USRE36614E - Modular surface mount component for an electrical device or LED's - Google Patents
Modular surface mount component for an electrical device or LED's Download PDFInfo
- Publication number
- USRE36614E USRE36614E US09/120,591 US12059198A USRE36614E US RE36614 E USRE36614 E US RE36614E US 12059198 A US12059198 A US 12059198A US RE36614 E USRE36614 E US RE36614E
- Authority
- US
- United States
- Prior art keywords
- terminals
- light emitting
- connection pad
- modular component
- terminal pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- This invention relates to electro-optical displays and other modular compact components.
- the invention relates to a method of manufacturing such components capable of being fully automated for producing low cost modular components also highly suitable for automated assembly in installations.
- Display devices are used extensively particularly in digital circuitry to provide information for the interface for the user.
- the cost of interface devices such as displays
- the cost of displaying information becomes a larger portion of the total cost and thus more significant.
- the cost of displaying information is low, the additional cost of displaying more information when desirable is not a deterent leading to greater design freedom.
- display devices As electronic components, the display device should be sealed to prevent physical damage during automated assembly and contamination after assembly. Versatility is also advantageous to limit constraints on product design and packaging. Furthermore, it would be desirable for the display package to have terminals suitable for surface mount soldering. Of course, compactness of size is highly desirable in addition to the previously enumerated considerations and sought after advantages.
- An object of the present invention is to provide a novel and improved method of manufacturing modular components in which the manufacturing costs are considerably lower than those known from the prior art and in which at the same time the packaging features are at least the equal of those known from the prior art.
- Another object of the invention is to provide a method of manufacturing modular display components that is adaptable to mass production techniques.
- a further object of the invention is the provision of a novel method of manufacturing modular components, each component having a plurality of devices being arranged in the form of lines and columns.
- Yet another object of the invention is to provide a method of manufacturing an alpha-numeric display device having a modular structure and which can be placed side by side to display characters in both vertical and horizontal formats.
- a still further object of the invention is the provision of a method of manufacturing modular components which are highly suitable for automated assembly installations.
- Another aim of the invention is the provision of packed modular components formed by the method described herein.
- the method comprises, and the product of such method is formed by the steps of:
- step (d) depositing a curable layer of insulative material onto said first major surface for encapsulating said devices including electrical connections made in step (c);
- FIG. 1 is a perspective view of a modular compact component including a light emitting diode which is encapsulated in transparent epoxy;
- FIG. 2 is a view similar to FIG. 1 but illustrating a second illustrative embodiment with a dome lens top;
- FIG. 3 is a view similar to FIG. 1 but depicting a third illustrative embodiment having a prism top;
- FIG. 4 is a view similar to FIG. 1 but showing a fourth illustrative embodiment with a fresnal prism top;
- FIG. 5 demonstrates a step in a method of manufacturing in accordance with the invention having a plurality of modular compact components of the type shown in FIG. 1;
- FIG. 6 is a partial plan view on a planar substrate with a matrix arrangement of light emitting diodes.
- FIG. 7 is a partial plan view on a planar substrate bearing a plurality of individual digit character displays having sixteen segment fonts.
- FIG. 1 demonstrates the construction of a typical modular component 10 that may be manufactured according to the present invention.
- a conductive pattern of highly conductive material such as copper.
- the conductive pattern deposited onto the upper side 11 defines a land area 13 and a connection pad 14.
- a light emitting diode 15 is mounted on the land area 13 so that its terminal on the underneath or back side is electrically and mechanically coupled to the land area 13.
- the upper side of the light emitting diode 15 is provided with a terminal 16 which is electrically conductive and connected with the connection pad 14 via a bonding wire 17.
- a second conductive pattern of highly conductive material such as copper.
- This second conductive pattern defines a first terminal pad 19 and a second terminal pad 20.
- .[.Both.]. .Iadd.Each of .Iaddend.terminal pads 19 and 20 externally are coated with a .Iadd.corresponding .Iaddend.layer of solder 21 in order to make the modular component 10 suitable for surface mount soldering.
- the land area 13 on the upper side 11 of the substrate 12 is provided with an extension 22 which is electrically connected to the terminal pad 19 on the under side 18 via a plated through groove 23 having a semicircular cross-section.
- the connection pad 14 on the upper side 11 of the substrate 12 is provided with an extension 24 which is electrically connected to the terminal pad 20 on the under side 18 via a plated through groove 25, which is preferably identical to the plated through groove 23.
- the two terminal pads 19 and 20 serve as external terminals for the light emitting diode 15 which mechanically secure modular component 10 during surface mounting of the component.
- the plated through grooves 23 and 25 are located at opposing edges of the substrate 12, so that they can be produced by dividing plated through holes into two substantially equal parts. As will be seen hereinafter such dividing of plated through holes can be advantageously adapted to mass production techniques with the present invention.
- the modular component 10 is provided with a transparent covering 26 for protective purposes.
- a transparent covering 26 for protective purposes.
- the light emitting diode 15 and its electrical contacts including the bonding wire 17 are sealed and encapsulated in the covering 26 which may comprise of synthetic resin, silicone rubber or other suitable transparent and insulative material.
- the covering 26 is made from clear or diffused epoxy, which provides especially good optical characteristics.
- the covering 26 of the modular component 10 has a cubical shape with a planar upper surface.
- FIG. 2 illustates an illustrative embodiment of the present invention in which the modular component 10 is provided with a covering 261 forming a generally hemispherically shaped lens above the light emitting diode 15.
- FIG. 3 illustrates an illustrative embodiment in which the modular component 10 is provided with a covering 262 forming a prism over the light emitting diode 15. This prism is suitable for side emitting.
- FIG. 4 shows a further illustrative embodiment in which the modular component 10 is provided with a covering 263 forming a fresnal prism over the light emitting diode 15. This fresnal prism is suitable for lateral or top emission of light.
- the method starts with a generally planar substrate 12 metalized with 3 mil copper on both sides. First, holes are drilled in the substrate 12 and then plated through to provide electrical connections between the upper side 11 to the under side 18. Next conductive patterns are formed on both sides of the substrate 12 by masking and etching. Techniques for forming conductive patterns are well-known and form no part of the present invention and therefore will not be discussed in further detail herein.
- the conductive patterns of the substrate 12 include on the upper side 11 a plurality of land areas 13 with the corresponding extensions 22 and a plurality of connection pads with the corresponding extensions 24.
- the conductive patterns include a plurality of terminal pads 19 and 20 which are arranged in pairs around the plated through holes. Then a gasket tape is applied to the under side 18 of the substrate 12. Subsequently, light emitting diodes 15 are mounted on the land areas 13 so that their terminals on their under sides are electrically and mechanically coupled to the corresponding land areas 13. The terminals 16 on the upper sides of the light emitting diodes are then electrically connected to their corresponding connection pads 14 via bonding wires 17. After this wire bonding, a test is performed automatically utilizing a probe station and defective light emitting diodes 15 are identified. In the next step, neither reworking is possible to correct malfunctioning light emitting diodes 15 by rebounding and/or repairing wire 17 or malfunctioning light emitting diodes 15 are replaced.
- Liquid epoxy is deposited onto the upper side 11 of the substrate 12 in a sufficient quality so as to provide a coating of a thickness that will encapsulate all the light emitting diodes 15 and the bonding wires 17.
- the deposition of epoxy onto the substrate 12 is performed as a coating or casting operation.
- the liquid epoxy is degassed in a controlled ambient vessel utilizing a pressure less than atmospheric pressure in order to remove bubbles. Thereafter the epoxy is cured and after this curing step the gasket tape is peeled off the under side 18 of the substrate 12 since it has no longer to prevent the flow of liquid epoxy through the plated through holes.
- the substrate 12 is inverted and a test is performed with a wafer prober using a glass stage with an optical sensor under the stage. This step is performed to test the light emitting diodes 15 for output.
- the external surfaces of all terminal pads 19 and 20 on the back side 18 of the substrate 12 are coated with a layer of solder 21. Techniques for depositing solder on terminal pads are well-known and form no part of the present invention, and therefore will not be discussed herein.
- an adhesive carrier 27 is subsequently applied to the underneath surface 18 of the substrate 12 and the substrate 12 is sawed into strips 28 held together by the adhesive carrier 27. Then the strips 28 are cut into individual modular components 10 which are illustrated in FIG. 1. This second cut is in a direction that is at a right angle to the first cut.
- first cuts are designated with reference numerals 29 and the second cuts are designated with reference numerals 30. It can be seen that the first cuts 29 divide the plated through holes into substantially equal parts having semicircular cross-sections, e.g. each plated through hole is divided into a first plated through groove 23 and a second plated through groove 25, which are both present in FIG. 1 but for two adjacent plated through holes.
- the individual modular components 10 are packed in a bubble tape for automatic pick and place equipment.
- FIG. 6 is a partial plan view on a planar substrate 12 having a plurality of light emitting diodes 15 arranged on its upper side 11 to form lines 31 and columns 32.
- the portion of the land areas corresponding to the light emitting diodes 15 forming each line 31 are interconnected together and to a plurality of plated through holes 33 in the form of conductive strips 34.
- the plated through holes 33 are arranged in equal distances on the conductor strips 34 so as to allow the mounting of five light emitting diodes 15 on the corresponding land area portions between each two plated through holes 33.
- connection pads 35 are perforated by plated through holes 37 so as to provide electrical connection to terminal pads on the under side of the substrate 12.
- the connection pads 35 and plated through holes 37 corresponding to the light emitting diodes 15 forming each column 32 are arranged in equal distances so as to allow the mounting of seven light emitting diodes 15 between each two plated through holes 37.
- the planar substrate 12 is divided into individual modular components.
- Each individual modular component has a matrix arrangement of 5 ⁇ 7 light emitting diodes 15.
- the cut lines which are parallel to the lines 31 are designated with reference numerals 38 and the cut lines which are parallel to the columns 32 are designated with reference numerals 39.
- the cut lines 38 will divide each of the plated through holes 37 into two substantially equal parts, each part forming a plated through groove similar to the plated through grooves 23 and 25 shown in FIG. 1.
- the cut lines 39 will divide each of the plated through holes 33 into two substantially equal parts, each part providing a plated through groove similar to the plated through grooves 23 and 25 shown in FIG. 1.
- FIG. 7 is a partial plan view on a planar substrate 12 having a plurality of light emitting diodes 40 arranged on its upper side 11 to form a plurality of multiple segment joints or single character displays.
- Each segment of the multiple segment joint corresponds to a light emitting diode 40 which is mounted on a corresponding land area.
- Each terminal on the upper side of a light emitting diode 40 is connected to a separate connection pad 41 by a bonding wire 42.
- Each connection pad 41 is perforated by a plated through hole 43 so as to provide electrical connection to corresponding terminal pads on the under side of the substrate 12.
- the planar substrate 12 is divided into individual modular components. Each individual modular component functions as a single character display.
- the horizontal cut lines are designated with reference numerals 44 while the vertical cut lines are designated with reference numerals 45. It can be seen that the cut lines 44 and 45 will divide each of the plated through holes 43 into two substantially equal parts, each part forming a plated through groove like the plated through grooves 23 and 25 shown in FIG. 1.
- the present invention provides an inexpensive technique for making surface mounted semiconductor packages. Diodes, photo sensitive devices, resistors or integrated circuits could be manufactured in panel form casing with a protective coating which maybe opaque. The panel can be tested prior to coating and after coating and sawed apart using the method described above.
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/120,591 USRE36614E (en) | 1988-01-15 | 1998-07-17 | Modular surface mount component for an electrical device or LED's |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/144,370 US4843280A (en) | 1988-01-15 | 1988-01-15 | A modular surface mount component for an electrical device or led's |
US09/120,591 USRE36614E (en) | 1988-01-15 | 1998-07-17 | Modular surface mount component for an electrical device or LED's |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/144,370 Reissue US4843280A (en) | 1988-01-15 | 1988-01-15 | A modular surface mount component for an electrical device or led's |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE36614E true USRE36614E (en) | 2000-03-14 |
Family
ID=22508289
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/144,370 Ceased US4843280A (en) | 1988-01-15 | 1988-01-15 | A modular surface mount component for an electrical device or led's |
US09/120,591 Expired - Lifetime USRE36614E (en) | 1988-01-15 | 1998-07-17 | Modular surface mount component for an electrical device or LED's |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/144,370 Ceased US4843280A (en) | 1988-01-15 | 1988-01-15 | A modular surface mount component for an electrical device or led's |
Country Status (1)
Country | Link |
---|---|
US (2) | US4843280A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281435B1 (en) * | 1999-03-03 | 2001-08-28 | Rohm Co., Ltd. | Chip-type electronic devices |
US20020163302A1 (en) * | 2001-04-09 | 2002-11-07 | Koichi Nitta | Light emitting device |
US6534799B1 (en) * | 2000-10-03 | 2003-03-18 | Harvatek Corp. | Surface mount light emitting diode package |
US6576995B2 (en) * | 2000-04-10 | 2003-06-10 | Infineon Technologies Ag | Housing for semiconductor chips |
US6649834B1 (en) * | 2002-12-16 | 2003-11-18 | Kingpak Technology Inc. | Injection molded image sensor and a method for manufacturing the same |
US20030218417A1 (en) * | 2002-05-22 | 2003-11-27 | Unity Opto Technology Co., Ltd. | Light emitting diode lamp with light emitting diode module having improved heat dissipation |
US6747293B2 (en) | 2001-04-09 | 2004-06-08 | Kabushiki Kaisha Toshiba | Light emitting device |
US6777719B1 (en) * | 1999-03-19 | 2004-08-17 | Rohm Co., Ltd. | Chip light-emitting device |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
US20050274957A1 (en) * | 2004-05-28 | 2005-12-15 | Harvatek Corporation | LED packaging structure |
US7242032B2 (en) | 2001-04-09 | 2007-07-10 | Kabushiki Kaisha Toshiba | Light emitting device |
US20090251873A1 (en) * | 2008-04-02 | 2009-10-08 | Sun-Wen Cyrus Cheng | Surface Mount Power Module Dual Footprint |
US20110175135A1 (en) * | 2008-11-17 | 2011-07-21 | Everlight Electronics Co., Ltd | Circuit Board For LED |
USD735400S1 (en) * | 2013-02-09 | 2015-07-28 | SVV Technology Innovations, Inc | Optical lens array lightguide plate |
USD758977S1 (en) * | 2015-06-05 | 2016-06-14 | Kingbright Electronics Co. Ltd. | LED component |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935856A (en) * | 1989-10-05 | 1990-06-19 | Dialight Corporation | Surface mounted LED package |
US4959761A (en) * | 1989-12-21 | 1990-09-25 | Dialight Corporation | Surface mounted led package |
US5167556A (en) * | 1990-07-03 | 1992-12-01 | Siemens Aktiengesellschaft | Method for manufacturing a light emitting diode display means |
DE59402033D1 (en) * | 1993-09-30 | 1997-04-17 | Siemens Ag | Miniature two-pole SMT package for semiconductor components and method for its production |
JP3127195B2 (en) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | Light emitting device and method of manufacturing the same |
DE19549726B4 (en) * | 1994-12-06 | 2010-04-22 | Sharp K.K. | Light emitting diode module for e.g. display panel, LCD back light - has LED chip enclosed in transparent resin package with electrodes being connected to respective P=type and N=type PN junction sides while passing through sealed respective insulating substrate hole |
US5644327A (en) * | 1995-06-07 | 1997-07-01 | David Sarnoff Research Center, Inc. | Tessellated electroluminescent display having a multilayer ceramic substrate |
US5782552A (en) * | 1995-07-26 | 1998-07-21 | Green; David R. | Light assembly |
IT1281360B1 (en) * | 1995-09-26 | 1998-02-18 | Fiat Ricerche | MICROTELESCOPE LIGHTING SYSTEM INTEGRATED IN A TRANSPARENT SHEET |
JP2909023B2 (en) * | 1996-05-01 | 1999-06-23 | 日吉電子株式会社 | Long light emitting device |
JP3009626B2 (en) * | 1996-05-20 | 2000-02-14 | 日吉電子株式会社 | LED luminous bulb |
EP1439586B1 (en) * | 1996-06-26 | 2014-03-12 | OSRAM Opto Semiconductors GmbH | Light-emitting semiconductor component with luminescence conversion element |
DE19638667C2 (en) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
JPH10211732A (en) * | 1997-01-30 | 1998-08-11 | Canon Inc | Head and method for mounting the same |
JP2001518692A (en) * | 1997-07-29 | 2001-10-16 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト | Photoelectric element |
DE19755734A1 (en) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Method for producing a surface-mountable optoelectronic component |
US6897855B1 (en) | 1998-02-17 | 2005-05-24 | Sarnoff Corporation | Tiled electronic display structure |
US6476783B2 (en) | 1998-02-17 | 2002-11-05 | Sarnoff Corporation | Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display |
US5960024A (en) | 1998-03-30 | 1999-09-28 | Bandwidth Unlimited, Inc. | Vertical optical cavities produced with selective area epitaxy |
US6493372B1 (en) | 1998-04-14 | 2002-12-10 | Bandwidth 9, Inc. | Vertical cavity apparatus with tunnel junction |
US5991326A (en) | 1998-04-14 | 1999-11-23 | Bandwidth9, Inc. | Lattice-relaxed verticle optical cavities |
US6493371B1 (en) | 1998-04-14 | 2002-12-10 | Bandwidth9, Inc. | Vertical cavity apparatus with tunnel junction |
US6535541B1 (en) | 1998-04-14 | 2003-03-18 | Bandwidth 9, Inc | Vertical cavity apparatus with tunnel junction |
US6487230B1 (en) | 1998-04-14 | 2002-11-26 | Bandwidth 9, Inc | Vertical cavity apparatus with tunnel junction |
US6493373B1 (en) | 1998-04-14 | 2002-12-10 | Bandwidth 9, Inc. | Vertical cavity apparatus with tunnel junction |
US6760357B1 (en) | 1998-04-14 | 2004-07-06 | Bandwidth9 | Vertical cavity apparatus with tunnel junction |
US6487231B1 (en) | 1998-04-14 | 2002-11-26 | Bandwidth 9, Inc. | Vertical cavity apparatus with tunnel junction |
US7066628B2 (en) | 2001-03-29 | 2006-06-27 | Fiber Optic Designs, Inc. | Jacketed LED assemblies and light strings containing same |
US6488619B1 (en) * | 1998-09-08 | 2002-12-03 | Olympus Optical Co., Ltd. | Distal endoscope part having light emitting source such as light emitting diodes as illuminating means |
US7931390B2 (en) * | 1999-02-12 | 2011-04-26 | Fiber Optic Designs, Inc. | Jacketed LED assemblies and light strings containing same |
US6498592B1 (en) | 1999-02-16 | 2002-12-24 | Sarnoff Corp. | Display tile structure using organic light emitting materials |
US6226425B1 (en) | 1999-02-24 | 2001-05-01 | Bandwidth9 | Flexible optical multiplexer |
US6275513B1 (en) | 1999-06-04 | 2001-08-14 | Bandwidth 9 | Hermetically sealed semiconductor laser device |
US6233263B1 (en) | 1999-06-04 | 2001-05-15 | Bandwidth9 | Monitoring and control assembly for wavelength stabilized optical system |
DE10012734C1 (en) * | 2000-03-16 | 2001-09-27 | Bjb Gmbh & Co Kg | Illumination kit for illumination, display or notice purposes has plug connector with contacts in row along edge of each light emitting module to mechanically/electrically connect modules |
JP2001326390A (en) * | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | Rear-surface light-emitting chip type light-emitting element and insulating board used therefor |
JP2002050797A (en) * | 2000-07-31 | 2002-02-15 | Toshiba Corp | Semiconductor excitation phosphor light-emitting device and manufacturing method therefor |
EP1187226B1 (en) * | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US6683665B1 (en) | 2000-11-20 | 2004-01-27 | Sarnoff Corporation | Tiled electronic display structure and method for modular repair thereof |
US6980272B1 (en) | 2000-11-21 | 2005-12-27 | Sarnoff Corporation | Electrode structure which supports self alignment of liquid deposition of materials |
DE10129785B4 (en) * | 2001-06-20 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for its production |
JP4009817B2 (en) * | 2001-10-24 | 2007-11-21 | セイコーエプソン株式会社 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
JP2003234509A (en) * | 2002-02-08 | 2003-08-22 | Citizen Electronics Co Ltd | Light emitting diode |
JP2003309292A (en) * | 2002-04-15 | 2003-10-31 | Citizen Electronics Co Ltd | Metal core substrate of surface mounting light emitting diode and its manufacturing method |
DE10234978A1 (en) * | 2002-07-31 | 2004-02-12 | Osram Opto Semiconductors Gmbh | Surface-mounted semiconductor component used in the production of luminescent diodes in mobile telephone keypads comprises a semiconductor chip, external electrical connections, and a chip casing |
EP1525619A1 (en) * | 2002-07-31 | 2005-04-27 | Osram Opto Semiconductors GmbH | Surface-mounted semiconductor component and method for the production thereof |
DE10237084A1 (en) * | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Electrically conductive frame with a semiconductor light diode, to illuminate a mobile telephone keypad, has a layered structure with the electrical connections and an encapsulated diode chip in very small dimensions |
DE10250911B4 (en) * | 2002-10-31 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Method for producing an envelope and / or at least part of a housing of an optoelectronic component |
EP1420462A1 (en) * | 2002-11-13 | 2004-05-19 | Heptagon Oy | Light emitting device |
US7919787B2 (en) * | 2003-06-27 | 2011-04-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor device with a light emitting semiconductor die |
WO2005091389A1 (en) * | 2004-03-19 | 2005-09-29 | Showa Denko K.K. | Compound semiconductor light-emitting device and production method thereof |
CN1725521B (en) * | 2004-07-16 | 2010-10-27 | 国际商业机器公司 | Optoelectronic device and manufacturing method |
JP4676735B2 (en) * | 2004-09-22 | 2011-04-27 | 東レ・ダウコーニング株式会社 | Optical semiconductor device manufacturing method and optical semiconductor device |
US7850362B2 (en) * | 2004-11-10 | 2010-12-14 | 1 Energy Solutions, Inc. | Removable LED lamp holder with socket |
US7850361B2 (en) * | 2004-11-10 | 2010-12-14 | 1 Energy Solutions, Inc. | Removable LED lamp holder |
US8016440B2 (en) * | 2005-02-14 | 2011-09-13 | 1 Energy Solutions, Inc. | Interchangeable LED bulbs |
US20070025109A1 (en) | 2005-07-26 | 2007-02-01 | Yu Jing J | C7, C9 LED bulb and embedded PCB circuit board |
DE102005041064B4 (en) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Surface-mountable optoelectronic component and method for its production |
US7265496B2 (en) * | 2005-09-23 | 2007-09-04 | Fiber Optic Designs, Inc. | Junction circuit for LED lighting chain |
US7276858B2 (en) | 2005-10-28 | 2007-10-02 | Fiber Optic Designs, Inc. | Decorative lighting string with stacked rectification |
US7250730B1 (en) * | 2006-01-17 | 2007-07-31 | Fiber Optic Designs, Inc. | Unique lighting string rectification |
US8083393B2 (en) | 2006-02-09 | 2011-12-27 | 1 Energy Solutions, Inc. | Substantially inseparable LED lamp assembly |
US8044585B2 (en) * | 2006-05-02 | 2011-10-25 | Chain Technology Consultant Inc. | Light emitting diode with bumps |
EP2027602A4 (en) * | 2006-05-23 | 2012-11-28 | Cree Inc | Lighting device and method of making |
US7963670B2 (en) * | 2006-07-31 | 2011-06-21 | 1 Energy Solutions, Inc. | Bypass components in series wired LED light strings |
US20080025024A1 (en) * | 2006-07-31 | 2008-01-31 | Jingjing Yu | Parallel-series led light string |
TWI317562B (en) * | 2006-08-16 | 2009-11-21 | Ind Tech Res Inst | Light-emitting device |
DE102007015468A1 (en) * | 2007-03-30 | 2008-10-02 | Osram Opto Semiconductors Gmbh | Organic radiation-emitting device, its use, and a method of manufacturing the device |
US7964888B2 (en) * | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
US7784993B2 (en) | 2007-07-13 | 2010-08-31 | 1 Energy Solutions, Inc. | Watertight LED lamp |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
US7732829B2 (en) * | 2008-02-05 | 2010-06-08 | Hymite A/S | Optoelectronic device submount |
US7883261B2 (en) * | 2008-04-08 | 2011-02-08 | 1 Energy Solutions, Inc. | Water-resistant and replaceable LED lamps |
US8376606B2 (en) * | 2008-04-08 | 2013-02-19 | 1 Energy Solutions, Inc. | Water resistant and replaceable LED lamps for light strings |
US8314564B2 (en) | 2008-11-04 | 2012-11-20 | 1 Energy Solutions, Inc. | Capacitive full-wave circuit for LED light strings |
US8136960B2 (en) * | 2008-11-12 | 2012-03-20 | American Opto Plus Led Corporation | Light emitting diode display |
TW201114003A (en) * | 2008-12-11 | 2011-04-16 | Xintec Inc | Chip package structure and method for fabricating the same |
CN201391793Y (en) * | 2009-04-20 | 2010-01-27 | 喻北京 | Novel heat dissipation structure of LED bulb |
US8836224B2 (en) * | 2009-08-26 | 2014-09-16 | 1 Energy Solutions, Inc. | Compact converter plug for LED light strings |
JP2012080085A (en) | 2010-09-10 | 2012-04-19 | Nichia Chem Ind Ltd | Support medium and light emitting device using the same |
CN104241262B (en) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | Light emitting device and display device |
JP6487626B2 (en) * | 2014-03-24 | 2019-03-20 | スタンレー電気株式会社 | Semiconductor device |
USD778846S1 (en) * | 2014-12-15 | 2017-02-14 | Kingbright Electronics Co. Ltd. | LED component |
USD778847S1 (en) * | 2014-12-15 | 2017-02-14 | Kingbright Electronics Co. Ltd. | LED component |
JP6736256B2 (en) * | 2015-03-23 | 2020-08-05 | ローム株式会社 | LED package |
DE102015111492B4 (en) * | 2015-07-15 | 2023-02-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Components and methods for manufacturing components |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3189978A (en) * | 1962-04-27 | 1965-06-22 | Rca Corp | Method of making multilayer circuits |
US3908184A (en) * | 1973-01-30 | 1975-09-23 | Nippon Electric Co | Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents |
US4000437A (en) * | 1975-12-17 | 1976-12-28 | Integrated Display Systems Incorporated | Electric display device |
JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS56137466A (en) * | 1980-03-28 | 1981-10-27 | Sharp Corp | Electronic cash register |
US4305204A (en) * | 1980-01-16 | 1981-12-15 | Litronix, Inc. | Method for making display device |
US4445132A (en) * | 1980-06-13 | 1984-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | LED Module for a flat panel display unit |
US4508758A (en) * | 1982-12-27 | 1985-04-02 | At&T Technologies, Inc. | Encapsulated electronic circuit |
US4525597A (en) * | 1982-10-30 | 1985-06-25 | Ngk Insulators, Ltd. | Ceramic leadless packages and a process for manufacturing the same |
JPS61134040A (en) * | 1984-12-04 | 1986-06-21 | Fuji Dengiyou Kk | Manufacture of semiconductor element |
US4603496A (en) * | 1985-02-04 | 1986-08-05 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
US4713579A (en) * | 1984-11-12 | 1987-12-15 | Takiron Co., Ltd. | Dot matrix luminous display |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3919041B2 (en) * | 1997-02-06 | 2007-05-23 | 富士通株式会社 | Payment system |
-
1988
- 1988-01-15 US US07/144,370 patent/US4843280A/en not_active Ceased
-
1998
- 1998-07-17 US US09/120,591 patent/USRE36614E/en not_active Expired - Lifetime
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3189978A (en) * | 1962-04-27 | 1965-06-22 | Rca Corp | Method of making multilayer circuits |
US3908184A (en) * | 1973-01-30 | 1975-09-23 | Nippon Electric Co | Ceramic substrate assembly for electronic circuits having ceramic films thereon for intercepting the flow of brazing agents |
US4000437A (en) * | 1975-12-17 | 1976-12-28 | Integrated Display Systems Incorporated | Electric display device |
JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
US4305204A (en) * | 1980-01-16 | 1981-12-15 | Litronix, Inc. | Method for making display device |
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS56137466A (en) * | 1980-03-28 | 1981-10-27 | Sharp Corp | Electronic cash register |
US4445132A (en) * | 1980-06-13 | 1984-04-24 | Tokyo Shibaura Denki Kabushiki Kaisha | LED Module for a flat panel display unit |
US4525597A (en) * | 1982-10-30 | 1985-06-25 | Ngk Insulators, Ltd. | Ceramic leadless packages and a process for manufacturing the same |
US4508758A (en) * | 1982-12-27 | 1985-04-02 | At&T Technologies, Inc. | Encapsulated electronic circuit |
US4713579A (en) * | 1984-11-12 | 1987-12-15 | Takiron Co., Ltd. | Dot matrix luminous display |
JPS61134040A (en) * | 1984-12-04 | 1986-06-21 | Fuji Dengiyou Kk | Manufacture of semiconductor element |
US4603496A (en) * | 1985-02-04 | 1986-08-05 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281435B1 (en) * | 1999-03-03 | 2001-08-28 | Rohm Co., Ltd. | Chip-type electronic devices |
US6777719B1 (en) * | 1999-03-19 | 2004-08-17 | Rohm Co., Ltd. | Chip light-emitting device |
US6576995B2 (en) * | 2000-04-10 | 2003-06-10 | Infineon Technologies Ag | Housing for semiconductor chips |
US6534799B1 (en) * | 2000-10-03 | 2003-03-18 | Harvatek Corp. | Surface mount light emitting diode package |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
US6747293B2 (en) | 2001-04-09 | 2004-06-08 | Kabushiki Kaisha Toshiba | Light emitting device |
US20040217369A1 (en) * | 2001-04-09 | 2004-11-04 | Kabushiki Kaisha Toshiba | Light emitting device |
US7569989B2 (en) | 2001-04-09 | 2009-08-04 | Kabushiki Kaisha Toshiba | Light emitting device |
US20020163302A1 (en) * | 2001-04-09 | 2002-11-07 | Koichi Nitta | Light emitting device |
US7176623B2 (en) | 2001-04-09 | 2007-02-13 | Kabushiki Kaisha Toshiba | Light emitting device |
US20070085107A1 (en) * | 2001-04-09 | 2007-04-19 | Kabushiki Kaisha Toshiba | Light Emitting Device |
US7242032B2 (en) | 2001-04-09 | 2007-07-10 | Kabushiki Kaisha Toshiba | Light emitting device |
US20030218417A1 (en) * | 2002-05-22 | 2003-11-27 | Unity Opto Technology Co., Ltd. | Light emitting diode lamp with light emitting diode module having improved heat dissipation |
US6649834B1 (en) * | 2002-12-16 | 2003-11-18 | Kingpak Technology Inc. | Injection molded image sensor and a method for manufacturing the same |
US20050274957A1 (en) * | 2004-05-28 | 2005-12-15 | Harvatek Corporation | LED packaging structure |
US20090251873A1 (en) * | 2008-04-02 | 2009-10-08 | Sun-Wen Cyrus Cheng | Surface Mount Power Module Dual Footprint |
US8319114B2 (en) * | 2008-04-02 | 2012-11-27 | Densel Lambda K.K. | Surface mount power module dual footprint |
US20110175135A1 (en) * | 2008-11-17 | 2011-07-21 | Everlight Electronics Co., Ltd | Circuit Board For LED |
USD735400S1 (en) * | 2013-02-09 | 2015-07-28 | SVV Technology Innovations, Inc | Optical lens array lightguide plate |
USD758977S1 (en) * | 2015-06-05 | 2016-06-14 | Kingbright Electronics Co. Ltd. | LED component |
Also Published As
Publication number | Publication date |
---|---|
US4843280A (en) | 1989-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE36614E (en) | Modular surface mount component for an electrical device or LED's | |
USRE36446E (en) | Method for producing displays and modular components | |
US6143588A (en) | Method of making an integrated circuit package employing a transparent encapsulant | |
US5298768A (en) | Leadless chip-type light emitting element | |
US6383835B1 (en) | IC package having a conductive material at least partially filling a recess | |
US5177593A (en) | Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components | |
US6964886B2 (en) | Methods of fabrication for flip-chip image sensor packages | |
US3938177A (en) | Narrow lead contact for automatic face down bonding of electronic chips | |
US5633533A (en) | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | |
US4867371A (en) | Fabrication of optical devices | |
US6403881B1 (en) | Electronic component package assembly and method of manufacturing the same | |
US4448306A (en) | Integrated circuit chip carrier | |
US4567545A (en) | Integrated circuit module and method of making same | |
KR20050002220A (en) | Stack type Ball grid array package and method for manufacturing the same | |
US20020053742A1 (en) | IC package and its assembly method | |
KR890005830A (en) | Semiconductor device and manufacturing method thereof | |
JP2914097B2 (en) | Injection molded printed circuit board | |
US3999280A (en) | Narrow lead contact for automatic face down bonding of electronic chips | |
US6023414A (en) | Display device mounting arrangement and method | |
JP3900613B2 (en) | Surface mount type chip component and manufacturing method thereof | |
US4538143A (en) | Light-emitting diode displayer | |
US4126882A (en) | Package for multielement electro-optical devices | |
US5406119A (en) | Lead frame | |
EP3680211B1 (en) | Sensor unit and method of interconnecting a substrate and a carrier | |
JP2000196153A (en) | Chip electronic component and manufacture thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INFINEON TECHNOLOGIES CORPORATION, CALIFORNIA Free format text: SECRETARY'S CERTIFICATE;ASSIGNOR:SIEMENS MICROELECTRONICS, INC.;REEL/FRAME:009933/0013 Effective date: 19990408 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
SULP | Surcharge for late payment |
Year of fee payment: 11 |
|
AS | Assignment |
Owner name: OSRAM OPTO SEMICONDUCTORS GMBH & CO. OGH., GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INFINEON TECHNOLOGIES NORTH AMERICA CORP.;REEL/FRAME:012785/0048 Effective date: 20011116 Owner name: INFINEON TECHNOLOGIES NORTH AMERICA CORP., CALIFOR Free format text: CERTIFICATE OF AMENDMENT;ASSIGNOR:INFINEON TECHNOLOGIES CORPORATION;REEL/FRAME:012785/0470 Effective date: 19990930 |