JPS61134040A - Manufacture of semiconductor element - Google Patents

Abstract

PURPOSE:To obtain the manufacture of the titled element with no leads like legs which can be automatically produced simply and efficiently with high yield by a method wherein a plurality of plane rectangular small plate groups which can be separated from one another by bending are sectioned in a thin plate of ceramic, and small holes are formed along separation lines. CONSTITUTION:Small holes D, E, D, E... are opened over the whole separation lines of the plate, in such a manner that small holes D and E are formed at the centers of one separation line and the other opposed to each other of each small plate, e.g. one separation line B1 and the other one B2 in a small plate 1a. Next, a melting conductive metal M is printed on the front F side of the plate A. At this time, each of small plates 1a, 1b... is coated with a conductive metal M by printing only in the surface part H continuous to the edge G of one small hole D, i.e. surface part H surrounding the edge G and the surface part K continuous to the edge J of the other hole E, i.e. surface part K surrounding the edge J, resulting in the formation of one polarity D and the other polarity electrically insulated from each other in the front F side. Likewise, the melting conductive metal M is printed on the front side of the plate A, and one polarity S and the other polarity T are formed in each small plate.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a semiconductor device, and more specifically, it is possible to produce a semiconductor device without lead wires such as legs with high efficiency using an automatic machine, and This invention relates to a manufacturing method that can produce semiconductor devices with excellent reliability.

(Prior Art) As is well known, disaster semiconductor chips such as optical-electrical conversion elements, magnetic field-electrical conversion elements, piezoelectric resistance conversion elements, etc.
Voltage-electrical conversion elements, temperature/thermal-electrical resistance conversion elements, diodes, thyristors.

Semiconductor devices such as transistors generally have leg-shaped lead wires.

In the case of a shape with lead wires, if the lead wires themselves are made smaller in response to the demand for miniaturization of semiconductor devices, they will have to be made excessively thin, making them easy to bend, which puts a certain limit on miniaturization. There is. Furthermore, if the semiconductor element is made too small, handling becomes troublesome, and the production of the semiconductor element itself by an automatic machine and the automatic assembly of equipment using this semiconductor element may become troublesome.

Therefore, some semiconductor devices without single lines like legs have been proposed, but the conventional ones have poor production efficiency.
Furthermore, the reliability of quality was also lacking. In other words, in manufacturing this type of semiconductor device, it is possible to automatically produce it with high efficiency and high yield, and it can be provided to the market at a low price, and it also has reliable electrical accuracy and quality reliability. It is also necessary that the manufactured semiconductor element be designed to be usable together with other electronic parts in automatic mounting machines, robots, etc., and that hybrid mounting with other electronic parts is possible and that labor-saving assembly can be achieved. However, conventional methods for manufacturing semiconductor devices without lead wires, such as legs, have not satisfactorily met these requirements. .

(Problems to be Solved by the Invention) The present invention has been made in view of the above points, and its purpose is to enable automatic production that is simple, highly efficient, and has a high yield, and to be commercially available. The purpose is to provide a method for manufacturing semiconductor devices without lead wires such as legs that can be provided at a relatively low cost, and another objective is to improve the quality of semiconductor devices without lead wires such as legs.
In particular, the purpose is to provide a method for manufacturing semiconductor devices with good electrical connection accuracy, and another purpose is to provide a design that can be used together with other electronic components in automatic mounting machines, robots, etc. It is an object of the present invention to provide a method for manufacturing a semiconductor device that allows hybrid lift mounting together with electronic components and saves labor in assembly.

(Children's role and action for solving problems) That is, the present invention:
A plurality of plate-like bodies each having a rectangular plane and which can be separated from each other by bending is defined in a thin ceramic plate-like body.

At the same time or before and after this section, a plurality of holes are formed at the +Ara line of each plate-like body so that a small hole is formed in the center of the cutting line on one side and the other side of each plate-like body facing each other. Open a small hole.

Next, each plate is printed on both sides so that conductive metal is applied to the front and back sides of each plate-shaped body at positions that connect to each small hole and surround each small hole. One pole and the other pole are formed on the front and back of the body. During this printing, the molten metal applied to the front and back sides adheres to the front and back sides, and a portion of it flows into the small holes.

It flows down the wall of the small hole to the other side. When the front side is printed, it flows down to the back side through the small holes, and when the back side is printed, it flows down through the small holes to the front side. This flow of molten metal into the small holes is the reason why the molten metal adheres to the intended printing area on the front and back in just the right amount, and this phenomenon of flowing into the small holes creates a film of conductive metal on the wall of each small hole. 1, and electrically connect one and the other pole of the front and back sides.

Next, each of these plate-shaped bodies is separated along the separation line to form an element substrate in which a recessed part with a film of conductive metal is formed on one side and the other side to connect the front and back electrodes. made,
This is a method of manufacturing a semiconductor device, which comprises arranging a semiconductor chip between poles on the surface of the device substrate.

(Embodiment) A preferred embodiment of the present invention will be described below based on the drawings.

First, as shown in FIG. 1, a thin plate-like body, for example, a ceramic plate-like body A with a thickness of O0B, can be cut by bending it at a cutting line Bl, 82.83, Be.
A plurality of planar rectangular plate-like bodies 1a, lb, lc, ld, which can be separated from each other by putting..., CI, C2, 03, 04... into a substantially lattice shape.
Divide the group of... Each of these plate-like bodies has a length (L) of approximately 3.2 ms and a width (W)! ,
It is divided into about 27mm. At this time, if we pay attention to the cutting lines on one side and the other facing each other of each plate-like body, for example, one plate-like body 1a, a small hole is formed in the center of each of the cutting line @BL on one side and the cutting line B2 on the other side. so that E is formed.
Small holes 〇, E, D, E are made throughout the incision line of the plate.

Open D, E-... Of course, each cutting line may be divided after making the small hole E. The size of the small hole E is, for example, about 0.4 cm in diameter.

Next, as shown in FIG. 2, molten conductive metal is printed on the surface F side of this plate-like body A by screen printing or the like. During this printing, each plate-like small body 1a.

To explain by focusing on each of ib@-., in other words, the surface portion H that is connected to the edge G of one small hole, the surface portion H that surrounds the edge G, and the surface portion H that is continuous to the edge J of the other small hole E. In other words, the conductive metal M is applied only to the surface area surrounding the edge J.
is printed with appropriate masking so as to be applied by printing, thereby forming one pole and the other pole P which are electrically insulated from each other on the surface F side as shown in FIG. Similarly, as shown in Figure 3, a molten conductive metal M is printed on the back R side of the plate-like body A, and one pole S and the other pole T are printed on each plate-like body as shown in Figure w44. form.

What is important here is that when the conductive metal is printed and coated on the surface parts H and K on the surface F side, the molten conductive metal forms small holes and E.
A part of the molten metal flows from the edges G and J of the small hole along the wall surface Z of the small hole as shown by the arrow X in FIG. 6, and flows down the upper half of the wall surface Z. That is, the conductive metal M to be printed escapes through the small hole, and due to this escape, the conductive metal is evenly coated to the desired thickness on the surface portions H and K, and also on the upper half of the wall surface Z of the small hole. A conductive metal M is coated. Similarly, when a conductive metal is printed and coated on the back surface R side, the lower half of the wall surface Z flows down the wall surface Z of the small hole as shown by the arrow Y in FIG. The conductive metal M is also coated on the other half. That is, as shown in FIG.
One pole 0 on the front side and one pole S on the back side are electrically connected by a conductive metal coated on the wall Z of the small hole, thereby forming a cathode 2. Further, the other pole P on the front side and the other pole T on the back side are electrically connected by a conductive metal coated on the wall Z of the small hole, thereby forming an anode 3. This is formed on a plurality of plate-like small bodies at once when conductive metal is printed on the front and back sides of the plate-like body A.

After doing this, a semiconductor element chip is electrically connected between the cathode 2 and the seven nodes 3 on the surface of each plate-shaped body in accordance with the processing requirements, thereby producing a semiconductor element.

Then, if these plate-like bodies 1a, lb, and lce age are bent at the cutting lines Bl, B2, 9, C1, C2, -@fist and made into individual pieces, the plate-like bodies corpuscles 1a, l
b...Small hole on side edge 4.

It has a concave portion 5 at the half of the side, and a concave portion 7 at the other end 6, and has cathodes 2, 7 nodes 3 on the front and back sides with the concave portions as electrical connection points.

A single semiconductor element in which a semiconductor chip is connected between the cathode 2 and the anode 13 is obtained.

Alternatively, if a desired plurality of elements are separated as one unit along a cutting line without being separated into individual elements, a semiconductor element group including the plurality of elements as a part can be obtained.

Furthermore, following the printing of the conductive metal as described in (h), mark lines for identifying the positions of the cathode and anode may be printed on either the front or back side of each plate-like object by optical means. If set to , during this automatic processing.

During automatic taping, the positions of the cathode and 7 nodes are automatically read and automatic alignment is possible.

The method for manufacturing a semiconductor device of the present invention is not particularly limited to any semiconductor device, but can be applied to a photo-electrical conversion device, a magnetic field-electrical conversion device, a pressure-electrical resistance conversion device, etc. One specific example is shown in FIGS.

FIG. 7 is a cross-sectional view taken along line II-II in FIG. 8, showing a light emitting diode, in which a recess 5, which is half of a small hole, is formed in one end 4 of a small plate-shaped body 1a. A recess 7, which is a half of the small hole, is formed at the other end 6, and a cathode 2 made of a coated conductive metal is formed on one front and back of the plate-like body la, with the recess 5 inside. , 7 made of a conductive metal coated on the other front and back of the plate-like small body 1a with the recess 7 inside.
Node 3 is formed. A light emitting diode chip 8 is connected on the cathode 2 , and a gold wire 9 is connected between the light emitting diode chip 8 and the anode 3 . Further, their surfaces are coated with a protective layer 10 made of, for example, epoxy resin. In addition, on either the front or back side of the plate-shaped small body, in the example shown in the figure, there is a mark on the surface to identify the positions of the cathode and anode and enable automatic alignment when reading with an optical reading means during automatic processing or automatic taping. The mark line 14 is added.

One example of using this is to use a dispenser or the like to place conductive adhesive or solder 13 on the patterned negative electrode 11 and positive electrode 12 of the PC board, as shown in FIG. .

Next, a light emitting diode as shown below is placed on top of this. This set is set so that the cathode 2 on the back surface of the plate-shaped small body 1a is placed on the negative electrode 11, and the 7 nodes 3 are placed on the positive electrode 12.

After this, if it is dried, the arrangement on the PC board is completed.

In the embodiment described above, the small hole is shown as circular, but other shapes such as angular, rhombic, etc. may be used, and the shape of the recess formed in the plate-shaped body from a plan view may be angular, triangular, etc. It's okay.

(Effects of the Invention) As is clear from the above explanation, according to the present invention, semiconductor devices without lead wires such as legs can be easily and highly efficiently automatically produced with high yield, and can be provided to the market at the lowest possible cost. . Furthermore, it is possible to provide a method for manufacturing a semiconductor element with good accuracy of electrical connection between the front and back cathodes and anodes instead of lead wires such as legs, and whose quality is highly reliable. Furthermore, it is designed to be used with other electronic components in automatic mounting machines, robots, etc.
The present invention exhibits moderate practical effects, such as being able to provide a manufacturing method for semiconductor devices that can be hybrid mounted together with other electronic components and greatly reduces assembly labor.

[Brief explanation of the drawing]

The accompanying drawings FIGS. 1 to 6 show embodiments of the present invention.
The figure is a diagram explaining the process of forming parting lines on the plate-like body to divide it into individual plate-like bodies and forming small holes, and Figure 2 is a diagram explaining the process of printing conductive metal on the surface of the plate-like body. figure, 3rd
The figure is a diagram explaining the process of printing conductive metal on the back side of a plate-shaped body, Figure 4 is a cross-sectional view along the I-I line of No. zrg, and No. 5
The figure shows only one plate-shaped small body with conductive metal printed on the front and back sides. Figure 6 shows a mode in which the conductive metal flows down into the small hole and the conductive metals on the front and back are electrically connected. Figures 7 to 9 show a light emitting diode as an example of a semiconductor element manufactured using the manufacturing method of the present invention, and Figure 7 is a diagram for explaining '@8 in Figure II--. 8 is a plan view, and FIG. 9 is a diagram showing an example of connection to P and C boards. In the figure, A is a plate-like body, Bl, B2. B3.・Fist/separation line,
CL, C2, C3, . . . are separation lines, D. E is the small hole, F is the surface G of the plate-shaped body, J is the edge of the small hole, H is the surface portion where conductive metal is to be printed, M is the conductive metal,
O is one pole of the surface part, P is the other pole of the surface part, R
is the back side of the plate, S is one pole of the back part, T is the other pole of the back part, Z is the wall of the small hole, 1a, 1b, lc
is a plate-like body, 2 is one pole 0 on the front surface and one pole S on the back surface
and a cathode made of a conductive metal that flows down and coats the wall of the small hole, and 3 is the other pole P on the front surface, the other pole T on the back surface, and an anode made of a conductive metal that flows down and coats the wall of the small hole. , 4.7 on one side, 5 on the other side
．． Reference numeral 7 designates a concave portion as a half of the small hole when the plate-like small body is separated from the plate-like body, 8 a semiconductor chip, 9 a gold wire, and 10 a resin layer. Dormitory 3 Diagram A

Claims (1)

[Claims] A plurality of planar rectangular plate-shaped bodies that can be separated from each other by bending are divided into a thin plate-shaped body made of ceramic, and the cutting lines of one and the other of the plate-shaped bodies facing each other are divided. A plurality of small holes are formed throughout the plate-like body so that small holes are formed at certain places, and then a conductive metal is applied to the front and back sides of each plate-like body at positions connected to the small holes. One side and the other pole are formed on the front and back sides of each plate-like object by printing both sides of the entire plate-like object, and at the same time, during this printing, water flows down from the front side to the back side and from the back side to the front side to the wall of each small hole. Then, one side of the front and back sides are electrically connected to the other using a printed conductive metal that is applied in a film form, and then these plate-like bodies are cut into individual pieces, thereby connecting one side to the other side. A method for manufacturing a semiconductor device, which comprises manufacturing an element substrate having a recess formed with a film of conductive metal that connects the front and back electrodes, and arranging a semiconductor chip between the electrodes on the surface of the element substrate.