JPS56135984A - Manufacture of leadless light emitting diode chip - Google Patents

Manufacture of leadless light emitting diode chip

Info

Publication number
JPS56135984A
JPS56135984A JP3972580A JP3972580A JPS56135984A JP S56135984 A JPS56135984 A JP S56135984A JP 3972580 A JP3972580 A JP 3972580A JP 3972580 A JP3972580 A JP 3972580A JP S56135984 A JPS56135984 A JP S56135984A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode element
diode chip
leadless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3972580A
Other languages
English (en)
Other versions
JPS6160593B2 (ja
Inventor
Kaoru Konishigawa
Akiyoshi Nakaoka
Fuminori Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3972580A priority Critical patent/JPS56135984A/ja
Publication of JPS56135984A publication Critical patent/JPS56135984A/ja
Publication of JPS6160593B2 publication Critical patent/JPS6160593B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
JP3972580A 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip Granted JPS56135984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3972580A JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3972580A JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Publications (2)

Publication Number Publication Date
JPS56135984A true JPS56135984A (en) 1981-10-23
JPS6160593B2 JPS6160593B2 (ja) 1986-12-22

Family

ID=12560952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3972580A Granted JPS56135984A (en) 1980-03-27 1980-03-27 Manufacture of leadless light emitting diode chip

Country Status (1)

Country Link
JP (1) JPS56135984A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890792A (ja) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp 半導体光装置の製造方法
JPS599564U (ja) * 1982-07-09 1984-01-21 清水　亮太郎 リ−ドレス発光ダイオ−ド
JPS61167691U (ja) * 1985-04-05 1986-10-17
JPS6210456U (ja) * 1985-07-04 1987-01-22
JPH02104658U (ja) * 1989-02-06 1990-08-20
JPH0343750U (ja) * 1989-09-04 1991-04-24
USRE36446E (en) * 1988-01-15 1999-12-14 Infineon Technologies Corporation Method for producing displays and modular components
USRE36614E (en) * 1988-01-15 2000-03-14 Infineon Technologies Corporation Modular surface mount component for an electrical device or LED's
US6451628B1 (en) * 1997-12-25 2002-09-17 Sanyo Electric Co., Ltd. Method fabricating a semiconductor device with a decreased mounting area
JP2008288540A (ja) * 2007-05-18 2008-11-27 Everlight Electronics Co Ltd 発光ダイオードモジュール及びその製造方法
JP2014220472A (ja) * 2013-05-10 2014-11-20 日亜化学工業株式会社 配線基板及びこれを用いた発光装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5890792A (ja) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp 半導体光装置の製造方法
JPS599564U (ja) * 1982-07-09 1984-01-21 清水　亮太郎 リ−ドレス発光ダイオ−ド
JPS61167691U (ja) * 1985-04-05 1986-10-17
JPH0241650Y2 (ja) * 1985-04-05 1990-11-06
JPH0447976Y2 (ja) * 1985-07-04 1992-11-12
JPS6210456U (ja) * 1985-07-04 1987-01-22
USRE36614E (en) * 1988-01-15 2000-03-14 Infineon Technologies Corporation Modular surface mount component for an electrical device or LED's
USRE36446E (en) * 1988-01-15 1999-12-14 Infineon Technologies Corporation Method for producing displays and modular components
JPH02104658U (ja) * 1989-02-06 1990-08-20
JPH0343750U (ja) * 1989-09-04 1991-04-24
US6451628B1 (en) * 1997-12-25 2002-09-17 Sanyo Electric Co., Ltd. Method fabricating a semiconductor device with a decreased mounting area
JP2008288540A (ja) * 2007-05-18 2008-11-27 Everlight Electronics Co Ltd 発光ダイオードモジュール及びその製造方法
US8110842B2 (en) 2007-05-18 2012-02-07 Everlight Electronics Co., Ltd. Light-emitting diode module and manufacturing method thereof
JP2014220472A (ja) * 2013-05-10 2014-11-20 日亜化学工業株式会社 配線基板及びこれを用いた発光装置

Also Published As

Publication number Publication date
JPS6160593B2 (ja) 1986-12-22

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