JPS6160593B2 - - Google Patents

Info

Publication number
JPS6160593B2
JPS6160593B2 JP55039725A JP3972580A JPS6160593B2 JP S6160593 B2 JPS6160593 B2 JP S6160593B2 JP 55039725 A JP55039725 A JP 55039725A JP 3972580 A JP3972580 A JP 3972580A JP S6160593 B2 JPS6160593 B2 JP S6160593B2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
wiring pattern
diode element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55039725A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56135984A (en
Inventor
Kaoru Konishigawa
Akyoshi Nakaoka
Fuminori Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3972580A priority Critical patent/JPS56135984A/ja
Publication of JPS56135984A publication Critical patent/JPS56135984A/ja
Publication of JPS6160593B2 publication Critical patent/JPS6160593B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
JP3972580A 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip Granted JPS56135984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3972580A JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3972580A JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Publications (2)

Publication Number Publication Date
JPS56135984A JPS56135984A (en) 1981-10-23
JPS6160593B2 true JPS6160593B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-12-22

Family

ID=12560952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3972580A Granted JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Country Status (1)

Country Link
JP (1) JPS56135984A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890792A (ja) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp 半導体光装置の製造方法
JPS599564U (ja) * 1982-07-09 1984-01-21 清水　亮太郎 リ−ドレス発光ダイオ−ド
JPH0241650Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1985-04-05 1990-11-06
JPH0447976Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1985-07-04 1992-11-12
US4890383A (en) * 1988-01-15 1990-01-02 Simens Corporate Research & Support, Inc. Method for producing displays and modular components
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
JPH0639466Y2 (ja) * 1989-02-06 1994-10-12 スタンレー電気株式会社 表面実装型半導体装置
JPH0343750U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-09-04 1991-04-24
JP3819574B2 (ja) * 1997-12-25 2006-09-13 三洋電機株式会社 半導体装置の製造方法
TWI351115B (en) 2007-05-18 2011-10-21 Everlight Electronics Co Ltd Light-emitting diode module and the manufacturing method thereof
JP6191224B2 (ja) * 2013-05-10 2017-09-06 日亜化学工業株式会社 配線基板及びこれを用いた発光装置

Also Published As

Publication number Publication date
JPS56135984A (en) 1981-10-23

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