一种闪烁体光输出与余辉检测装置
JP3018042B2 (ja) ケイ光x線膜厚測定装置
JPH102859A (ja) プラズマモニタリング方法
JPH041942A (ja) 反射光測定用素子