USRE36614E - Modular surface mount component for an electrical device or LED's - Google Patents

Modular surface mount component for an electrical device or LED's Download PDF

Info

Publication number
USRE36614E
USRE36614E US09/120,591 US12059198A USRE36614E US RE36614 E USRE36614 E US RE36614E US 12059198 A US12059198 A US 12059198A US RE36614 E USRE36614 E US RE36614E
Authority
US
United States
Prior art keywords
terminals
light emitting
connection pad
modular component
terminal pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/120,591
Inventor
Marvin Lumbard
Lynn K. Wiese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Opto Semiconductors GmbH
Original Assignee
Infineon Technologies North America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US07/144,370 priority Critical patent/US4843280A/en
Application filed by Infineon Technologies North America Corp filed Critical Infineon Technologies North America Corp
Priority to US09/120,591 priority patent/USRE36614E/en
Assigned to INFINEON TECHNOLOGIES CORPORATION reassignment INFINEON TECHNOLOGIES CORPORATION SECRETARY'S CERTIFICATE Assignors: SIEMENS MICROELECTRONICS, INC.
Publication of USRE36614E publication Critical patent/USRE36614E/en
Application granted granted Critical
Assigned to OSRAM OPTO SEMICONDUCTORS GMBH & CO. OGH. reassignment OSRAM OPTO SEMICONDUCTORS GMBH & CO. OGH. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Assigned to INFINEON TECHNOLOGIES NORTH AMERICA CORP. reassignment INFINEON TECHNOLOGIES NORTH AMERICA CORP. CERTIFICATE OF AMENDMENT Assignors: INFINEON TECHNOLOGIES CORPORATION
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements

Abstract

Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Description

BACKGROUND OF THE INVENTION

This invention relates to electro-optical displays and other modular compact components. In particular, the invention relates to a method of manufacturing such components capable of being fully automated for producing low cost modular components also highly suitable for automated assembly in installations.

Display devices are used extensively particularly in digital circuitry to provide information for the interface for the user. However, with the advances in integrated circuitry technology progressively providing increased processing power in smaller space at reduced costs, the cost of interface devices, such as displays, becomes a larger portion of the total cost and thus more significant. Also when the cost of displaying information is low, the additional cost of displaying more information when desirable is not a deterent leading to greater design freedom. In view of these economic or cost saving benefits, it is extremely desirable to have a fully automated manufacturing process for producing display devices.

Another consideration in display devices as electronic components is modular construction. From a packaging stand-point, the display device should be sealed to prevent physical damage during automated assembly and contamination after assembly. Versatility is also advantageous to limit constraints on product design and packaging. Furthermore, it would be desirable for the display package to have terminals suitable for surface mount soldering. Of course, compactness of size is highly desirable in addition to the previously enumerated considerations and sought after advantages.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a novel and improved method of manufacturing modular components in which the manufacturing costs are considerably lower than those known from the prior art and in which at the same time the packaging features are at least the equal of those known from the prior art.

Another object of the invention is to provide a method of manufacturing modular display components that is adaptable to mass production techniques.

A further object of the invention is the provision of a novel method of manufacturing modular components, each component having a plurality of devices being arranged in the form of lines and columns.

Yet another object of the invention is to provide a method of manufacturing an alpha-numeric display device having a modular structure and which can be placed side by side to display characters in both vertical and horizontal formats.

A still further object of the invention is the provision of a method of manufacturing modular components which are highly suitable for automated assembly installations.

Another aim of the invention is the provision of packed modular components formed by the method described herein.

In accordance with one form of the present invention the method comprises, and the product of such method is formed by the steps of:

(a) providing an electrically insulating, generally planar substrate having two opposing major surfaces, the first of said two major surfaces including a plurality of land areas for receiving devices to be mounted thereon and a plurality of connection pads, the second of said two major surfces including a plurality of terminal pads serving as external terminals for mounted devices, and plated through holes for providing electrical connections between some of the external terminals to the land areas and between the remaining external terminals to the connection pads;

(b) mounting at least one device having at least two terminals on individual land areas so that one terminal is electrically and mechanically coupled to one of said land areas and electrically connected to its corresponding external terminal;

(c) electrically connecting any remaining terminals of each device to respective ones of said connection pads;

(d) depositing a curable layer of insulative material onto said first major surface for encapsulating said devices including electrical connections made in step (c);

(e) curing said layer of insulative material at least partially; and

(f) dividing the planar substrate including the layer of insulative material into individual modular components, each individual modular component including at least one device mounted therein and encapsulated by the layer of insulative material and electrically connected to its external terminals.

When the above method is employed the features of mounting a plurality of devices on a planar substrate and dividing the planar substrate into individual modular components renders the method highly suitable for fully automated and therefore low cost production.

BRIEF DESCRIPTION OF THE DRAWING

Features of the invention and additional aspects and objects of the invention will be more readily appreciated and better understood by reference to the following detailed description which should be considered in conjunction with the drawing in which:

FIG. 1 is a perspective view of a modular compact component including a light emitting diode which is encapsulated in transparent epoxy;

FIG. 2 is a view similar to FIG. 1 but illustrating a second illustrative embodiment with a dome lens top;

FIG. 3 is a view similar to FIG. 1 but depicting a third illustrative embodiment having a prism top;

FIG. 4 is a view similar to FIG. 1 but showing a fourth illustrative embodiment with a fresnal prism top;

FIG. 5 demonstrates a step in a method of manufacturing in accordance with the invention having a plurality of modular compact components of the type shown in FIG. 1;

FIG. 6 is a partial plan view on a planar substrate with a matrix arrangement of light emitting diodes; and

FIG. 7 is a partial plan view on a planar substrate bearing a plurality of individual digit character displays having sixteen segment fonts.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 demonstrates the construction of a typical modular component 10 that may be manufactured according to the present invention. Deposited onto the upper side 11 of a flat substrate 12 of an electrically insulating material, for instance synthetic plastic material or the like, is a conductive pattern of highly conductive material such as copper. The conductive pattern deposited onto the upper side 11 defines a land area 13 and a connection pad 14. A light emitting diode 15 is mounted on the land area 13 so that its terminal on the underneath or back side is electrically and mechanically coupled to the land area 13. The upper side of the light emitting diode 15 is provided with a terminal 16 which is electrically conductive and connected with the connection pad 14 via a bonding wire 17.

Deposited onto the rear of back side 18 of the flat substrate 12 is a second conductive pattern of highly conductive material such as copper. This second conductive pattern defines a first terminal pad 19 and a second terminal pad 20. .[.Both.]. .Iadd.Each of .Iaddend.terminal pads 19 and 20 externally are coated with a .Iadd.corresponding .Iaddend.layer of solder 21 in order to make the modular component 10 suitable for surface mount soldering.

The land area 13 on the upper side 11 of the substrate 12 is provided with an extension 22 which is electrically connected to the terminal pad 19 on the under side 18 via a plated through groove 23 having a semicircular cross-section. Similarly, the connection pad 14 on the upper side 11 of the substrate 12 is provided with an extension 24 which is electrically connected to the terminal pad 20 on the under side 18 via a plated through groove 25, which is preferably identical to the plated through groove 23. In this manner the two terminal pads 19 and 20 serve as external terminals for the light emitting diode 15 which mechanically secure modular component 10 during surface mounting of the component.

It is to be understood that the plated through grooves 23 and 25 are located at opposing edges of the substrate 12, so that they can be produced by dividing plated through holes into two substantially equal parts. As will be seen hereinafter such dividing of plated through holes can be advantageously adapted to mass production techniques with the present invention.

The modular component 10 is provided with a transparent covering 26 for protective purposes. Thus the light emitting diode 15 and its electrical contacts including the bonding wire 17 are sealed and encapsulated in the covering 26 which may comprise of synthetic resin, silicone rubber or other suitable transparent and insulative material. According to a preferred illustrative embodiment of the present invention the covering 26 is made from clear or diffused epoxy, which provides especially good optical characteristics.

In the illustrative embodiment of FIG. 1, the covering 26 of the modular component 10 has a cubical shape with a planar upper surface. Other embodiments for different purposes and with different shapes of the coverings are shown in FIGS. 2, 3 and 4.

FIG. 2 illustates an illustrative embodiment of the present invention in which the modular component 10 is provided with a covering 261 forming a generally hemispherically shaped lens above the light emitting diode 15.

FIG. 3 illustrates an illustrative embodiment in which the modular component 10 is provided with a covering 262 forming a prism over the light emitting diode 15. This prism is suitable for side emitting.

FIG. 4 shows a further illustrative embodiment in which the modular component 10 is provided with a covering 263 forming a fresnal prism over the light emitting diode 15. This fresnal prism is suitable for lateral or top emission of light.

In order to mass produce modular components in the most economical manner, all necessary steps are performed while the substrates 12 corresponding to a plurality of modular components 10 are coherent in the form of a panel. An appropriate method of manufacturing the modular components 10 corresponding to FIG. 1 will subsequently be described.

The method starts with a generally planar substrate 12 metalized with 3 mil copper on both sides. First, holes are drilled in the substrate 12 and then plated through to provide electrical connections between the upper side 11 to the under side 18. Next conductive patterns are formed on both sides of the substrate 12 by masking and etching. Techniques for forming conductive patterns are well-known and form no part of the present invention and therefore will not be discussed in further detail herein. The conductive patterns of the substrate 12 include on the upper side 11 a plurality of land areas 13 with the corresponding extensions 22 and a plurality of connection pads with the corresponding extensions 24.

On the under side 18 of the substrate 12, the conductive patterns include a plurality of terminal pads 19 and 20 which are arranged in pairs around the plated through holes. Then a gasket tape is applied to the under side 18 of the substrate 12. Subsequently, light emitting diodes 15 are mounted on the land areas 13 so that their terminals on their under sides are electrically and mechanically coupled to the corresponding land areas 13. The terminals 16 on the upper sides of the light emitting diodes are then electrically connected to their corresponding connection pads 14 via bonding wires 17. After this wire bonding, a test is performed automatically utilizing a probe station and defective light emitting diodes 15 are identified. In the next step, neither reworking is possible to correct malfunctioning light emitting diodes 15 by rebounding and/or repairing wire 17 or malfunctioning light emitting diodes 15 are replaced.

Liquid epoxy is deposited onto the upper side 11 of the substrate 12 in a sufficient quality so as to provide a coating of a thickness that will encapsulate all the light emitting diodes 15 and the bonding wires 17. The deposition of epoxy onto the substrate 12 is performed as a coating or casting operation. Then the liquid epoxy is degassed in a controlled ambient vessel utilizing a pressure less than atmospheric pressure in order to remove bubbles. Thereafter the epoxy is cured and after this curing step the gasket tape is peeled off the under side 18 of the substrate 12 since it has no longer to prevent the flow of liquid epoxy through the plated through holes.

Then the substrate 12 is inverted and a test is performed with a wafer prober using a glass stage with an optical sensor under the stage. This step is performed to test the light emitting diodes 15 for output. After this testing step, the external surfaces of all terminal pads 19 and 20 on the back side 18 of the substrate 12 are coated with a layer of solder 21. Techniques for depositing solder on terminal pads are well-known and form no part of the present invention, and therefore will not be discussed herein. According to FIG. 5, an adhesive carrier 27 is subsequently applied to the underneath surface 18 of the substrate 12 and the substrate 12 is sawed into strips 28 held together by the adhesive carrier 27. Then the strips 28 are cut into individual modular components 10 which are illustrated in FIG. 1. This second cut is in a direction that is at a right angle to the first cut.

In FIG. 5, the first cuts are designated with reference numerals 29 and the second cuts are designated with reference numerals 30. It can be seen that the first cuts 29 divide the plated through holes into substantially equal parts having semicircular cross-sections, e.g. each plated through hole is divided into a first plated through groove 23 and a second plated through groove 25, which are both present in FIG. 1 but for two adjacent plated through holes.

After the cutting of the strips 28 the individual modular components 10 are packed in a bubble tape for automatic pick and place equipment.

FIG. 6 is a partial plan view on a planar substrate 12 having a plurality of light emitting diodes 15 arranged on its upper side 11 to form lines 31 and columns 32. The portion of the land areas corresponding to the light emitting diodes 15 forming each line 31 are interconnected together and to a plurality of plated through holes 33 in the form of conductive strips 34. The plated through holes 33 are arranged in equal distances on the conductor strips 34 so as to allow the mounting of five light emitting diodes 15 on the corresponding land area portions between each two plated through holes 33.

The terminals on the upper sides of the light emitting diodes 15 corresponding to each column 32 are connected to each other and to a plurality of connection pads 35 by bonding wires 36. The connection pads 35 are perforated by plated through holes 37 so as to provide electrical connection to terminal pads on the under side of the substrate 12. The connection pads 35 and plated through holes 37 corresponding to the light emitting diodes 15 forming each column 32 are arranged in equal distances so as to allow the mounting of seven light emitting diodes 15 between each two plated through holes 37.

After the mounting, wiring and encapsulating of the light emitting diodes 15, the planar substrate 12 is divided into individual modular components. Each individual modular component has a matrix arrangement of 5×7 light emitting diodes 15. In FIG. 6, the cut lines which are parallel to the lines 31 are designated with reference numerals 38 and the cut lines which are parallel to the columns 32 are designated with reference numerals 39. It can be seen that the cut lines 38 will divide each of the plated through holes 37 into two substantially equal parts, each part forming a plated through groove similar to the plated through grooves 23 and 25 shown in FIG. 1. Likewise the cut lines 39 will divide each of the plated through holes 33 into two substantially equal parts, each part providing a plated through groove similar to the plated through grooves 23 and 25 shown in FIG. 1.

FIG. 7 is a partial plan view on a planar substrate 12 having a plurality of light emitting diodes 40 arranged on its upper side 11 to form a plurality of multiple segment joints or single character displays. Each segment of the multiple segment joint corresponds to a light emitting diode 40 which is mounted on a corresponding land area. Each terminal on the upper side of a light emitting diode 40 is connected to a separate connection pad 41 by a bonding wire 42. Each connection pad 41 is perforated by a plated through hole 43 so as to provide electrical connection to corresponding terminal pads on the under side of the substrate 12.

After the mounting, wiring and encapsulating of the light emitting diodes 40, the planar substrate 12 is divided into individual modular components. Each individual modular component functions as a single character display. In FIG. 7, the horizontal cut lines are designated with reference numerals 44 while the vertical cut lines are designated with reference numerals 45. It can be seen that the cut lines 44 and 45 will divide each of the plated through holes 43 into two substantially equal parts, each part forming a plated through groove like the plated through grooves 23 and 25 shown in FIG. 1.

The present invention provides an inexpensive technique for making surface mounted semiconductor packages. Diodes, photo sensitive devices, resistors or integrated circuits could be manufactured in panel form casing with a protective coating which maybe opaque. The panel can be tested prior to coating and after coating and sawed apart using the method described above.

There has thus been shown and described a novel method of manufacturing modular components which fulfills all the objects and advantages sought therefor. Many changes, modifications, variations and other uses and applications of the subject invention will, however, become apparent to those skilled in the art after considering this specification and the accompanying drawings which disclose preferred embodiments thereof. For example, different arrangements of devices are readily possible while utilizing the principles of the disclosed technique. Such arrangements may also have locations for plated through holes other than at the sides of the modular components, and the present techniques may also be extended to include multiple conductive layers and laminated substrate layers. All such changes, modifications, variations and other uses and applications which do not depart from the spirit and scope of the invention are deemed to be covered by the invention which is limited only by the claims which follow.

Claims (13)

What is claimed is:
1. A modular surface mount component comprising:
an electrically insulating generally planar substrate having two opposing major surfaces and at least two lateral edges forming two opposite ends of the substrate, the first of said two major surfaces including at least one land area and at least one connection pad, the second of said two major surfaces including at least two terminal pads each next to one of the two lateral edges, and at least two plated through grooves having semicircular crosssections and electrically connecting said land area and said connection pad to respective ones of the two terminal pads each plated through groove located in one of the two lateral edges;
at least one device having at least two terminals, one of said terminals being electrically and mechanically coupled to said land area and the second of said terminals being electrically connected to said connection pad;
at least one layer of insulative material on said first major surface, said insulative material encapsulating said device and said electrical connection between the second of said terminals and said connection pad; and
the two terminal pads physically displaced on the second of said two major surfaces for mechanically surface mounting the modular component when the modular component is electrically connected.
2. The modular component according to claim 1 wherein the second of said terminals and said connection pad are connected by a bonding wire.
3. The modular component according to claim 1 wherein solder is deposited on said terminal pads on said second major surface.
4. A modular surface mount component comprising:
an electrically insulating generally planar substrate having two opposing major surfaces, the first of said two major surfaces including at least one land area and at least one connection pad, the second of said two major surfaces including at least two terminal pads, and the substrate having at least two opposite side edges each having a groove having a substantially semicircular cross-section and a conductive coating electrically connecting one land area and one connection pad to respective ones of the two terminal pads;
at least one light emitting diode having at least two terminals, one of said terminals being electrically and mechanically coupled to said land area and the second of said terminals being electrically connected to said connection pad;
at least one layer of insulative material on said first major surface, said insulative material being at least partially transparent to the light emitted by the light emitting diode and encapsulating said light emitting diode and said electrical connection between the second of said terminals and said connection pad; and
the two terminal pads being surface mount terminals for electrically connecting and mechanically mounting the modular component.
5. The modular component according to claim 4 wherein a plurality of light emitting diodes is arranged to form lines and columns on said first major surface.
6. The modular component according to claim 5 wherein the portion of the land areas corresponding to the light emitting diodes forming each line are interconnected together and to at least one of said plated through grooves.
7. The modular component according to claim 5 wherein said second terminals of the light emitting diodes corresponding to each column are connected to each other and to at least one of said plated through grooves by a bonding wire.
8. The modular component according to claim 4 wherein a plurality of light emitting diodes is arranged to form a multiple segment font on said first major surface, whereby each segment of said multiple segment font corresponds to a light emitting diode.
9. The modular component according to claim 8 wherein each of said second terminals of the light emitting diodes is connected to a corresponding connection pad by a bonding wire.
10. The modular component according to claim 4 wherein said terminal pads on said second major surface are .Iadd.each .Iaddend.coated with a .Iadd.corresponding .Iaddend.layer of solder. .Iadd.
11. A modular surface mount component comprising:
an electrically insulating generally planar substrate having two opposing major surfaces and at least two lateral edges forming two opposite ends of the substrate, the first of said two major surfaces including at least one land area and at least one connection pad, the second of said two major surfaces including at least two terminal pads each next to one of the two lateral edges, and at least two plated through grooves having semicircular cross-sections and electrically connecting said land area and said connection pad to respective ones of the two terminal pads each plated through groove located in one of the two lateral edges;
at least one device having at least two terminals, one of said terminals being electrically and mechanically coupled to said land area and the second of said terminals being electrically connected to said connection pad;
at least one layer of insulative material on said first major surface, said insulative material encapsulating said device and said electrical connection between the second of said terminals and said connection pad, said layer of insulative material being substantially flush with the two lateral edges of the planar substrate; and
the two terminal pads physically displaced on the second of said two major surfaces for mechanically surface mounting the modular component when the modular component is electrically connected. .Iaddend..Iadd.12. The modular component according to claim 11 wherein the second of said terminals and said connection pad are connected by a bonding wire. .Iaddend..Iadd.13. The modular component according to claim 11 wherein solder is deposited on said terminal pads on said second major surface. .Iaddend..Iadd.14. A modular surface mount component comprising:
an electrically insulating generally planar substrate having two opposing major surfaces, the first of said two major surfaces including at least one land area and at least one connection pad, the second of said two major surfaces including at least two terminal pads, and the substrate having at least two opposite side edges each having a groove having a substantially semicircular cross-section and a conductive coating electrically connecting one land area and one connection pad to respective ones of the two terminal pads;
at least one light emitting diode having at least two terminals, one of said terminals being electrically and mechanically coupled to said land area and the second of said terminals being electrically connected to said connection pad;
at least one layer of insulative material on said first major surface, said insulative material being at least partially transparent to the light emitted by the light emitting diode and encapsulating said light emitting diode and said electrical connection between the second of said terminals and said connection pad, said layer of insulative material being substantially flush with the side edges of the planar substrate; and
the two terminal pads being surface mount terminals for electrically connecting and mechanically mounting the modular component.
.Iaddend..Iadd.5. The modular component according to claim 14 wherein a plurality of light emitting diode is arranged to form lines and columns on said first major surface. .Iaddend..Iadd.16. The modular component according to claim 15 wherein the portion of the land areas corresponding to the light emitting diodes forming each line are interconnected together and to at least one of said groove. .Iaddend..Iadd.17. The modular component according to claim 15 wherein said second terminals of the light emitting diodes corresponding to each column are connected to each other and to at least one of said grooves by a bonding wire. .Iaddend..Iadd.18. The modular component according to claim 14 wherein a plurality of light emitting diodes is arranged to form a multiple segment font on said first major surface, whereby each segment of said multiple segment font corresponds to a light emitting diode. .Iaddend..Iadd.19. The modular component according to claim 18 wherein each of said second terminals of the light emitting diodes is connected to a corresponding connection pad
by a bonding wire. .Iaddend..Iadd.20. The modular component according to claim 14 wherein each of said terminal pads on said second major surface is coated with a corresponding layer of solder. .Iaddend.
US09/120,591 1988-01-15 1998-07-17 Modular surface mount component for an electrical device or LED's Expired - Lifetime USRE36614E (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US07/144,370 US4843280A (en) 1988-01-15 1988-01-15 A modular surface mount component for an electrical device or led's
US09/120,591 USRE36614E (en) 1988-01-15 1998-07-17 Modular surface mount component for an electrical device or LED's

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/120,591 USRE36614E (en) 1988-01-15 1998-07-17 Modular surface mount component for an electrical device or LED's

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US07/144,370 Reissue US4843280A (en) 1988-01-15 1988-01-15 A modular surface mount component for an electrical device or led's

Publications (1)

Publication Number Publication Date
USRE36614E true USRE36614E (en) 2000-03-14

Family

ID=22508289

Family Applications (2)

Application Number Title Priority Date Filing Date
US07/144,370 Expired - Lifetime US4843280A (en) 1988-01-15 1988-01-15 A modular surface mount component for an electrical device or led's
US09/120,591 Expired - Lifetime USRE36614E (en) 1988-01-15 1998-07-17 Modular surface mount component for an electrical device or LED's

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US07/144,370 Expired - Lifetime US4843280A (en) 1988-01-15 1988-01-15 A modular surface mount component for an electrical device or led's

Country Status (1)

Country Link
US (2) US4843280A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281435B1 (en) * 1999-03-03 2001-08-28 Rohm Co., Ltd. Chip-type electronic devices
US20020163302A1 (en) * 2001-04-09 2002-11-07 Koichi Nitta Light emitting device
US6534799B1 (en) * 2000-10-03 2003-03-18 Harvatek Corp. Surface mount light emitting diode package
US6576995B2 (en) * 2000-04-10 2003-06-10 Infineon Technologies Ag Housing for semiconductor chips
US6649834B1 (en) * 2002-12-16 2003-11-18 Kingpak Technology Inc. Injection molded image sensor and a method for manufacturing the same
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
US6747293B2 (en) 2001-04-09 2004-06-08 Kabushiki Kaisha Toshiba Light emitting device
US6777719B1 (en) * 1999-03-19 2004-08-17 Rohm Co., Ltd. Chip light-emitting device
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US20050274957A1 (en) * 2004-05-28 2005-12-15 Harvatek Corporation LED packaging structure
US7242032B2 (en) 2001-04-09 2007-07-10 Kabushiki Kaisha Toshiba Light emitting device
US20090251873A1 (en) * 2008-04-02 2009-10-08 Sun-Wen Cyrus Cheng Surface Mount Power Module Dual Footprint
US20110175135A1 (en) * 2008-11-17 2011-07-21 Everlight Electronics Co., Ltd Circuit Board For LED
USD735400S1 (en) * 2013-02-09 2015-07-28 SVV Technology Innovations, Inc Optical lens array lightguide plate
USD758977S1 (en) * 2015-06-05 2016-06-14 Kingbright Electronics Co. Ltd. LED component

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935856A (en) * 1989-10-05 1990-06-19 Dialight Corporation Surface mounted LED package
US4959761A (en) * 1989-12-21 1990-09-25 Dialight Corporation Surface mounted led package
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
EP0646971B1 (en) * 1993-09-30 1997-03-12 Siemens Aktiengesellschaft Two-terminal SMT-miniature-housing of semiconductor device and process of manufacturing the same
DE19549726B4 (en) * 1994-12-06 2010-04-22 Sharp K.K. Light emitting diode module for e.g. display panel, LCD back light - has LED chip enclosed in transparent resin package with electrodes being connected to respective P=type and N=type PN junction sides while passing through sealed respective insulating substrate hole
JP3127195B2 (en) * 1994-12-06 2001-01-22 シャープ株式会社 Light emitting device and manufacturing method thereof
US5644327A (en) * 1995-06-07 1997-07-01 David Sarnoff Research Center, Inc. Tessellated electroluminescent display having a multilayer ceramic substrate
US5782552A (en) * 1995-07-26 1998-07-21 Green; David R. Light assembly
IT1281360B1 (en) * 1995-09-26 1998-02-18 Fiat Ricerche microtelescopio lighting system integrated into a transparent plate
JP2909023B2 (en) * 1996-05-01 1999-06-23 日吉電子株式会社 Long light emitting apparatus
JP3009626B2 (en) * 1996-05-20 2000-02-14 日吉電子株式会社 Led fireball
DE29724848U1 (en) 1996-06-26 2004-09-30 Osram Opto Semiconductors Gmbh Light emitting semiconductor component having luminescence
DE19638667C2 (en) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mixed-color light-emitting semiconductor component having luminescence
JPH10211732A (en) * 1997-01-30 1998-08-11 Canon Components Kk Head and method for mounting the same
EP1566846B1 (en) * 1997-07-29 2016-02-03 OSRAM Opto Semiconductors GmbH Optoelectronic device
DE19755734A1 (en) * 1997-12-15 1999-06-24 Siemens Ag A method for producing a surface-mountable optoelectronic component
US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6476783B2 (en) 1998-02-17 2002-11-05 Sarnoff Corporation Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display
US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US5960024A (en) 1998-03-30 1999-09-28 Bandwidth Unlimited, Inc. Vertical optical cavities produced with selective area epitaxy
US6493373B1 (en) 1998-04-14 2002-12-10 Bandwidth 9, Inc. Vertical cavity apparatus with tunnel junction
US5991326A (en) 1998-04-14 1999-11-23 Bandwidth9, Inc. Lattice-relaxed verticle optical cavities
US6493371B1 (en) 1998-04-14 2002-12-10 Bandwidth9, Inc. Vertical cavity apparatus with tunnel junction
US6487231B1 (en) 1998-04-14 2002-11-26 Bandwidth 9, Inc. Vertical cavity apparatus with tunnel junction
US6760357B1 (en) 1998-04-14 2004-07-06 Bandwidth9 Vertical cavity apparatus with tunnel junction
US6493372B1 (en) 1998-04-14 2002-12-10 Bandwidth 9, Inc. Vertical cavity apparatus with tunnel junction
US6487230B1 (en) 1998-04-14 2002-11-26 Bandwidth 9, Inc Vertical cavity apparatus with tunnel junction
US6535541B1 (en) 1998-04-14 2003-03-18 Bandwidth 9, Inc Vertical cavity apparatus with tunnel junction
US7931390B2 (en) * 1999-02-12 2011-04-26 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US7066628B2 (en) * 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US6488619B1 (en) * 1998-09-08 2002-12-03 Olympus Optical Co., Ltd. Distal endoscope part having light emitting source such as light emitting diodes as illuminating means
US6226425B1 (en) 1999-02-24 2001-05-01 Bandwidth9 Flexible optical multiplexer
US6275513B1 (en) 1999-06-04 2001-08-14 Bandwidth 9 Hermetically sealed semiconductor laser device
US6233263B1 (en) 1999-06-04 2001-05-15 Bandwidth9 Monitoring and control assembly for wavelength stabilized optical system
DE10012734C1 (en) * 2000-03-16 2001-09-27 Bjb Gmbh & Co Kg Illumination kit for illumination, display or notice purposes has plug connector with contacts in row along edge of each light emitting module to mechanically/electrically connect modules
JP2001326390A (en) * 2000-05-18 2001-11-22 Rohm Co Ltd Rear-surface light-emitting chip type light-emitting element and insulating board used therefor
JP2002050797A (en) * 2000-07-31 2002-02-15 Toshiba Corp Semiconductor excitation phosphor light-emitting device and manufacturing method therefor
EP1187226B1 (en) * 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
US6683665B1 (en) 2000-11-20 2004-01-27 Sarnoff Corporation Tiled electronic display structure and method for modular repair thereof
US6980272B1 (en) 2000-11-21 2005-12-27 Sarnoff Corporation Electrode structure which supports self alignment of liquid deposition of materials
DE10129785B4 (en) * 2001-06-20 2010-03-18 Osram Opto Semiconductors Gmbh Optoelectronic component and method for its production
JP4009817B2 (en) * 2001-10-24 2007-11-21 セイコーエプソン株式会社 Light emitting device and electronic device
JP2003234509A (en) * 2002-02-08 2003-08-22 Citizen Electronics Co Ltd Light emitting diode
JP2003309292A (en) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd Metal core substrate of surface mounting light emitting diode and its manufacturing method
DE10234978A1 (en) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Surface-mounted semiconductor component used in the production of luminescent diodes in mobile telephone keypads comprises a semiconductor chip, external electrical connections, and a chip casing
CN1672260A (en) * 2002-07-31 2005-09-21 奥斯兰姆奥普托半导体有限责任公司 Surface-mountable semiconductor component and method for producing it
DE10237084A1 (en) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Electrically conductive frame with a semiconductor light diode, to illuminate a mobile telephone keypad, has a layered structure with the electrical connections and an encapsulated diode chip in very small dimensions
DE10250911B4 (en) * 2002-10-31 2009-08-27 Osram Opto Semiconductors Gmbh Method for producing an envelope and / or at least part of a housing of an optoelectronic component
EP1420462A1 (en) * 2002-11-13 2004-05-19 Heptagon Oy Light emitting device
US7919787B2 (en) * 2003-06-27 2011-04-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Semiconductor device with a light emitting semiconductor die
US7772605B2 (en) * 2004-03-19 2010-08-10 Showa Denko K.K. Compound semiconductor light-emitting device
CN1725521B (en) * 2004-07-16 2010-10-27 国际商业机器公司 Optoelectronic device and manufacturing method
JP4676735B2 (en) 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 Optical semiconductor device manufacturing method and optical semiconductor device
US7850361B2 (en) * 2004-11-10 2010-12-14 1 Energy Solutions, Inc. Removable LED lamp holder
US7850362B2 (en) * 2004-11-10 2010-12-14 1 Energy Solutions, Inc. Removable LED lamp holder with socket
US8016440B2 (en) 2005-02-14 2011-09-13 1 Energy Solutions, Inc. Interchangeable LED bulbs
US20070025109A1 (en) 2005-07-26 2007-02-01 Yu Jing J C7, C9 LED bulb and embedded PCB circuit board
DE102005041064A1 (en) * 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Surface-mounted optoelectronic component has semiconductor chip with a molded body shaped on the chip
US7265496B2 (en) * 2005-09-23 2007-09-04 Fiber Optic Designs, Inc. Junction circuit for LED lighting chain
US7276858B2 (en) 2005-10-28 2007-10-02 Fiber Optic Designs, Inc. Decorative lighting string with stacked rectification
US7250730B1 (en) * 2006-01-17 2007-07-31 Fiber Optic Designs, Inc. Unique lighting string rectification
US8083393B2 (en) 2006-02-09 2011-12-27 1 Energy Solutions, Inc. Substantially inseparable LED lamp assembly
US8044585B2 (en) * 2006-05-02 2011-10-25 Chain Technology Consultant Inc. Light emitting diode with bumps
EP2027602A4 (en) * 2006-05-23 2012-11-28 Cree Inc Lighting device and method of making
US20080025024A1 (en) * 2006-07-31 2008-01-31 Jingjing Yu Parallel-series led light string
US7963670B2 (en) * 2006-07-31 2011-06-21 1 Energy Solutions, Inc. Bypass components in series wired LED light strings
TWI317562B (en) * 2006-08-16 2009-11-21 Ind Tech Res Inst Light-emitting device
DE102007015468A1 (en) * 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Organic radiation-emitting device, its use, and a method of manufacturing the device
US7964888B2 (en) 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
US7784993B2 (en) 2007-07-13 2010-08-31 1 Energy Solutions, Inc. Watertight LED lamp
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US7732829B2 (en) * 2008-02-05 2010-06-08 Hymite A/S Optoelectronic device submount
US7883261B2 (en) * 2008-04-08 2011-02-08 1 Energy Solutions, Inc. Water-resistant and replaceable LED lamps
US8376606B2 (en) * 2008-04-08 2013-02-19 1 Energy Solutions, Inc. Water resistant and replaceable LED lamps for light strings
US8314564B2 (en) 2008-11-04 2012-11-20 1 Energy Solutions, Inc. Capacitive full-wave circuit for LED light strings
US8136960B2 (en) * 2008-11-12 2012-03-20 American Opto Plus Led Corporation Light emitting diode display
TW201114003A (en) * 2008-12-11 2011-04-16 Xintec Inc Chip package structure and method for fabricating the same
CN201391793Y (en) * 2009-04-20 2010-01-27 喻北京 Novel heat dissipation structure of LED bulb
US8836224B2 (en) * 2009-08-26 2014-09-16 1 Energy Solutions, Inc. Compact converter plug for LED light strings
JP2012080085A (en) * 2010-09-10 2012-04-19 Nichia Chem Ind Ltd Support medium and light emitting device using the same
JP6487626B2 (en) * 2014-03-24 2019-03-20 スタンレー電気株式会社 Semiconductor device
USD778847S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
USD778846S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
JP2016178270A (en) * 2015-03-23 2016-10-06 ローム株式会社 LED package
DE102015111492A1 (en) * 2015-07-15 2017-01-19 Osram Opto Semiconductors Gmbh Component and method for the production of components

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits
US3908184A (en) * 1973-01-30 1975-09-23 Nippon Electric Co Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents
US4000437A (en) * 1975-12-17 1976-12-28 Integrated Display Systems Incorporated Electric display device
JPS55113387A (en) * 1979-02-22 1980-09-01 Sanyo Electric Co Ltd Light emitting diode indicator
JPS56135984A (en) * 1980-03-27 1981-10-23 Matsushita Electric Ind Co Ltd Manufacture of leadless light emitting diode chip
JPS56137466A (en) * 1980-03-28 1981-10-27 Sharp Corp Electronic cash register
US4305204A (en) * 1980-01-16 1981-12-15 Litronix, Inc. Method for making display device
US4445132A (en) * 1980-06-13 1984-04-24 Tokyo Shibaura Denki Kabushiki Kaisha LED Module for a flat panel display unit
US4508758A (en) * 1982-12-27 1985-04-02 At&T Technologies, Inc. Encapsulated electronic circuit
US4525597A (en) * 1982-10-30 1985-06-25 Ngk Insulators, Ltd. Ceramic leadless packages and a process for manufacturing the same
JPS61134040A (en) * 1984-12-04 1986-06-21 Fuji Dengiyou Kk Manufacture of semiconductor element
US4603496A (en) * 1985-02-04 1986-08-05 Adaptive Micro Systems, Inc. Electronic display with lens matrix
US4713579A (en) * 1984-11-12 1987-12-15 Takiron Co., Ltd. Dot matrix luminous display

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3919041B2 (en) * 1997-02-06 2007-05-23 富士通株式会社 Payment system

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits
US3908184A (en) * 1973-01-30 1975-09-23 Nippon Electric Co Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents
US4000437A (en) * 1975-12-17 1976-12-28 Integrated Display Systems Incorporated Electric display device
JPS55113387A (en) * 1979-02-22 1980-09-01 Sanyo Electric Co Ltd Light emitting diode indicator
US4305204A (en) * 1980-01-16 1981-12-15 Litronix, Inc. Method for making display device
JPS56135984A (en) * 1980-03-27 1981-10-23 Matsushita Electric Ind Co Ltd Manufacture of leadless light emitting diode chip
JPS56137466A (en) * 1980-03-28 1981-10-27 Sharp Corp Electronic cash register
US4445132A (en) * 1980-06-13 1984-04-24 Tokyo Shibaura Denki Kabushiki Kaisha LED Module for a flat panel display unit
US4525597A (en) * 1982-10-30 1985-06-25 Ngk Insulators, Ltd. Ceramic leadless packages and a process for manufacturing the same
US4508758A (en) * 1982-12-27 1985-04-02 At&T Technologies, Inc. Encapsulated electronic circuit
US4713579A (en) * 1984-11-12 1987-12-15 Takiron Co., Ltd. Dot matrix luminous display
JPS61134040A (en) * 1984-12-04 1986-06-21 Fuji Dengiyou Kk Manufacture of semiconductor element
US4603496A (en) * 1985-02-04 1986-08-05 Adaptive Micro Systems, Inc. Electronic display with lens matrix

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281435B1 (en) * 1999-03-03 2001-08-28 Rohm Co., Ltd. Chip-type electronic devices
US6777719B1 (en) * 1999-03-19 2004-08-17 Rohm Co., Ltd. Chip light-emitting device
US6576995B2 (en) * 2000-04-10 2003-06-10 Infineon Technologies Ag Housing for semiconductor chips
US6534799B1 (en) * 2000-10-03 2003-03-18 Harvatek Corp. Surface mount light emitting diode package
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
US7569989B2 (en) 2001-04-09 2009-08-04 Kabushiki Kaisha Toshiba Light emitting device
US6747293B2 (en) 2001-04-09 2004-06-08 Kabushiki Kaisha Toshiba Light emitting device
US7176623B2 (en) 2001-04-09 2007-02-13 Kabushiki Kaisha Toshiba Light emitting device
US20040217369A1 (en) * 2001-04-09 2004-11-04 Kabushiki Kaisha Toshiba Light emitting device
US20070085107A1 (en) * 2001-04-09 2007-04-19 Kabushiki Kaisha Toshiba Light Emitting Device
US20020163302A1 (en) * 2001-04-09 2002-11-07 Koichi Nitta Light emitting device
US7242032B2 (en) 2001-04-09 2007-07-10 Kabushiki Kaisha Toshiba Light emitting device
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
US6649834B1 (en) * 2002-12-16 2003-11-18 Kingpak Technology Inc. Injection molded image sensor and a method for manufacturing the same
US20050274957A1 (en) * 2004-05-28 2005-12-15 Harvatek Corporation LED packaging structure
US20090251873A1 (en) * 2008-04-02 2009-10-08 Sun-Wen Cyrus Cheng Surface Mount Power Module Dual Footprint
US8319114B2 (en) * 2008-04-02 2012-11-27 Densel Lambda K.K. Surface mount power module dual footprint
US20110175135A1 (en) * 2008-11-17 2011-07-21 Everlight Electronics Co., Ltd Circuit Board For LED
USD735400S1 (en) * 2013-02-09 2015-07-28 SVV Technology Innovations, Inc Optical lens array lightguide plate
USD758977S1 (en) * 2015-06-05 2016-06-14 Kingbright Electronics Co. Ltd. LED component

Also Published As

Publication number Publication date
US4843280A (en) 1989-06-27

Similar Documents

Publication Publication Date Title
US5258330A (en) Semiconductor chip assemblies with fan-in leads
US5894108A (en) Plastic package with exposed die
JP3127195B2 (en) Light emitting device and manufacturing method thereof
US5148265A (en) Semiconductor chip assemblies with fan-in leads
US4700276A (en) Ultra high density pad array chip carrier
CA1311856C (en) Multiple integrated circuit interconnection arrangement
US5357674A (en) Method of manufacturing a printed circuit board
US6271056B1 (en) Stacked semiconductor package and method of fabrication
US6160705A (en) Ball grid array package and method using enhanced power and ground distribution circuitry
US6323060B1 (en) Stackable flex circuit IC package and method of making same
US6031282A (en) High performance integrated circuit chip package
US7215018B2 (en) Stacked die BGA or LGA component assembly
US5677575A (en) Semiconductor package having semiconductor chip mounted on board in face-down relation
JP3337480B2 (en) Electrical connections forming apparatus
EP0098932B1 (en) Repairable multi-level system for semiconductor device
US5477933A (en) Electronic device interconnection techniques
US4074342A (en) Electrical package for lsi devices and assembly process therefor
US5874782A (en) Wafer with elevated contact structures
US4251852A (en) Integrated circuit package
US7245021B2 (en) Micropede stacked die component assembly
US7777238B2 (en) Chip-type light emitting device and wiring substrate for the same
US6388340B2 (en) Compliant semiconductor chip package with fan-out leads and method of making same
US6504104B2 (en) Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
US4079511A (en) Method for packaging hermetically sealed integrated circuit chips on lead frames
US4423468A (en) Dual electronic component assembly

Legal Events

Date Code Title Description
AS Assignment

Owner name: INFINEON TECHNOLOGIES CORPORATION, CALIFORNIA

Free format text: SECRETARY S CERTIFICATE;ASSIGNOR:SIEMENS MICROELECTRONICS, INC.;REEL/FRAME:009933/0013

Effective date: 19990408

FPAY Fee payment

Year of fee payment: 12

SULP Surcharge for late payment

Year of fee payment: 11

AS Assignment

Owner name: OSRAM OPTO SEMICONDUCTORS GMBH & CO. OGH., GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INFINEON TECHNOLOGIES NORTH AMERICA CORP.;REEL/FRAME:012785/0048

Effective date: 20011116

Owner name: INFINEON TECHNOLOGIES NORTH AMERICA CORP., CALIFOR

Free format text: CERTIFICATE OF AMENDMENT;ASSIGNOR:INFINEON TECHNOLOGIES CORPORATION;REEL/FRAME:012785/0470

Effective date: 19990930